Numerical analysis of the robustness of clinching process considering the pre-forming of the parts 
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The Deterioration Mechanism of Silicone Molds in Polyurethane Vacuum Casting
M. Wortmann, N. Frese, W. Keil, J. Brikmann, J. Biedinger, B. Brockhagen, G. Reiss, C. Schmidt, A. Gölzhäuser, E. Moritzer, B. Hüsgen, ACS Applied Polymer Materials 2 (2020) 4719–4732.
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Transformable Decentral Production for Local Economies with Minimized Carbon Footprint
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Seven Paradoxes of Business Process Management in a Hyper-Connected World
D. Beverungen, J.C.A.M. Buijs, J. Becker, C. Di Ciccio, W.M.P. van der Aalst, C. Bartelheimer, J. vom Brocke, M. Comuzzi, K. Kraume, H. Leopold, M. Matzner, J. Mendling, N. Ogonek, T. Post, M. Resinas, K. Revoredo, A. del-Río-Ortega, M. La Rosa, F.M. Santoro, A. Solti, M. Song, A. Stein, M. Stierle, V. Wolf, Business &; Information Systems Engineering 63 (2020) 145–156.
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Banks and Corporate Income Taxation: A Review
V. Gawehn, Banks and Corporate Income Taxation: A Review, SSRN, 2019.
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Modeling and Validating FixedBed Reactors: A StateoftheArt Review
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Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
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Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.
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Innovative scaling strategies for a fast development of apparatuses by modular process engineering
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The Role of Gender in Business Process Management Competence Supply
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Towards a typology of business process management professionals: identifying patterns of competences through latent semantic analysis
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An Economic Theory of 'Destabilization War'
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Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.
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Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
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Structure of Ultrahigh Molecular Weight Polyethylene-Air Counterflow Flame
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Improving the bond quality of copper wire bonds using a friction model approach
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Synthesis of cyclic carbonates from epoxides and CO2 catalyzed by potassium iodide and amino alcohols
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Designing interaction routines in service networks: A modularity and social construction-based approach
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Bridging the gap between manufacturing and service through IT-based boundary objects
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On the selective aerobic oxidation of benzyl alcohol with Pd/Au-nanoparticles in batch and flow
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