@inproceedingsUnger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place=San Diego, CA, US, title=Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds, booktitle=Proceedings of the 47th International Symposium on Microelectronics (IMAPS), author=Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael, year=2014, pages=289–294