Optimizing Communication for Latency Sensitive HPC Applications on up to 48 FPGAs Using ACCL
M. Meyer, T. Kenter, L. Petrica, K. O’Brien, M. Blott, C. Plessl, ArXiv:2403.18374 (2024).
LibreCat: /record/53364
arXiv: 2403.18374

Noctua 2 Supercomputer
C. Bauer, T. Kenter, M. Lass, L. Mazur, M. Meyer, H. Nitsche, H. Riebler, R. Schade, M. Schwarz, N. Winnwa, A. Wiens, X. Wu, C. Plessl, J. Simon, Journal of Large-Scale Research Facilities 9 (2024).
LibreCat: /record/53663
DOI: 10.17815/jlsrf-8-187 

Multi-FPGA Designs and Scaling of HPC Challenge Benchmarks via MPI and Circuit-Switched Inter-FPGA Networks
M. Meyer, T. Kenter, C. Plessl, ACM Transactions on Reconfigurable Technology and Systems (2023).
LibreCat: /record/38041
DOI: 10.1145/3576200

Compute Centers I: Heterogeneous Execution Environments
T. Hansmeier, T. Kenter, M. Meyer, H. Riebler, M. Platzner, C. Plessl, in: C.-J. Haake, F. Meyer auf der Heide, M. Platzner, H. Wachsmuth, H. Wehrheim (Eds.), On-The-Fly Computing -- Individualized IT-Services in Dynamic Markets, Heinz Nixdorf Institut, Universität Paderborn, Paderborn, 2023, pp. 165–182.
LibreCat: /record/45893
DOI: 10.5281/zenodo.8068642

In-depth FPGA Accelerator Performance Evaluation with Single Node Benchmarks from the HPC Challenge Benchmark Suite for Intel and Xilinx FPGAs using OpenCL
M. Meyer, T. Kenter, C. Plessl, Journal of Parallel and Distributed Computing (2022).
LibreCat: /record/27364
DOI: 10.1016/j.jpdc.2021.10.007

Patent DE 10 2017 000 926 : Gerät mit wenigstens einem elastisch verformbaren Bauteil, insbesondere einem Gummi-Metall-Lager und mit einer Einrichtung zur Feststellung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer, sowie Verfahren zur Bestimmung der Bauteil-Restnutzungsdauer.
K. Reinke, A. Bender, T. Meyer, W. Sextro, J.K. Kimotho, (2022).
LibreCat: /record/9980

Evaluating FPGA Accelerator Performance with a Parameterized OpenCL Adaptation of Selected Benchmarks of the HPCChallenge Benchmark Suite
M. Meyer, T. Kenter, C. Plessl, in: 2020 IEEE/ACM International Workshop on Heterogeneous High-Performance Reconfigurable Computing (RC), 2020.
LibreCat: /record/21632
DOI: 10.1109/h2rc51942.2020.00007

Patent EP 3 358 332 : Verfahren zur Bestimmung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer eines elastisch verformbaren Bauteils, als Strukturteil und/oder Lagerteil eines Geräts.
K. Reinke, A. Bender, T. Meyer, W. Sextro, J.K. Kimotho, (2020).
LibreCat: /record/9981

Steigerung der Intelligenz mechatronischer Systeme
T. Meyer, T. Kaul, J.K. Kimotho, W. Sextro, Steigerung Der Intelligenz Mechatronischer Systeme, Springer Nature Switzerland AG. Part of Springer Nature., 2018.
LibreCat: /record/9995

Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.
LibreCat: /record/9999
DOI: 10.4071/2380-4505-2018.1.000572

Optimization-based reliability control of mechatronic systems
T. Meyer, Optimization-Based Reliability Control of Mechatronic Systems, Shaker, 2018.
LibreCat: /record/9994

Formulation of reliability-related objective functions for design of intelligent mechatronic systems
T. Kaul, T. Meyer, W. Sextro, SAGE Journals Vol. 231(4) (2017) 390–399.
LibreCat: /record/9976
DOI: 10.1177/1748006X17709376

Entwicklung verlässlicher, intelligenter Systeme
W. Sextro, T. Meyer, T. Kaul, J.K. Kimotho, in: VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung Und Betrieb Zuverlässiger Produkte., Leonberg, 2017, pp. 17–30.
LibreCat: /record/9985

Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.
LibreCat: /record/9955
DOI: 10.1109/ECTC.2016.234

Kupferbondverbindungen intelligent herstellen
M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F. Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.
LibreCat: /record/9957

Modeling of Complex Redundancy in Technical Systems with Bayesian Networks
T. Kaul, T. Meyer, W. Sextro, in: Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016, 2016.
LibreCat: /record/9961

Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.
LibreCat: /record/9966
DOI: 10.1109/ECTC.2016.215

Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
LibreCat: /record/9968

Integrierte Modellierung der Dynamik und der Verlässlichkeit komplexer mechatronischer Systeme
T. Kaul, T. Meyer, W. Sextro, in: J. Gausemeier, R. Dumitrescu, F. Rammig, W. Schäfer, A. Trächtler (Eds.), 10. Paderborner Workshop Entwurf Mechatronischer Systeme, Heinz Nixdorf Institut, Universität Paderborn, Paderborn, 2015, pp. 101–112.
LibreCat: /record/9945

Integrated Model for Dynamics and Reliability of Intelligent Mechatronic Systems
T. Kaul, T. Meyer, W. Sextro, in: P. et al. (Ed.), European Safety and Reliability Conference (ESREL2015), Taylor and Francis, London, 2015.
LibreCat: /record/9946
DOI: 10.1201/b19094-290