@bookAlthoff_2023, series=Schriften des Lehrstuhls für Dynamik und Mechatronik, title=Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach, volume=15, publisher=Shaker, author=Althoff, Simon, year=2023, collection=Schriften des Lehrstuhls für Dynamik und Mechatronik 

@articleSchemmel_Krieger_Hemsel_Sextro_2021, title=Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization, volume=119, DOI=https://doi.org/10.1016/j.microrel.2021.114077, journal=Microelectronics Reliability, author=Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter, year=2021, pages=114077 

@inproceedingsUnger_Hunstig_Meyer_Brökelmann_Sextro_2018, title=Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges, volume=Vol. 2018, No. 1, pp. 000572-000577., DOI=10.4071/2380-4505-2018.1.000572, booktitle=In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, author=Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter, year=2018 

@articleRösener_Hoffmann_Herres-Pawlis_2018, title=Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility, volume=2018, DOI=10.1002/ejic.201800511, number=27, journal=European Journal of Inorganic Chemistry, author=Rösener, Thomas and Hoffmann, Alexander and Herres-Pawlis, Sonja, year=2018, pages=3164–3175 

@articleOppermann_Laurini_Etscheidt_Hollmann_Strassl_Hoffmann_Schurr_Dittmeyer_Rinke_Herres-Pawlis_2017, title=Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer, volume=40, DOI=10.1002/ceat.201600691, number=8, journal=Chemical Engineering \'26; Technology, author=Oppermann, Alexander and Laurini, Larissa and Etscheidt, Fabian and Hollmann, Katharina and Strassl, Florian and Hoffmann, Alexander and Schurr, Daniela and Dittmeyer, Roland and Rinke, Günter and Herres-Pawlis, Sonja, year=2017, pages=1475–1483 

@inproceedingsEacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title=Effect of different oxide layers on the ultrasonic copper wire bond process, DOI=10.1109/ECTC.2016.91, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten, year=2016, pages=2111–2118 

@inproceedingsMeyer10.1109/ECTC.2016.215Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title=Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation, DOI=10.1109/ECTC.2016.215, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten, year=2016, pages=622–628 

@inproceedingsAlthoff_Neuhaus_Hemsel_Sextro_2014, title=Improving the bond quality of copper wire bonds using a friction model approach, DOI=10.1109/ECTC.2014.6897500, booktitle=Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, author=Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter, year=2014, pages=1549–1555 

@inproceedingsEacock10.4071/isom-THP32Schaper_Althoff_Unger_Eichwald_Hengsbach_Zinn_Holzweissig_Guth_2014, title=Microstructural investigations of aluminum and copper wire bonds, DOI=10.4071/isom-THP32, booktitle=Proceedings of the 47th International Symposium on Microelectronics, author=Eacock , Florian and Schaper, Mirko and Althoff, Simon and Unger, Andreas and Eichwald, Paul and Hengsbach, Florian and Zinn, Carolin and Holzweissig,10.4071/isom-THP32__Martin Joachim and Guth, Karsten, year=2014 

@inproceedingsEichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title=Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding, DOI=10.4071/isom-THP34, booktitle=Proceedings of the 47th International Symposium on Microelectronics, author=Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian and Unger, Andreas and Meyer, Tobias and Guth, Karsten, year=2014, pages=856–861 

@inproceedingsUnger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place=San Diego, CA, US, title=Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds, booktitle=Proceedings of the 47th International Symposium on Microelectronics (IMAPS), author=Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael, year=2014, pages=289–294 

@articleHerres-Pawlis_Berth_Wiedemeier_Schmidt_Zrenner_Warnecke_2010, title=Oxygen sensing by fluorescence quenching of [Cu(btmgp)I], volume=130, DOI=10.1016/j.jlumin.2010.05.012, number=10, journal=Journal of Luminescence, publisher=Elsevier BV, author=Herres-Pawlis, Sonja and Berth, Gerhard and Wiedemeier, Volker and Schmidt, Ludger and Zrenner, Artur and Warnecke, Hans-Joachim, year=2010, pages=1958–1962