@inproceedingsEichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title=Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding, DOI=10.4071/isom-THP34, booktitle=Proceedings of the 47th International Symposium on Microelectronics, author=Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian and Unger, Andreas and Meyer, Tobias and Guth, Karsten, year=2014, pages=856–861