@inproceedingsAlthoff_Neuhaus_Hemsel_Sextro_2014, title=Improving the bond quality of copper wire bonds using a friction model approach, DOI=10.1109/ECTC.2014.6897500, booktitle=Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, author=Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter, year=2014, pages=1549–1555 
LibreCat: /record/9868
DOI: 10.1109/ECTC.2014.6897500

@inproceedingsBecker_Kuznik_Müller_2014, place=Berlin, title=Fault Effect Modeling in a Heterogeneous SystemC Based Virtual Platform Framework for Cyber Physical Systems, DOI=10.1109/ICCPS.2014.6843726, publisher=IEEE, author=Becker, Markus and Kuznik, Christoph and Müller, Wolfgang, year=2014 
LibreCat: /record/36918
DOI: 10.1109/ICCPS.2014.6843726