On the Multimodal Resolution of a Search Sequence in Virtual Reality
N. Klowait, Human Behavior and Emerging Technologies 2023 (2023) 1–15.

Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.

Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties
D. Voswinkel, Journal of Manufacturing Processes 94 (2023) 10–19.

Reactive Direct Bonding of Digital Light Process Components
E. Moritzer, C. Driediger, Macromolecular Symposia 404 (2022).

Co-Evolutionary Diversity Optimisation for the Traveling Thief Problem
A. Nikfarjam, A. Neumann, J. Bossek, F. Neumann, in: G. Rudolph, A.V. Kononova, H. Aguirre, P. Kerschke, G. Ochoa, T. Tu\'76 sar (Eds.), Parallel Problem Solving from Nature (PPSN XVII), Springer International Publishing, Cham, 2022, pp. 237–249.

Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design
M. Hesse, M. Hunstig, J. Timmermann, A. Trächtler, in: Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022, pp. 383–394.

Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.

Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen
H. Opdemom, Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen, Shaker Verlag, 2019.

Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.

Insights into the reaction mechanism and particle size effects of CO oxidation over supported Pt nanoparticle catalysts
S. Neumann, T. Gutmann, G. Buntkowsky, S. Paul, G. Thiele, H. Sievers, M. Bäumer, S. Kunz, Journal of Catalysis 377 (2019) 662–672.

Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.

Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.

Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.

Light-responsive nanoparticles based on new polycarbonate polymers as innovative drug delivery systems for photosensitizers in PDT
J. Anderski, L. Mahlert, J. Sun, W. Birnbaum, D. Mulac, S. Schreiber, F. Herrmann, D. Kuckling, K. Langer, International Journal of Pharmaceutics 557 (2018) 182–191.

MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall
R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.

Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition
A. Lücke, U. Gerstmann, T.D. Kühne, W.G. Schmidt, Journal of Computational Chemistry 38 (2017) 2276–2282.

Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.

Effect of different oxide layers on the ultrasonic copper wire bond process
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.

Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.

Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.