Lead-Free Ceramics in Prestressed Ultrasonic Transducers
C. Scheidemann, P. Bornmann, W. Littmann, T. Hemsel, Actuators 14 (2025).

Sensitivity Analysis and Material Parameter Estimation of a Pre-Stressed Langevin Transducer
O. Friesen, C. Scheidemann, L. Claes, T. Hemsel, B. Henning, in: 2025 International Congress on Ultrasonics, AMA Service GmbH, Paderborn, 2025, pp. 138–141.

Estimation of third order elastic constants of piezoceramics using DC biased impedance measurements
L. Claes, J. Hölscher, O. Friesen, C. Scheidemann, T. Hemsel, B. Henning, in: 2025 International Congress on Ultrasonics, AMA Service GmbH, Paderborn, 2025, pp. 142–145.

Investigation of the Setting Behaviour of Mechanically Biased Piezoelectric Ultrasonic Transducers
C. Scheidemann, J. Porzenheim, T. Hemsel, W. Sextro, in: 2025.

Time dependent material characteristics of prestressed piezoelectric ceramics in langevin transducers
C. Scheidemann, T. Hemsel, W. Sextro, in: 2025.

Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions
O.K. Aimiyekagbon, A. Bender, T. Hemsel, W. Sextro, Electronics 13 (2024).

Estimation of temperature-dependent piezoelectric material parameters using ring-shaped specimens
O. Friesen, L. Claes, C. Scheidemann, N. Feldmann, T. Hemsel, B. Henning, in: 2023 International Congress on Ultrasonics, Beijing, China, IOP Publishing, 2024, p. 012125.

Characteristic behavior of lead-free and lead-containing piezo ring ceramics in ultrasonic transducers
C. Scheidemann, T. Hemsel, W. Sextro, in: 2024.

The Influence of Ultrasonic Irradiation of a 316L Weld Pool Produced by DED on the Mechanical Properties of the Produced Component
D. Lehnert, C. Bödger, P. Pabel, C. Scheidemann, T. Hemsel, S. Gnaase, D. Kostka, T. Tröster, Crystals 14 (2024).

Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process
C. Scheidemann, O.E.C. Hagedorn, T. Hemsel, W. Sextro, in: 2023.

Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells
B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), 2023.

Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells
R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), 2023.

Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.

Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.

Piezoelectric Ultrasonic Power Transducers
T. Hemsel, J. Twiefel, in: Reference Module in Materials Science and Materials Engineering, Elsevier, 2022.

Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen
C. Scheidemann, T. Hemsel, W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen, LibreCat University, 2022.

Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding
O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, Berlin, 2022, pp. 138–143.

Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding
C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.

Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.

Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.