S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach, vol. 15. Shaker, 2023.

A. Bender, “Model-based condition monitoring of piezoelectric bending actuators,”10.1016/j.sna.2023.114399__Sensors and Actuators A: Physical, vol. 357, Art. no. 114399, 2023, doi:10.1016/j.sna.2023.114399 .

L. Özcan, T. Fichtler, B. Kasten, C. Koldewey, and R. Dumitrescu, “Interview Study on Strategy Options for Platform Operation in B Markets,” presented at the ISPIM Innovation Conference, Ljubljana, 2023.

J. Kersting, F. Maoro, and M. Geierhos, “Towards comparable ratings: Exploring bias in German physician reviews,”10.1016/j.datak.2023.102235__Data &; Knowledge Engineering, vol. 148, Art. no. 102235, 2023, doi:10.1016/j.datak.2023.102235 .

S. Gottschalk, E. Yigitbas, A. Nowosad, and G. Engels, “Situational Business Model Developer: A Tool-support for Situation-speciû01c Business Model Development,” presented at the 17th International Conference on Wirtschaftsinformatik, Nuremberg, 2022.

S. Gottschalk, E. Yigitbas, and G. Engels, “Model-driven Continuous Experimentation on Component-based Software Architectures ,”10.1109/ICSA-C54293.2022.00011__presented at the 18th International Conference on Software Architecture , Hawaii, 2022, doi:10.1109/ICSA-C54293.2022.00011 .

S. Werner, S. B. Schneider, and H. Karl, “Use What You Know: Network and Service Coordination Beyond Certainty,” presented at the IEEE/IFIP Network Operations and Management Symposium (NOMS), Budapest, 2022.

T. Hemsel and J. Twiefel, “Piezoelectric Ultrasonic Power Transducers,” in Reference Module in Materials Science and Materials Engineering, Elsevier, 2022.

I. Gräßler, B. Grewe, and H. Kramer, “Supporting Business Model Generation with Augmented Reality,” presented at the 33. ISPIM Innovation Conference “Innovating in a Digital World,” Copenhagen, 2022.

R. Stephan and A. Brosius, “Experimental Measurement Method and Evaluation of an Analytical Approach for Sound Conduction through Multiple Clinched Sheets,”10.3390/engproc2022026025__2022, doi:10.3390/engproc2022026025 .