Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., &; Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).