Self-aligned organic thin-film transistors for flexible electronics
T. Meyers, J. Reker, J. Temme, F.F. Vidor, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

Inorganic p-channel thin-film transistors using CuO nanoparticles
J. Reker, T. Meyers, F.F. Vidor, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

Gas Responsive Nanoswitch: Copper Oxide Composite for Highly Selective S Detection
A. Paul, B. Schwind, C. Weinberger, M. Tiemann, T. Wagner, Advanced Functional Materials (2019).

Nanoparticles and organic semiconductors for flexible electronics
U. Hilleringmann, J. Reker, F.F. Vidor, T. Meyers, T.H. Joubert, P. Bezuidenhout, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

Improved organic thin-film transistor performance by dielectric layer patterning
J. Temme, T. Meyers, J. Reker, F.F. Vidor, J. Vollbrecht, H. Kitzerow, J. Paradies, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

Mechanical deformation on nanoparticle-based thin-film transistors
F.F. Vidor, T. Meyers, J. Reker, K. Müller, G.I. Wirth, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

Oxygen detection with zinc oxide nanoparticle structures
T. Schwabe, A. Balke, P. Bezuidenhout, J. Reker, T. Meyers, T.-H. Joubert, U. Hilleringmann, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

Characterization of inkjet-printed dielectric on different substrates
J. Kruger, P.H. Bezuidenhout, U. Hilleringmann, T.-H. Joubert, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

Method of superposing a multiple driven magnetic field to minimize stray fields around the receiver for inductive wireless power transmission
S. Lange, M.-J. Bueker, D. Sievers, C. Hedayat, J. Foerstner, U. Hilleringmann, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.

Characterization of H-field Probes regarding Unwanted Field Suppression using Different Calibration Structures
D. Schroeder, C. Hangmann, C. Hedayat, T. Otto, U. Hilleringmann, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.

Wireless power supply for a RFID based sensor platform
M. Schmidt, D. Petrov, C. Hedayat, U. Hilleringmann, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.

Characterization of inkjet-printed dielectric on different substrates
J. Kruger, P.H. Bezuidenhout, U. Hilleringmann, T.-H. Joubert, in: M. du Plessis (Ed.), Fifth Conference on Sensors, MEMS, and Electro-Optic Systems, SPIE, 2019.

RFID based sensor platform for industry 4.0 application
D. Petrov, M. Schmidt, U. Hilleringmann, C. Hedayat, T. Otto, in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, pp. 1–4.

Devolopment, Production and post-processing of a topology optimized aircraft bracket 
S.H. Klippstein, A. Duchting, T. Reiher, F. Hengsbach, D. Menge, H.-J. Schmid, in: 30th Annual International Solid Freeform Fabrication Symposium, 2019, pp. 1932–1945.

Einfache Ermittlung von Schnellhärtungsparametern für elementar geklebte Strukturen
J. Ditter, T. Aubel, D. Teutenberg, G. Meschut, adhäsion KLEBEN &;amp; DICHTEN 63 (2019) 40–45.

Joining of high strength aluminum alloys by refill friction stir spot welding (III-1854-18)
C. Schmal, G. Meschut, N. Buhl, Welding in the World 63 (2019) 541–550.

Zwei Betrachtungen von Sicherheit und Privatheit nach Snowden
B. Auerbach, M. Shnayien, E. Kiltz, A. Tuschling, Datenschutz Und Datensicherheit - DuD 43 (2019) 706–712.

History and Aesthetics of Progress Indicators [Edistymispalkkien historia ja estetiikka]
F. Raczkowski, M. Shnayien, Tekniikan Waiheita 37 (2019) 57–67.

Transformation und Wandel der Beruflichen Integrationsförderung. Vom eErfolgsmodellc zum eProblemfallc.
D. Heisler, Berufsbildung. Zeitschrift für Theorie-Praxis-Dialog 175 (2019).

Potentiale und Herausforderungen von multiprofessionellen Teams aus systemischer Perspektive.
M. Engemann, S. Aßmann, T. Bührmann, in: 2019.