Neuhausen, T., &; Ahlers, M. (2024). Modellierungen außerinstitutioneller Aneignungsprozesse digital-materieller Interfaces und (musik-)pädagogische Anschlüsse. In D. Neuhaus &; H. J. Keden (Eds.), Musik – Digitalisierung – Bildung (pp. 77–96). kopaed.
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Neuhaus, J. (2017). Multiskalen-Kontaktmodellierung unter Berücksichtigung der Rauigkeit und fluiden Zwischenschichten am Beispiel des Rad-Schiene-Kontakts. Shaker.
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Schulte, F., Neuhaus, J., &; Sextro, W. (2015). A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In Proceedings of ICoEV 2015 International Conference on Engineering Vibration (pp. 1109–1117).
LibreCat: /record/9952

Althoff, S., Neuhaus, J., Hemsel, T., &; Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 1549–1555).https://doi.org/10.1109/ECTC.2014.6897500 
LibreCat: /record/9868
DOI: 10.1109/ECTC.2014.6897500

Neuhaus, J., &; Sextro, W. (2014). Thermo-Mechanical Model for Wheel Rail Contact using Coupled Point Contact Elements. In G. R. Liu &; Z. W. Guan (Eds.), Proceedings of the 5th International Conference on Computational Methods. ScienTech Publisher.
LibreCat: /record/9887

Althoff, S., Neuhaus, J., Hemsel, T., &; Sextro, W. (2013). A friction based approach for modeling wire bonding. In IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA.https://doi.org/10.4071/isom-2013-TA67 
LibreCat: /record/9797
DOI: 10.4071/isom-2013-TA67