Althoff S, Neuhaus J, Hemsel T, Sextro W. A friction based approach for modeling wire bonding. In: IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA; 2013. doi:10.4071/isom-2013-TA67
LibreCat: /record/9797
DOI: 10.4071/isom-2013-TA67