@inproceedingsEacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title=Effect of different oxide layers on the ultrasonic copper wire bond process, DOI=10.1109/ECTC.2016.91, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten, year=2016, pages=2111–2118