@inproceedingsAlthoff_Neuhaus_Hemsel_Sextro_2013, place=Orlando (Florida), USA, title=A friction based approach for modeling wire bonding, DOI=10.4071/isom-2013-TA67, booktitle=IMAPS 2013, 46th International Symposium on Microelectronics, author=Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter, year=2013 
LibreCat: /record/9797
DOI: 10.4071/isom-2013-TA67