@articleEichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017, title=Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design, volume=Vol. 2017, No. 1, journal=IMAPSource, author=Eichwald, Paul and Althoff, Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias, year=2017 
LibreCat: /record/9973