Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.”10.1109/ECTC.2016.91__IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–18, doi:10.1109/ECTC.2016.91.
LibreCat: /record/9959
DOI: 10.1109/ECTC.2016.91