Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.”10.1109/ECTC.2014.6897500__Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
LibreCat: /record/9868
DOI: 10.1109/ECTC.2014.6897500