Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.”https://doi.org/10.1109/ECTC.2016.91__In IEEE 66th Electronic Components and Technology Conference, 2111–18, 2016.https://doi.org/10.1109/ECTC.2016.91 .
LibreCat: /record/9959
DOI: 10.1109/ECTC.2016.91