T. Meier, C. Ngo, S. Priyadarshi, H. T. Duc, and M. Bieler, “Terahertz-induced anomalous currents following the optical excitation of excitons in semiconductor quantum wells,”10.1117/12.2646022__in Ultrafast Phenomena and Nanophotonics XXVII, 2023, vol. 12419, doi:10.1117/12.2646022 .

T. Meier et al., “Analysis of the nonlinear optical response of excitons in type-I and type-II quantum wells including many-body correlations,”10.1117/12.2650169__in Ultrafast Phenomena and Nanophotonics XXVII, 2023, vol. 12419, doi:10.1117/12.2650169 .

T. Meier et al., “Gain recovery dynamics in active type-II semiconductor heterostructures,”10.1063/5.0128777__Applied Physics Letters, vol. 122, no. 8, Art. no. 082104, 2023, doi:10.1063/5.0128777 .

T. Meier et al., “Temporal sorting of optical multi-wave-mixing processes in semiconductor quantum dots,” arxiv:2302.02480. 2023.

J. Sperling and E. Agudelo, “Entanglement of particles versus entanglement of fields: Independent quantum resources,”10.1103/physreva.107.042420__Physical Review A, vol. 107, no. 4, Art. no. 042420, 2023, doi:10.1103/physreva.107.042420 .

J. Sperling, I. Gianani, M. Barbieri, and E. Agudelo, “Detector entanglement: Quasidistributions for Bell-state measurements,”10.1103/physreva.107.012426__Physical Review A, vol. 107, no. 1, Art. no. 012426, 2023, doi:10.1103/physreva.107.012426 .

C. Lüders et al., “Tracking Quantum Coherence in Polariton Condensates with Time-Resolved Tomography,”10.1103/physrevlett.130.113601__Physical Review Letters, vol. 130, no. 11, Art. no. 113601, 2023, doi:10.1103/physrevlett.130.113601 .

J. Brosig-Koch, B. Hehenkamp, and J. Kokot, “Who benefits from quality competition in health care? A theory and a laboratory experiment on the relevance of patient characteristics,”10.1002/hec.4689__Health Economics, 2023, doi:10.1002/hec.4689 .

B. Hehenkamp and O. M. Kaarbøe, Price Regulation, Quality Competition and Location Choice with Costly Relocation. .

D. Hähnel et al., “A multi-mode super-fano mechanism for enhanced third harmonic generation in silicon metasurfaces,”https://doi.org/10.1038/s41377-023-01134-1__Light: Science &; Applications, vol. 12, no. 1, p. 97, 2023, doi:https://doi.org/10.1038/s41377-023-01134-1 .

M. Maack, “Online load balancing on uniform machines with limited migration,”10.1016/j.orl.2023.02.013__Operations Research Letters, vol. 51, no. 3, pp. 220–225, 2023, doi:10.1016/j.orl.2023.02.013 .

T. Mamedov, E. Schleicher, M. Schubert, T. Ehlert, E. Y. Kenig, and U. Hampel, “Experimental analysis of ship motion effects on the performance of an absorption column equipped with structured packings,” presented at the Jahrestreffen der ProcessNet-Fachgruppen Fluidverfahrenstechnik und Adsoprtion, Frankfurt am Main, 2023.

T. Ehlert, T. Mamedov, M. Schubert, and E. Y. Kenig, “Charakterisierung des Einflusses neigungsinduzierter Strömungsformen mit dem Ansatz der hydrodynamsichen Analogie,” presented at the Jahrestreffen der ProcessNet-Fachgruppen Fluidverfahrenstechnik und Adsoprtion, Frankfurt am Main, 2023.

T. Ehlert, N. Lutters, and E. Y. Kenig, “Modellierung des Randspalts in Strukturpackungskolonnen mit dem Ansatz der hydrodynamischen Analogien,” presented at the Jahrestreffen der ProcessNet-Fachgruppen Fluidverfahrenstechnik und Adsoprtion, Frankfurt am Main, 2023.

Y. K. Jende, “‘The Future of Canadian Studies: On Plowing a Lonely Furrow.’ ,” Zeitschrift für Kanada-Studien , vol. 43, pp. 126–127, 2023.

A. B. Bauer, Experimentelle Kompetenz Physikstudierender. Entwicklung und erste Erprobung eines performanzorientierten Kompetenzstrukturmodells unter Nutzung qualitativer Methoden, vol. 352. Berlin: Logos Verlag Berlin GmbH, 2023.

F. Beule, L. Schmelzle, D. Teutenberg, G. Possart, G. Meschut, and J. Mergheim, “Methodenentwicklung zur Simulation von hyperelastischen Klebverbindungen unter Crashbelastung,” presented at the 23. Kolloquium: Gemeinsame Forschung in der Klebtechnik, Frankfurt, 2023.

P. Schürmann,  A Formal Comparison of Advanced Digital Signature Primitives. 2023.

J. Kowatz, D. Teutenberg, and G. Meschut, “Weiterentwicklung der induktiven Schnellhärtung von Klebverbindungen für robuste Fertigungsprozesse unter Berücksichtigung von serienrelevanten Einflussfaktoren,” in 23. Kolloquium Gemeinsame Forschung in der Klebtechnik, Frankfurt a. M., 2023.

E. Moritzer and F. Flachmann, “Morphological and mechanical properties of foamed thick-walled Wood-Plastic-Composite structures,”10.1177/0021955x231161175__Journal of Cellular Plastics, vol. 59, no. 3, pp. 187–199, 2023, doi:10.1177/0021955x231161175 .