Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction Based Approach for Modeling Wire Bonding.”https://doi.org/10.4071/isom-2013-TA67__In IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA, 2013.https://doi.org/10.4071/isom-2013-TA67 .
LibreCat: /record/9797
DOI: 10.4071/isom-2013-TA67