Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”https://doi.org/10.1016/j.microrel.2021.114077__Microelectronics Reliability, vol. 119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.

Kretzschmar, Nils, and Volker Schöppner. “Simulating Tightly Intermeshing, Co-Rotating Twin Screw Extruders with SIGMA.” Proceedings of the 2010 Summer Computer Simulation Conference, Society for Computer Simulation International, 2010, pp. 133–140.