Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.”https://doi.org/10.1109/ECTC.2014.6897500__In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014.https://doi.org/10.1109/ECTC.2014.6897500 .
LibreCat: /record/9868
DOI: 10.1109/ECTC.2014.6897500