Althoff, S., Neuhaus, J., Hemsel, T., &; Sextro, W. (2013). A friction based approach for modeling wire bonding. In IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA.https://doi.org/10.4071/isom-2013-TA67 
LibreCat: /record/9797
DOI: 10.4071/isom-2013-TA67