@inproceedingsDymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title=Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding, booktitle=(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), author=Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias, year=2018, pages=41–44