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DOI: 10.4071/2380-4505-2018.1.000572

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Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., &; Guth, K. (2014). Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In Proceedings of the 47th International Symposium on Microelectronics (pp. 856–861).https://doi.org/10.4071/isom-THP34 
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