Althoff, S., Neuhaus, J., Hemsel, T., &; Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555).https://doi.org/10.1109/ECTC.2014.6897500 
LibreCat: /record/9868
DOI: 10.1109/ECTC.2014.6897500