Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–94.

Herres-Pawlis, Sonja, et al. “Oxygen Sensing by Fluorescence Quenching of [Cu(Btmgp)I].”10.1016/j.jlumin.2010.05.012__Journal of Luminescence, vol. 130, no. 10, Elsevier BV, 2010, pp. 1958–62, doi:10.1016/j.jlumin.2010.05.012.