@inproceedingsAlthoff_Neuhaus_Hemsel_Sextro_2014, title=Improving the bond quality of copper wire bonds using a friction model approach, DOI=10.1109/ECTC.2014.6897500, booktitle=Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, author=Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter, year=2014, pages=1549–1555