@inproceedingsMeyer10.1109/ECTC.2016.215Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title=Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation, DOI=10.1109/ECTC.2016.215, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten, year=2016, pages=622–628