Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
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Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.