Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.”10.4071/isom-2013-TA67__IMAPS 2013, 46th International Symposium on Microelectronics, 2013, doi:10.4071/isom-2013-TA67.
LibreCat: /record/9797
DOI: 10.4071/isom-2013-TA67