Modeling approaches for the decomposition behavior of preconsolidated rovings throughout local deformation processes
B. Gröger, J. Gerritzen, A. Hornig, M. Gude, in: G. Meschut, M. Bobbert, J. Duflou, L. Fratini, H. Hagenah, P. Martins, M. Merklein, F. Micari (Eds.), Sheet Metal 2025, Materials Research Forum LLC, Materials Research Foundations, 2025, pp. 268–275.

Expulsion prevention in resistance spot welding of dissimilar joints with ultra-high strength steel: An analysis of the mechanism and effect of preheating current
K. Yang, B. El-Sari, V. Olfert, Z. Wang, M. Biegler, M. Rethmeier, G. Meschut, Journal of Manufacturing Processes 124 (2024) 489–502.

Do Guided Mosque Tours Alleviate the Prejudice of Non-Muslims against Islam and Muslims? Evidence from a Quasi-Experimental Panel Study from Germany
O. Janzen, I. Diekmann, D. Tsolak, K. Salentin, Zeitschrift Für Religion, Gesellschaft Und Politik 8 (2024) 129–159.

TemporalFC: A Temporal Fact Checking Approach over Knowledge Graphs
U. Qudus, M. Röder, S. Kirrane, A.-C.N. Ngomo, in: T. R. Payne, V. Presutti, G. Qi, M. Poveda-Villalón, G. Stoilos, L. Hollink, Z. Kaoudi, G. Cheng, J. Li (Eds.), The Semantic Web – ISWC 2023, Springer, Cham, Cham, 2023, pp. 465–483.

Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.

Far-field Calculation from magnetic Huygens Box Data using the Boundary Element Method
C. Marschalt, D. Schroder, S. Lange, U. Hilleringmann, C. Hedayat, H. Kuhn, D. Sievers, J. Förstner, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.

Extraktion und Selektion geeigneter Merkmale für die Restlebensdauerprognose von technischen Systemen trotz aleatorischen Unsicherheiten 
O.K. Aimiyekagbon, A. Bender, W. Sextro, in: VDI-Berichte 2391, VDI Verlag GmbH, Düsseldorf, 2021, pp. 197–210.

Intergenerational Value Similarity in Adulthood
C. Hoellger, S. Sommer, I. Albert, H.M. Buhl, Journal of Family Issues 42 (2020) 1234–1257.

Analysis of pipe vibration in an ultrasonic powder transportationsystem
P. Dunst, T. Hemsel, W. Sextro, Elsevier Sensors and Actuators A 263 (2017) 733–736.

Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.

Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS
S. Kohl, W. Sextro, S. Schulze, in: The 2nd International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., Cyberjaya, Malaysia, 2016, 2016, pp. 1–12.

A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties
F. Schulte, J. Neuhaus, W. Sextro, in: Proceedings of ICoEV 2015 International Conference on Engineering Vibration, 2015, pp. 1109–1117.

Transient modeling of ultrasonic guided waves in circular viscoelastic waveguides for inverse material characterization
F. Bause, H. Gravenkamp, J. Rautenberg, B. Henning, Measurement Science and Technology 26 (2015).

Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.

Thermo-Mechanical Model for Wheel Rail Contact using Coupled Point Contact Elements
J. Neuhaus, W. Sextro, in: G.R. Liu, Z.W. Guan (Eds.), Proceedings of the 5th International Conference on Computational Methods, ScienTech Publisher, 2014.

Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.

A comprehensive model of wear, friction and contact temperature in radial shaft seals
D. Frölich, B. Magyar, B. Sauer, Wear 311 (2014) 71–80.

Fault Effect Modeling in a Heterogeneous SystemC Based Virtual Platform Framework for Cyber Physical Systems
M. Becker, C. Kuznik, W. Müller, in: IEEE, Berlin, 2014.

A friction based approach for modeling wire bonding
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.

Educating attention: recruiting, maintaining, and framing eye contact in early natural mother-infant interactions
I. Nomikou, K. Rohlfing, J. Szufnarowska, Interaction Studies 14 (2013) 240–267.