@bookAlthoff_2023, series=Schriften des Lehrstuhls für Dynamik und Mechatronik, title=Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach, volume=15, publisher=Shaker, author=Althoff, Simon, year=2023, collection=Schriften des Lehrstuhls für Dynamik und Mechatronik 

@inproceedingsHesse_Hunstig_Timmermann_Trächtler_2022, title=Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design, booktitle=Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), author=Hesse, Michael and Hunstig, Matthias and Timmermann, Julia and Trächtler, Ansgar, year=2022, pages=383–394 

@articleSchemmel_Krieger_Hemsel_Sextro_2021, title=Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization, volume=119, DOI=https://doi.org/10.1016/j.microrel.2021.114077, journal=Microelectronics Reliability, author=Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter, year=2021, pages=114077 

@inproceedingsDymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title=Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process, booktitle=(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), author=Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter, year=2018, pages=1–6 

@inproceedingsUnger_Hunstig_Meyer_Brökelmann_Sextro_2018, title=Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges, volume=Vol. 2018, No. 1, pp. 000572-000577., DOI=10.4071/2380-4505-2018.1.000572, booktitle=In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, author=Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter, year=2018 

@inproceedingsSchemmel_Hemsel_Sextro_2017, place=Kiel 2017, title=MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall, booktitle=43. Deutsche Jahrestagung für Akustik, author=Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter, year=2017, pages=611–614 

@inproceedingsAlthoff_Meyer_Unger_Sextro_Eacock_2016, title=Shape-Dependent Transmittable Tangential Force of Wire Bond Tools, DOI=10.1109/ECTC.2016.234, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian, year=2016, pages=2103–2110 

@inproceedingsEacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016, title=Effect of different oxide layers on the ultrasonic copper wire bond process, DOI=10.1109/ECTC.2016.91, booktitle=IEEE 66th Electronic Components and Technology Conference, author=Eacock, Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach, Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten, year=2016, pages=2111–2118 

@inproceedingsUnger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place=IEEE CPMT Symposium Japan, title=Validated Simulation of the Ultrasonic Wire Bonding Process, booktitle=Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, author=Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten, year=2016, pages=251–254 

@inproceedingsAlthoff_Neuhaus_Hemsel_Sextro_2014, title=Improving the bond quality of copper wire bonds using a friction model approach, DOI=10.1109/ECTC.2014.6897500, booktitle=Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, author=Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter, year=2014, pages=1549–1555