@bookAlthoff_2023, series=Schriften des Lehrstuhls für Dynamik und Mechatronik, title=Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach, volume=15, publisher=Shaker, author=Althoff, Simon, year=2023, collection=Schriften des Lehrstuhls für Dynamik und Mechatronik 

@articleVoswinkel_2023, title=Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties, volume=94, DOI=/10.1016/j.jmapro.2023.03.056, journal=Journal of Manufacturing Processes, publisher=Elsevier, author=Voswinkel, Dietrich, year=2023, pages=10–19 

@articleKlowait_2023, title=On the Multimodal Resolution of a Search Sequence in Virtual Reality, volume=2023, DOI=10.1155/2023/8417012, journal=Human Behavior and Emerging Technologies, publisher=Hindawi Limited, author=Klowait, Nils, year=2023, pages=1–15 

@articleMoritzer_Driediger_2022, title=Reactive Direct Bonding of Digital Light Process Components, volume=404, DOI=10.1002/masy.202100396, number=12100396, journal=Macromolecular Symposia, publisher=Wiley, author=Moritzer, Elmar and Driediger, Christine, year=2022 

@inproceedingsHesse_Hunstig_Timmermann_Trächtler_2022, title=Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design, booktitle=Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), author=Hesse, Michael and Hunstig, Matthias and Timmermann, Julia and Trächtler, Ansgar, year=2022, pages=383–394 

@inproceedingsNikfarjam_Neumann_Bossek_Neumann_2022, place=Cham, series=Lecture Notes in Computer Science, title=Co-Evolutionary Diversity Optimisation for the Traveling Thief Problem, DOI=10.1007/978-3-031-14714-2_17, booktitle=Parallel Problem Solving from Nature (PPSN XVII), publisher=Springer International Publishing, author=Nikfarjam, Adel and Neumann, Aneta and Bossek, Jakob and Neumann, Frank, editor=Rudolph, Günter and Kononova, Anna V. and Aguirre, Hernán and Kerschke, Pascal and Ochoa, Gabriela and Tu\'76 sar, Tea, year=2022, pages=237–249, collection=Lecture Notes in Computer Science 

@articleSchemmel_Krieger_Hemsel_Sextro_2021, title=Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization, volume=119, DOI=https://doi.org/10.1016/j.microrel.2021.114077, journal=Microelectronics Reliability, author=Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter, year=2021, pages=114077 

@bookOpdemom_2019, series=Schriftenreihe Institut für Leichtbau mit Hybridsystemen, title=Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen, volume=2019,35, publisher=Shaker Verlag, author=Opdemom, Hermann, year=2019, collection=Schriftenreihe Institut für Leichtbau mit Hybridsystemen 

@articleSchemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title=Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding, volume=295, DOI=10.1016/j.sna.2019.04.025, journal=Sensors and Actuators A: Physical, author=Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter, year=2019, pages=653–662 

@inproceedingsDymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title=Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process, booktitle=(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), author=Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter, year=2018, pages=1–6 

@inproceedingsDymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title=Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding, booktitle=(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), author=Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias, year=2018, pages=41–44 

@inproceedingsUnger_Hunstig_Meyer_Brökelmann_Sextro_2018, title=Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges, volume=Vol. 2018, No. 1, pp. 000572-000577., DOI=10.4071/2380-4505-2018.1.000572, booktitle=In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, author=Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter, year=2018 

@articleAnderski_Mahlert_Sun_Birnbaum_Mulac_Schreiber_Herrmann_Kuckling_Langer_2018, title=Light-responsive nanoparticles based on new polycarbonate polymers as innovative drug delivery systems for photosensitizers in PDT, volume=557, DOI=10.1016/j.ijpharm.2018.12.040, journal=International Journal of Pharmaceutics, publisher=Elsevier BV, author=Anderski, Juliane and Mahlert, Laura and Sun, Jingjiang and Birnbaum, Wolfgang and Mulac, Dennis and Schreiber, Sebastian and Herrmann, Fabian and Kuckling, Dirk and Langer, Klaus, year=2018, pages=182–191 

@inproceedingsSchemmel_Hemsel_Sextro_2017, place=Kiel 2017, title=MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall, booktitle=43. Deutsche Jahrestagung für Akustik, author=Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter, year=2017, pages=611–614 

@articleLücke_Gerstmann_Kühne_Schmidt_2017, title=Efficient PAW-based bond strength analysis for understanding the In/Si(111)(8 × 2) – (4 × 1) phase transition, volume=38, DOI=10.1002/jcc.24878, number=26, journal=Journal of Computational Chemistry, author=Lücke, Andreas and Gerstmann, Uwe and Kühne, Thomas D. and Schmidt, Wolf G., year=2017, pages=2276–2282 

@inproceedingsAlthoff_Meyer_Unger_Sextro_Eacock_2016, title=Shape-Dependent Transmittable Tangential Force of Wire Bond Tools, DOI=10.1109/ECTC.2016.234, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian, year=2016, pages=2103–2110 

@inproceedingsEacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title=Effect of different oxide layers on the ultrasonic copper wire bond process, DOI=10.1109/ECTC.2016.91, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten, year=2016, pages=2111–2118 

@inproceedingsUnger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place=IEEE CPMT Symposium Japan, title=Validated Simulation of the Ultrasonic Wire Bonding Process, booktitle=Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, author=Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten, year=2016, pages=251–254 

@inproceedingsAlthoff_Neuhaus_Hemsel_Sextro_2014, title=Improving the bond quality of copper wire bonds using a friction model approach, DOI=10.1109/ECTC.2014.6897500, booktitle=Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, author=Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter, year=2014, pages=1549–1555 

@inproceedingsEacock10.4071/isom-THP32Schaper_Althoff_Unger_Eichwald_Hengsbach_Zinn_Holzweissig_Guth_2014, title=Microstructural investigations of aluminum and copper wire bonds, DOI=10.4071/isom-THP32, booktitle=Proceedings of the 47th International Symposium on Microelectronics, author=Eacock , Florian and Schaper, Mirko and Althoff, Simon and Unger, Andreas and Eichwald, Paul and Hengsbach, Florian and Zinn, Carolin and Holzweissig,10.4071/isom-THP32__Martin Joachim and Guth, Karsten, year=2014