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M. Meyer, T. Kenter, and C. Plessl, “Multi-FPGA Designs and Scaling of HPC Challenge Benchmarks via MPI and Circuit-Switched Inter-FPGA Networks,”10.1145/3576200__ACM Transactions on Reconfigurable Technology and Systems, 2023, doi:10.1145/3576200 .
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A. F. Ahmed, M. A. Sherif, and A.-C. N. Ngomo, “NELLIE: Never-Ending Linking for Linked Open Data,”10.1109/access.2023.3300694__IEEE Access, pp. 1–1, 2023, doi:10.1109/access.2023.3300694 .
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B. K. Pothineni, S. Kollmann, X. Li, G. Grundmeier, D. J. Erb, and A. Keller, “Adsorption of Ferritin at Nanofaceted Al2O3 Surfaces,”10.3390/ijms241612808__International Journal of Molecular Sciences, vol. 24, no. 16, Art. no. 12808, 2023, doi:10.3390/ijms241612808 .
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F. Winkelnkemper, L. Höper, and C. Schulte, “ARIadne – An Explanation Model for Digital Artefacts,”10.15388/infedu.2024.09__Informatics in Education, 2023, doi:10.15388/infedu.2024.09 .
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L. Kersting, B. Arian, J. Rozo Vasquez, A. Trächtler, W. Homberg, and F. Walther, “Echtzeitfähige Modellierung eines innovativen Drückwalzprozesses für die eigenschaftsgeregelte Bauteilfertigung,”10.1515/auto-2022-0106__at - Automatisierungstechnik, vol. 71, no. 1, pp. 68–81, 2023, doi:10.1515/auto-2022-0106 .
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P. Arias-Cabarcos, M. Fallahi, T. Habrich, K. Schulze, C. Becker, and T. Strufe, “Performance and Usability Evaluation of Brainwave Authentication Techniques with Consumer Devices,”10.1145/3579356__ACM Transactions on Privacy and Security, vol. 26, no. 3, pp. 1–36, 2023, doi:10.1145/3579356 .
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H. Westermann and R. Mahnken, “On the accuracy, stability and computational efficiency of explicit last-stage diagonally implicit Runge–Kutta methods (ELDIRK) for the adaptive solution of phase-field problems,”10.1016/j.cma.2023.116545__Computer Methods in Applied Mechanics and Engineering, vol. 418, Art. no. 116545, 2023, doi:10.1016/j.cma.2023.116545 .
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