Robust Pattern Generation for Small Delay Faults under Process Variations
H. Jafarzadeh, F. Klemme, J.D. Reimer, Z.P. Najafi Haghi, H.  Amrouch, S. Hellebrand, H.-J.  Wunderlich, in: IEEE International Test Conference (ITC’23), Anaheim, USA, October 2023, IEEE, Anaheim, CA, USA, 2023.

Simplified numerical calculation of the isothermal, three-dimensional, Non-Newtonian flow characteristics of single-screw melt-extruder
D. Stüker, V. Schöppner, in: INTERNATIONAL CONFERENCE ON HUMANS AND TECHNOLOGY: A HOLISTIC AND SYMBIOTIC APPROACH TO SUSTAINABLE DEVELOPMENT: ICHT 2022, AIP Publishing, 2023.

Introduction—The Digital Twin of Humans
I. Gräßler, E. Steffen, G.W. Maier, D. Roesmann, in: I. Gräßler, G.W. Maier, E. Steffen, D. Roesmann (Eds.), The Digital Twin of Humans, Springer International Publishing, Cham, 2023, pp. 3–10.

The Digital Twin of Humans
I. Gräßler, G.W. Maier, E. Steffen, D. Roesmann, eds., The Digital Twin of Humans, Springer International Publishing, Cham, 2023.

Calibration of a Contact Model for DEM Simulations of Grooved Feed  Sections of Single Screw Extruders
V. Schöppner, F. Brüning, in: 36th International Conference of the Polymer Processing Society  (PPS-36), Montreal (Kanada), 2023.

Individual Assembly Guidance
A. Pöhler, I. Gräßler, in: The Digital Twin of Humans, Springer International Publishing, Cham, 2023, pp. 171–185.

The short-and long-term properties of welded high-temperature-resistant thermoplastics
S. Vogtschmidt, V. Schöppner, in: 2023.

Adaptive Scaling of Components in the Fused Deposition Modeling Process
E. Moritzer, F. Hecker, Macromolecular Symposia 411 (2023).

Analysis and modelling of the material degradation of polypropylene on the co-rotating twin-screw extruder
M. Altepeter, S. Wanke, V. Schöppner, in: INTERNATIONAL CONFERENCE ON HUMANS AND TECHNOLOGY: A HOLISTIC AND SYMBIOTIC APPROACH TO SUSTAINABLE DEVELOPMENT: ICHT 2022, AIP Publishing, 2023.

Integration of Human Factors for Assembly Systems of the Future
D. Roesmann, I. Gräßler, in: The Digital Twin of Humans, Springer International Publishing, Cham, 2023, pp. 187–203.