Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.
LibreCat: /record/41971

Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.
LibreCat: /record/10334
DOI: 10.1016/j.sna.2019.04.025

Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
LibreCat: /record/9868
DOI: 10.1109/ECTC.2014.6897500

An efficient simulation technique for high-frequency piezoelectric inertia motors
M. Hunstig, T. Hemsel, W. Sextro, in: Ultrasonics Symposium (IUS), 2012 IEEE International, 2012, pp. 277–280.
LibreCat: /record/9784
DOI: 10.1109/ULTSYM.2012.0068