@inproceedingsDymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title=Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process, booktitle=(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), author=Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter, year=2018, pages=1–6