Damage modeling in the numerical simulation of mechanical joining processes
M. Otroshi, Damage Modeling in the Numerical Simulation of Mechanical Joining Processes, Shaker Verlag, 2022.

Investigation of the three-dimensional stress state during loading of self-piercing riveted joints
M. Otroshi, G. Meschut, in: n.d.

Charge mentale et violence domestique: une approche des récits de femmes en termes de small stories
J. Mildorf, in: S. Patron (Ed.), Récits de La Charge Mentale Des Femmes: Small Stories II, Herrmann, Paris, 2022, pp. 43–62.

Design Decisions in the Architecture Development of Advanced Systems: Towards traceable and sustainable Documentation and Communication
S. Pfeifer, D. Akgül, S. Röbenack, A. Tihlarik, B. Albert, H. Anacker, R. Dumitrescu, in: N.H. Mortensen, C.T. Hansen, M. Deininger (Eds.), DS 118: Proceedings of NordDesign 2022, The Design Society, 2022.

Design of an optimised value creation network for zero emission ferries
J.-P. Disselkamp, T. Seidenberg, H. Anacker, R. Dumitrescu, in: Proceedings of the IEEE, 2022.

Knowledge-based Interactive Configuration Tool for Industrial Augmented Reality Systems
D. Eckertz, H. Anacker, R. Dumitrescu, in: Proceedings of the 5th International Conference on Information and Computer Technologies (ICICT), IEEE, 2022.

Towards a Process Model to Enable Domain Experts to Become Citizen Data Scientists for Industrial Applications
S. Merkelbach, S. von Enzberg, A. Kuhn, R. Dumitrescu, in: Proceedings of the IEEE, IEEE, 2022.

Systematics for the individual assessment of augmented reality potentials to support product validation
D. Eckertz, H. Anacker, R. Dumitrescu, in: Proceedings of NordDesign 2022, The Design Society, 2022.

Implementation of Systems Engineering: A maturity-based approach
D. Wilke, S. Pfeifer, R. Heitmann, H. Anacker, R. Dumitrescu, V. Franke, in: Proceedings of the IEEE ISSE , n.d.

Experimentelle Untersuchung des Ermüdungsverhaltens und Berechnung der Lebensdauer von Stahlklebverbindungen bei multiaxialer Belastung
K. Tews, D. Teutenberg, G. Meschut, in: 2022.

Fridolin-Duck Karotti. Mit einem kollaborativen Schreibtool gemeinsam Fantasiere beschreiben
S. Rezat, O. Scholle, S. Bendner, Praxis Deutsch 292 (2022) 22–26.

Improved output gap estimates and forecasts using a local linear regression
M. Fritz, International Economics 172 (2022) 157–167.

Digital lesen und schreiben. Basisbeitrag
S. Rezat, Praxis Deutsch (2022) 4–13.

Second-harmonic generation in atomically thin <mml:math xmlns:mml="http://www..org/1998/Math/MathML"><mml:mn>1</mml:mn><mml:mi>T</mml:mi><mml:mtext></mml:mtext><mml:mi>Ti</mml:mi><mml:msub><mml:mrow><mml:mi>Se</mml:mi></mml:mrow><mml:mn>2</mml:mn></mml:msub></mml:math> and its possible origin from charge density wave transitions
R. Zhang, W. Ruan, J. Yu, L. Gao, H. Berger, L. Forró, K. Watanabe, T. Taniguchi, A. Ranjbar, R.V. Belosludov, T. Kühne, M.S. Bahramy, X. Xi, Physical Review B 105 (2022).

Electronic Structures of Group III–V Element Haeckelite Compounds: A Novel Family of Semiconductors, Dirac Semimetals, and Topological Insulators
M. Khazaei, A. Ranjbar, Y. Kang, Y. Liang, R. Khaledialidusti, S. Bae, H. Raebiger, V. Wang, M.J. Han, H. Mizoguchi, M.S. Bahramy, T. Kühne, R.V. Belosludov, K. Ohno, H. Hosono, Advanced Functional Materials 32 (2022).

Real-Space Identification of Non-Noble Single Atomic Catalytic Sites within Metal-Coordinated Supramolecular Networks
B. Schulze Lammers, N. López-Salas, J. Stein Siena, H. Mirhosseini, D. Yesilpinar, J.J. Heske, T. Kühne, H. Fuchs, M. Antonietti, H. Mönig, ACS Nano 16 (2022) 14284–14296.

On the Role of Hydrogen Bond Strength and Charge Transfer of a Diels-Alder Reaction On-Water: Semiempirical and Free Energy Calculations.
A. Henao Aristizabal, Y. Gohar, R. Whilhelm, T. Kühne, (2022).

CEN: Improved charge equilibration via neural network technique
E.R. Khajehpasha, J.A. Finkler, T. Kühne, A. Ghasemi, Physical Review B 105 (2022).

Surface Passivation and Detrimental Heat-Induced Diffusion Effects in RbF-Treated Cu(In,Ga)Se<sub>2</sub> Solar Cell Absorbers
A. Elizabeth, S.K. Sahoo, H. Phirke, T. Kodalle, T. Kühne, J.-N. Audinot, T. Wirtz, A. Redinger, C.A. Kaufmann, H. Mirhosseini, H. Mönig, ACS Applied Materials &;amp; Interfaces 14 (2022) 34101–34112.

Fingerprints Indicating Superior Properties of Internal Interfaces in Cu(In,Ga)Se            <sub>2</sub>            ThinFilm Solar Cells
M. Raghuwanshi, M. Chugh, G. Sozzi, A. Kanevce, T. Kühne, H. Mirhosseini, R. Wuerz, O. CojocaruMirédin, Advanced Materials 34 (2022).