F. Eacock et al., “Effect of different oxide layers on the ultrasonic copper wire bond process,” in IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
LibreCat: /record/9959
DOI: 10.1109/ECTC.2016.91

S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
LibreCat: /record/9868
DOI: 10.1109/ECTC.2014.6897500

A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.
LibreCat: /record/9895