@articleSchemmel_Krieger_Hemsel_Sextro_2021, title=Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization, volume=119, DOI=https://doi.org/10.1016/j.microrel.2021.114077, journal=Microelectronics Reliability, author=Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter, year=2021, pages=114077 
LibreCat: /record/21436
DOI: https://doi.org/10.1016/j.microrel.2021.114077

@inproceedingsKretzschmar_Schöppner_2010, place=San Diego, CA, USA, series=SCSC ’10, title=Simulating Tightly Intermeshing, Co-Rotating Twin Screw Extruders with SIGMA, booktitle=Proceedings of the 2010 Summer Computer Simulation Conference, publisher=Society for Computer Simulation International, author=Kretzschmar, Nils and Schöppner, Volker, year=2010, pages=133–140, collection=SCSC ’10 
LibreCat: /record/23858