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Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &; Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical, 295, 653–662.https://doi.org/10.1016/j.sna.2019.04.025 
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Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).
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Eacock , F., Schaper, M., Althoff, S., Unger, A., Eichwald, P., Hengsbach, F.,https://doi.org/10.4071/isom-THP32__Guth, K. (2014). Microstructural investigations of aluminum and copper wire bonds. In Proceedings of the 47th International Symposium on Microelectronics.https://doi.org/10.4071/isom-THP32 
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