Slapáková, M., Kihoulou, B., Veselý, J., Minárik, P., Fekete, K., Knapek, M., Králík, R., Grydin, O., Stolbchenko, M., &; Schaper, M. (2023). 3D-structure of intermetallic interface layer in Al–steel clad material. Vacuum, 212, Article 112043.https://doi.org/10.1016/j.vacuum.2023.112043 
LibreCat: /record/43441
DOI: 10.1016/j.vacuum.2023.112043

Düsing, M., &; Mahnken, R. (2018). eA coupled phase field/diffusion model for upper and lower bainitic transformation”. International Journal of Solids and Structures, 135, 1723183.
LibreCat: /record/9899

Althoff, S., Neuhaus, J., Hemsel, T., &; Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555).https://doi.org/10.1109/ECTC.2014.6897500 
LibreCat: /record/9868
DOI: 10.1109/ECTC.2014.6897500