[{"place":"Florence, Italy","year":"2019","citation":{"apa":"Bringmann, O., Ecker, W., Müller, W., &#38; Müller-Gridschneder, D. (Eds.). (2019). <i>Proceedings of the 2nd International Workshop on Embedded Software for Industrial IoT - ESIIT</i>.","mla":"Bringmann, Oliver, et al., editors. <i>Proceedings of the 2nd International Workshop on Embedded Software for Industrial IoT - ESIIT</i>. 2019.","short":"O. Bringmann, W. Ecker, W. Müller, D. Müller-Gridschneder, eds., Proceedings of the 2nd International Workshop on Embedded Software for Industrial IoT - ESIIT, Florence, Italy, 2019.","bibtex":"@book{Bringmann_Ecker_Müller_Müller-Gridschneder_2019, place={Florence, Italy}, title={Proceedings of the 2nd International Workshop on Embedded Software for Industrial IoT - ESIIT}, year={2019} }","ama":"Bringmann O, Ecker W, Müller W, Müller-Gridschneder D, eds. <i>Proceedings of the 2nd International Workshop on Embedded Software for Industrial IoT - ESIIT</i>.; 2019.","chicago":"Bringmann, Oliver, Wolfgang Ecker, Wolfgang Müller, and Daniel Müller-Gridschneder, eds. <i>Proceedings of the 2nd International Workshop on Embedded Software for Industrial IoT - ESIIT</i>. Florence, Italy, 2019.","ieee":"O. Bringmann, W. Ecker, W. Müller, and D. Müller-Gridschneder, Eds., <i>Proceedings of the 2nd International Workshop on Embedded Software for Industrial IoT - ESIIT</i>. Florence, Italy, 2019."},"date_updated":"2024-04-18T22:09:33Z","date_created":"2024-04-18T22:09:26Z","title":"Proceedings of the 2nd International Workshop on Embedded Software for Industrial IoT - ESIIT","type":"book_editor","editor":[{"first_name":"Oliver","full_name":"Bringmann, Oliver","last_name":"Bringmann"},{"last_name":"Ecker","full_name":"Ecker, Wolfgang","first_name":"Wolfgang"},{"last_name":"Müller","id":"16243","full_name":"Müller, Wolfgang","first_name":"Wolfgang"},{"last_name":"Müller-Gridschneder","full_name":"Müller-Gridschneder, Daniel","first_name":"Daniel"}],"status":"public","_id":"53596","department":[{"_id":"58"}],"user_id":"16243","language":[{"iso":"eng"}]},{"related_material":{"link":[{"url":"https://www.edacentrum.de/compact/current-and-future-risc-v-activities-virtual-prototyping-and-chip-design","relation":"confirmation"}]},"year":"2018","citation":{"chicago":"Adelt, Peer, Bastian Koppelmann, and Wolfgang Müller. “Current and Future RISC-V Activities for Virtual Prototyping and Chip Design.” <i>International Workshop on RISC-V Research Activities</i> Presentation (2018).","ieee":"P. Adelt, B. Koppelmann, and W. Müller, “Current and Future RISC-V Activities for Virtual Prototyping and Chip Design,” <i>International Workshop on RISC-V Research Activities</i>, vol. Presentation, 2018.","ama":"Adelt P, Koppelmann B, Müller W. Current and Future RISC-V Activities for Virtual Prototyping and Chip Design. <i>International Workshop on RISC-V Research Activities</i>. 2018;Presentation.","apa":"Adelt, P., Koppelmann, B., &#38; Müller, W. (2018). Current and Future RISC-V Activities for Virtual Prototyping and Chip Design. <i>International Workshop on RISC-V Research Activities</i>, <i>Presentation</i>.","bibtex":"@article{Adelt_Koppelmann_Müller_2018, title={Current and Future RISC-V Activities for Virtual Prototyping and Chip Design}, volume={Presentation}, journal={International Workshop on RISC-V Research Activities}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang}, year={2018} }","mla":"Adelt, Peer, et al. “Current and Future RISC-V Activities for Virtual Prototyping and Chip Design.” <i>International Workshop on RISC-V Research Activities</i>, vol. Presentation, 2018.","short":"P. Adelt, B. Koppelmann, W. Müller, International Workshop on RISC-V Research Activities Presentation (2018)."},"date_updated":"2022-01-06T06:56:09Z","date_created":"2021-09-13T07:38:01Z","author":[{"first_name":"Peer","last_name":"Adelt","id":"5603","full_name":"Adelt, Peer"},{"last_name":"Koppelmann","id":"25260","full_name":"Koppelmann, Bastian","first_name":"Bastian"},{"first_name":"Wolfgang","id":"16243","full_name":"Müller, Wolfgang","last_name":"Müller"}],"volume":"Presentation","title":"Current and Future RISC-V Activities for Virtual Prototyping and Chip Design","conference":{"location":"Munich, DE"},"type":"journal_article","publication":"International Workshop on RISC-V Research Activities","status":"public","_id":"24194","user_id":"15931","department":[{"_id":"58"}],"language":[{"iso":"eng"}]},{"date_updated":"2022-01-06T06:56:09Z","publisher":"IEEE","date_created":"2021-09-13T07:38:03Z","author":[{"full_name":"Wu, Liang","id":"30401","last_name":"Wu","first_name":"Liang"},{"last_name":"Hussain","full_name":"Hussain, Mohammad Khizer","first_name":"Mohammad Khizer"},{"first_name":"Saed","last_name":"Abughannam","id":"37628","full_name":"Abughannam, Saed"},{"last_name":"Müller","id":"16243","full_name":"Müller, Wolfgang","first_name":"Wolfgang"},{"full_name":"Scheytt, Christoph","id":"37144","last_name":"Scheytt","first_name":"Christoph"},{"first_name":"Wolfgang","full_name":"Ecker, Wolfgang","last_name":"Ecker"}],"title":"Analog fault simulation automation at schematic level with random sampling techniques","conference":{"end_date":"2018.04.12","start_date":"2018.04.09"},"doi":"10.1109/DTIS.2018.8368549","related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/8368549"}]},"year":"2018","place":"Italy/Taormina","citation":{"ama":"Wu L, Hussain MK, Abughannam S, Müller W, Scheytt C, Ecker W. Analog fault simulation automation at schematic level with random sampling techniques. In: <i>2018 13th International Conference on Design &#38; Technology of Integrated Systems In Nanoscale Era (DTIS)) </i>. IEEE; 2018. doi:<a href=\"https://doi.org/10.1109/DTIS.2018.8368549\">10.1109/DTIS.2018.8368549</a>","ieee":"L. Wu, M. K. Hussain, S. Abughannam, W. Müller, C. Scheytt, and W. Ecker, “Analog fault simulation automation at schematic level with random sampling techniques,” 2018, doi: <a href=\"https://doi.org/10.1109/DTIS.2018.8368549\">10.1109/DTIS.2018.8368549</a>.","chicago":"Wu, Liang, Mohammad Khizer Hussain, Saed Abughannam, Wolfgang Müller, Christoph Scheytt, and Wolfgang Ecker. “Analog Fault Simulation Automation at Schematic Level with Random Sampling Techniques.” In <i>2018 13th International Conference on Design &#38; Technology of Integrated Systems In Nanoscale Era (DTIS)) </i>. Italy/Taormina: IEEE, 2018. <a href=\"https://doi.org/10.1109/DTIS.2018.8368549\">https://doi.org/10.1109/DTIS.2018.8368549</a>.","mla":"Wu, Liang, et al. “Analog Fault Simulation Automation at Schematic Level with Random Sampling Techniques.” <i>2018 13th International Conference on Design &#38; Technology of Integrated Systems In Nanoscale Era (DTIS)) </i>, IEEE, 2018, doi:<a href=\"https://doi.org/10.1109/DTIS.2018.8368549\">10.1109/DTIS.2018.8368549</a>.","bibtex":"@inproceedings{Wu_Hussain_Abughannam_Müller_Scheytt_Ecker_2018, place={Italy/Taormina}, title={Analog fault simulation automation at schematic level with random sampling techniques}, DOI={<a href=\"https://doi.org/10.1109/DTIS.2018.8368549\">10.1109/DTIS.2018.8368549</a>}, booktitle={2018 13th International Conference on Design &#38; Technology of Integrated Systems In Nanoscale Era (DTIS)) }, publisher={IEEE}, author={Wu, Liang and Hussain, Mohammad Khizer and Abughannam, Saed and Müller, Wolfgang and Scheytt, Christoph and Ecker, Wolfgang}, year={2018} }","short":"L. Wu, M.K. Hussain, S. Abughannam, W. Müller, C. Scheytt, W. Ecker, in: 2018 13th International Conference on Design &#38; Technology of Integrated Systems In Nanoscale Era (DTIS)) , IEEE, Italy/Taormina, 2018.","apa":"Wu, L., Hussain, M. K., Abughannam, S., Müller, W., Scheytt, C., &#38; Ecker, W. (2018). Analog fault simulation automation at schematic level with random sampling techniques. <i>2018 13th International Conference on Design &#38; Technology of Integrated Systems In Nanoscale Era (DTIS)) </i>. <a href=\"https://doi.org/10.1109/DTIS.2018.8368549\">https://doi.org/10.1109/DTIS.2018.8368549</a>"},"_id":"24196","user_id":"15931","department":[{"_id":"58"}],"language":[{"iso":"eng"}],"type":"conference","publication":"2018 13th International Conference on Design & Technology of Integrated Systems In Nanoscale Era (DTIS)) ","abstract":[{"lang":"eng","text":"This paper presents an approach for analog fault effect simulation automation based on random fault selection with a high fault coverage of the circuit under test by means of fault injection and simulation based on advanced sampling techniques. The random fault selection utilizes the likelihood of the fault occurrence of different electrical components in the circuit with a confidence level. Defect models of different devices are analyzed for the calculation of the fault probability. A case study with our implemented tool demonstrates that likelihood calculation and fault simulation provides means for efficient fault effect simulation automation."}],"status":"public"},{"year":"2018","place":"Dresden, Germany","citation":{"apa":"Bringmann, O., Ecker, W., Müller, W., &#38; Müller-Gridschneder, D. (Eds.). (2018). <i>Proceedings of the 1st International Workshop on Embedded Software for Industrial IoT - ESIIT</i>.","mla":"Bringmann, Oliver, et al., editors. <i>Proceedings of the 1st International Workshop on Embedded Software for Industrial IoT - ESIIT</i>. 2018.","bibtex":"@book{Bringmann_Ecker_Müller_Müller-Gridschneder_2018, place={Dresden, Germany}, title={Proceedings of the 1st International Workshop on Embedded Software for Industrial IoT - ESIIT}, year={2018} }","short":"O. Bringmann, W. Ecker, W. Müller, D. Müller-Gridschneder, eds., Proceedings of the 1st International Workshop on Embedded Software for Industrial IoT - ESIIT, Dresden, Germany, 2018.","ama":"Bringmann O, Ecker W, Müller W, Müller-Gridschneder D, eds. <i>Proceedings of the 1st International Workshop on Embedded Software for Industrial IoT - ESIIT</i>.; 2018.","ieee":"O. Bringmann, W. Ecker, W. Müller, and D. Müller-Gridschneder, Eds., <i>Proceedings of the 1st International Workshop on Embedded Software for Industrial IoT - ESIIT</i>. Dresden, Germany, 2018.","chicago":"Bringmann, Oliver, Wolfgang Ecker, Wolfgang Müller, and Daniel Müller-Gridschneder, eds. <i>Proceedings of the 1st International Workshop on Embedded Software for Industrial IoT - ESIIT</i>. Dresden, Germany, 2018."},"title":"Proceedings of the 1st International Workshop on Embedded Software for Industrial IoT - ESIIT","date_updated":"2024-04-18T22:05:33Z","date_created":"2024-04-18T22:03:47Z","editor":[{"first_name":"Oliver","full_name":"Bringmann, Oliver","last_name":"Bringmann"},{"full_name":"Ecker, Wolfgang","last_name":"Ecker","first_name":"Wolfgang"},{"first_name":"Wolfgang","last_name":"Müller","full_name":"Müller, Wolfgang","id":"16243"},{"first_name":"Daniel","last_name":"Müller-Gridschneder","full_name":"Müller-Gridschneder, Daniel"}],"status":"public","type":"book_editor","language":[{"iso":"eng"}],"_id":"53595","user_id":"16243","department":[{"_id":"58"}]},{"language":[{"iso":"ger"}],"department":[{"_id":"58"}],"user_id":"15931","_id":"24220","status":"public","publication":"Tagungsband des Wissenschaftsforums Intelligente Technische Systeme","type":"conference","doi":"10.17619/UNIPB/1-93","title":"Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen","date_created":"2021-09-13T08:20:35Z","author":[{"first_name":"Peer","last_name":"Adelt","id":"5603","full_name":"Adelt, Peer"},{"last_name":"Koppelmann","id":"25260","full_name":"Koppelmann, Bastian","first_name":"Bastian"},{"full_name":"Müller, Wolfgang","id":"16243","last_name":"Müller","first_name":"Wolfgang"},{"first_name":"Daniel","full_name":"Mueller-Gritschneder, Daniel","last_name":"Mueller-Gritschneder"},{"full_name":"Kleinjohann, Bernd","last_name":"Kleinjohann","first_name":"Bernd"},{"last_name":"Scheytt","id":"37144","full_name":"Scheytt, Christoph","first_name":"Christoph"}],"publisher":"Verlagsschriftenreihe des Heinz Nixdorf Instituts","date_updated":"2022-01-06T06:56:13Z","citation":{"bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Mueller-Gritschneder_Kleinjohann_Scheytt_2017, place={Germany, Paderborn}, title={Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen}, DOI={<a href=\"https://doi.org/10.17619/UNIPB/1-93\">10.17619/UNIPB/1-93</a>}, booktitle={Tagungsband des Wissenschaftsforums Intelligente Technische Systeme}, publisher={Verlagsschriftenreihe des Heinz Nixdorf Instituts}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Mueller-Gritschneder, Daniel and Kleinjohann, Bernd and Scheytt, Christoph}, year={2017} }","mla":"Adelt, Peer, et al. “Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen.” <i>Tagungsband des Wissenschaftsforums Intelligente Technische Systeme</i>, Verlagsschriftenreihe des Heinz Nixdorf Instituts, 2017, doi:<a href=\"https://doi.org/10.17619/UNIPB/1-93\">10.17619/UNIPB/1-93</a>.","short":"P. Adelt, B. Koppelmann, W. Müller, D. Mueller-Gritschneder, B. Kleinjohann, C. Scheytt, in: Tagungsband des Wissenschaftsforums Intelligente Technische Systeme, Verlagsschriftenreihe des Heinz Nixdorf Instituts, Germany, Paderborn, 2017.","apa":"Adelt, P., Koppelmann, B., Müller, W., Mueller-Gritschneder, D., Kleinjohann, B., &#38; Scheytt, C. (2017). Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen. <i>Tagungsband des Wissenschaftsforums Intelligente Technische Systeme</i>. <a href=\"https://doi.org/10.17619/UNIPB/1-93\">https://doi.org/10.17619/UNIPB/1-93</a>","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Daniel Mueller-Gritschneder, Bernd Kleinjohann, and Christoph Scheytt. “Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen.” In <i>Tagungsband des Wissenschaftsforums Intelligente Technische Systeme</i>. Germany, Paderborn: Verlagsschriftenreihe des Heinz Nixdorf Instituts, 2017. <a href=\"https://doi.org/10.17619/UNIPB/1-93\">https://doi.org/10.17619/UNIPB/1-93</a>.","ieee":"P. Adelt, B. Koppelmann, W. Müller, D. Mueller-Gritschneder, B. Kleinjohann, and C. Scheytt, “Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen,” 2017, doi: <a href=\"https://doi.org/10.17619/UNIPB/1-93\">10.17619/UNIPB/1-93</a>.","ama":"Adelt P, Koppelmann B, Müller W, Mueller-Gritschneder D, Kleinjohann B, Scheytt C. Automatisierte Fehlerinjektion zur Entwicklung sicherer Mikrocontrolleranwendungen auf der Basis virtueller Plattformen. In: <i>Tagungsband des Wissenschaftsforums Intelligente Technische Systeme</i>. Verlagsschriftenreihe des Heinz Nixdorf Instituts; 2017. doi:<a href=\"https://doi.org/10.17619/UNIPB/1-93\">10.17619/UNIPB/1-93</a>"},"place":"Germany, Paderborn","year":"2017","related_material":{"link":[{"url":"https://digital.ub.uni-paderborn.de/hs/content/titleinfo/2436759","relation":"confirmation"}]},"publication_identifier":{"isbn":["978-3-942647-88-5"]},"publication_status":"published"},{"publication":"2nd Workshop on Resiliency in Embedded Electronic Systems (REES)","type":"conference","status":"public","abstract":[{"lang":"eng","text":"This paper presents the design flow of using \r\nsampling technique for fault injection on sche-\r\nmatic level. The parameters used in the docu-\r\nment to calculate the likelihood could be modi-\r\nfied by using more realistic data from the fab. \r\nWith the help of the fault simulator, the whole \r\ndesign flow of the fault effect simulation can be \r\nrealized automatically."}],"department":[{"_id":"58"}],"user_id":"15931","_id":"24223","language":[{"iso":"eng"}],"related_material":{"link":[{"url":"https://past.date-conference.com/date17/conference/workshop-w05","relation":"confirmation"}]},"page":"68","citation":{"apa":"Wu, L., Abughannam, S., Müller, W., Scheytt, C., &#38; Ecker, W. (2017). SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 68.","mla":"Wu, Liang, et al. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 2017, p. 68.","short":"L. Wu, S. Abughannam, W. Müller, C. Scheytt, W. Ecker, in: 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), Lausanne, Switzerland, 2017, p. 68.","bibtex":"@inproceedings{Wu_Abughannam_Müller_Scheytt_Ecker_2017, place={Lausanne, Switzerland}, title={SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study}, booktitle={2nd Workshop on Resiliency in Embedded Electronic Systems (REES)}, author={Wu, Liang and Abughannam, Saed and Müller, Wolfgang and Scheytt, Christoph and Ecker, Wolfgang}, year={2017}, pages={68} }","ama":"Wu L, Abughannam S, Müller W, Scheytt C, Ecker W. SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. In: <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>. ; 2017:68.","chicago":"Wu, Liang, Saed Abughannam, Wolfgang Müller, Christoph Scheytt, and Wolfgang Ecker. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” In <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 68. Lausanne, Switzerland, 2017.","ieee":"L. Wu, S. Abughannam, W. Müller, C. Scheytt, and W. Ecker, “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study,” in <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 2017, p. 68."},"year":"2017","place":"Lausanne, Switzerland","date_created":"2021-09-13T08:20:39Z","author":[{"full_name":"Wu, Liang","id":"30401","last_name":"Wu","first_name":"Liang"},{"full_name":"Abughannam, Saed","id":"37628","last_name":"Abughannam","first_name":"Saed"},{"last_name":"Müller","full_name":"Müller, Wolfgang","id":"16243","first_name":"Wolfgang"},{"first_name":"Christoph","last_name":"Scheytt","id":"37144","full_name":"Scheytt, Christoph"},{"full_name":"Ecker, Wolfgang","last_name":"Ecker","first_name":"Wolfgang"}],"date_updated":"2022-01-06T06:56:13Z","title":"SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study"},{"place":"Lausanne, CH","year":"2017","citation":{"mla":"Adelt, Peer, et al. “ANALISA - A Tool for Static Instruction Set Analysis.” <i>Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation</i>, 2017.","short":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, C. Scheytt, in: Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation, Lausanne, CH, 2017.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Kleinjohann_Scheytt_2017, place={Lausanne, CH}, title={ANALISA - A Tool for Static Instruction Set Analysis}, booktitle={Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Kleinjohann, Bernd and Scheytt, Christoph}, year={2017} }","apa":"Adelt, P., Koppelmann, B., Müller, W., Kleinjohann, B., &#38; Scheytt, C. (2017). ANALISA - A Tool for Static Instruction Set Analysis. <i>Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation</i>.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Bernd Kleinjohann, and Christoph Scheytt. “ANALISA - A Tool for Static Instruction Set Analysis.” In <i>Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation</i>. Lausanne, CH, 2017.","ieee":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, and C. Scheytt, “ANALISA - A Tool for Static Instruction Set Analysis,” 2017.","ama":"Adelt P, Koppelmann B, Müller W, Kleinjohann B, Scheytt C. ANALISA - A Tool for Static Instruction Set Analysis. In: <i>Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation</i>. ; 2017."},"related_material":{"link":[{"url":"https://www.date-conference.com/content/date-2017-call-papers","relation":"confirmation"}]},"title":"ANALISA - A Tool for Static Instruction Set Analysis","conference":{"start_date":"2017.03.27","end_date":"2017.03.31"},"date_updated":"2022-01-06T06:56:13Z","author":[{"id":"5603","full_name":"Adelt, Peer","last_name":"Adelt","first_name":"Peer"},{"last_name":"Koppelmann","full_name":"Koppelmann, Bastian","id":"25260","first_name":"Bastian"},{"first_name":"Wolfgang","last_name":"Müller","id":"16243","full_name":"Müller, Wolfgang"},{"first_name":"Bernd","full_name":"Kleinjohann, Bernd","last_name":"Kleinjohann"},{"first_name":"Christoph","id":"37144","full_name":"Scheytt, Christoph","last_name":"Scheytt"}],"date_created":"2021-09-13T08:20:40Z","status":"public","type":"conference","publication":"Design Automation and Testing in Europe (DATE), University Booth Interactive Presentation","language":[{"iso":"eng"}],"_id":"24224","user_id":"15931","department":[{"_id":"58"}]},{"related_material":{"link":[{"url":"https://www.edacentrum.de/rees/program","relation":"confirmation"}]},"page":"44","citation":{"apa":"Adelt, P., Koppelmann, B., Müller, W., Kleinjohann, B., &#38; Scheytt, C. (2017). An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries. <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>, 44.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Kleinjohann_Scheytt_2017, place={Lausanne, Switzerland}, title={An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries}, booktitle={2nd Workshop on Resiliency in Embedded Electronic Systems (REES) }, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Kleinjohann, Bernd and Scheytt, Christoph}, year={2017}, pages={44} }","mla":"Adelt, Peer, et al. “An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries.” <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>, 2017, p. 44.","short":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, C. Scheytt, in: 2nd Workshop on Resiliency in Embedded Electronic Systems (REES) , Lausanne, Switzerland, 2017, p. 44.","ama":"Adelt P, Koppelmann B, Müller W, Kleinjohann B, Scheytt C. An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries. In: <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>. ; 2017:44.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Bernd Kleinjohann, and Christoph Scheytt. “An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries.” In <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>, 44. Lausanne, Switzerland, 2017.","ieee":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, and C. Scheytt, “An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries,” in <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES) </i>, 2017, p. 44."},"place":"Lausanne, Switzerland","year":"2017","date_created":"2021-09-13T08:20:41Z","author":[{"first_name":"Peer","full_name":"Adelt, Peer","id":"5603","last_name":"Adelt"},{"full_name":"Koppelmann, Bastian","id":"25260","last_name":"Koppelmann","first_name":"Bastian"},{"id":"16243","full_name":"Müller, Wolfgang","last_name":"Müller","first_name":"Wolfgang"},{"first_name":"Bernd","full_name":"Kleinjohann, Bernd","last_name":"Kleinjohann"},{"last_name":"Scheytt","full_name":"Scheytt, Christoph","id":"37144","first_name":"Christoph"}],"date_updated":"2022-01-06T06:56:13Z","title":"An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries","publication":"2nd Workshop on Resiliency in Embedded Electronic Systems (REES) ","type":"conference","status":"public","department":[{"_id":"58"}],"user_id":"15931","_id":"24225","language":[{"iso":"eng"}]},{"year":"2017","citation":{"apa":"Adelt, P., Koppelmann, B., Müller, W., Kleinjohann, B., &#38; Scheytt, J. C. (2017). ANALISA - A Tool for Static Instruction Set Analysis. In University Booth Interactive Presentation (Ed.), <i>Design Automation and Testing in Europe (DATE)</i>.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Kleinjohann_Scheytt_2017, title={ANALISA - A Tool for Static Instruction Set Analysis}, booktitle={Design Automation and Testing in Europe (DATE)}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Kleinjohann, Bernd and Scheytt, J. Christoph}, editor={University Booth Interactive Presentation}, year={2017} }","short":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, J.C. Scheytt, in: University Booth Interactive Presentation (Ed.), Design Automation and Testing in Europe (DATE), 2017.","mla":"Adelt, Peer, et al. “ANALISA - A Tool for Static Instruction Set Analysis.” <i>Design Automation and Testing in Europe (DATE)</i>, edited by University Booth Interactive Presentation, 2017.","ama":"Adelt P, Koppelmann B, Müller W, Kleinjohann B, Scheytt JC. ANALISA - A Tool for Static Instruction Set Analysis. In: University Booth Interactive Presentation, ed. <i>Design Automation and Testing in Europe (DATE)</i>. ; 2017.","ieee":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, and J. C. Scheytt, “ANALISA - A Tool for Static Instruction Set Analysis,” in <i>Design Automation and Testing in Europe (DATE)</i>, Lausanne, CH, Mrz. 2017, 2017.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Bernd Kleinjohann, and J. Christoph Scheytt. “ANALISA - A Tool for Static Instruction Set Analysis.” In <i>Design Automation and Testing in Europe (DATE)</i>, edited by University Booth Interactive Presentation, 2017."},"corporate_editor":["University Booth Interactive Presentation"],"title":"ANALISA - A Tool for Static Instruction Set Analysis","conference":{"location":"Lausanne, CH, Mrz. 2017"},"date_updated":"2025-02-26T14:45:09Z","date_created":"2021-09-28T11:08:16Z","author":[{"first_name":"Peer","last_name":"Adelt","full_name":"Adelt, Peer","id":"5603"},{"first_name":"Bastian","id":"25260","full_name":"Koppelmann, Bastian","last_name":"Koppelmann"},{"first_name":"Wolfgang","last_name":"Müller","full_name":"Müller, Wolfgang","id":"16243"},{"last_name":"Kleinjohann","full_name":"Kleinjohann, Bernd","first_name":"Bernd"},{"first_name":"J. Christoph","orcid":"0000-0002-5950-6618 ","last_name":"Scheytt","full_name":"Scheytt, J. Christoph","id":"37144"}],"status":"public","type":"conference","publication":"Design Automation and Testing in Europe (DATE)","language":[{"iso":"eng"}],"_id":"25068","user_id":"5603","department":[{"_id":"70"}]},{"year":"2017","corporate_editor":["University Booth Interactive Presentation"],"citation":{"ama":"Adelt P, Koppelmann B, Müller W, Kleinjohann B, Scheytt JC. ANALISA - A Tool for Static Instruction Set Analysis. In: University Booth Interactive Presentation, ed. <i>Design Automation and Testing in Europe (DATE)</i>. ; 2017.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Bernd Kleinjohann, and J. Christoph Scheytt. “ANALISA - A Tool for Static Instruction Set Analysis.” In <i>Design Automation and Testing in Europe (DATE)</i>, edited by University Booth Interactive Presentation, 2017.","ieee":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, and J. C. Scheytt, “ANALISA - A Tool for Static Instruction Set Analysis,” in <i>Design Automation and Testing in Europe (DATE)</i>, Lausanne, CH, Mrz. 2017, 2017.","apa":"Adelt, P., Koppelmann, B., Müller, W., Kleinjohann, B., &#38; Scheytt, J. C. (2017). ANALISA - A Tool for Static Instruction Set Analysis. In University Booth Interactive Presentation (Ed.), <i>Design Automation and Testing in Europe (DATE)</i>.","mla":"Adelt, Peer, et al. “ANALISA - A Tool for Static Instruction Set Analysis.” <i>Design Automation and Testing in Europe (DATE)</i>, edited by University Booth Interactive Presentation, 2017.","short":"P. Adelt, B. Koppelmann, W. Müller, B. Kleinjohann, J.C. Scheytt, in: University Booth Interactive Presentation (Ed.), Design Automation and Testing in Europe (DATE), 2017.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Kleinjohann_Scheytt_2017, title={ANALISA - A Tool for Static Instruction Set Analysis}, booktitle={Design Automation and Testing in Europe (DATE)}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Kleinjohann, Bernd and Scheytt, J. Christoph}, editor={University Booth Interactive Presentation}, year={2017} }"},"title":"ANALISA - A Tool for Static Instruction Set Analysis","conference":{"location":"Lausanne, CH, Mrz. 2017"},"date_updated":"2025-02-26T14:45:23Z","author":[{"id":"5603","full_name":"Adelt, Peer","last_name":"Adelt","first_name":"Peer"},{"first_name":"Bastian","id":"25260","full_name":"Koppelmann, Bastian","last_name":"Koppelmann"},{"id":"16243","full_name":"Müller, Wolfgang","last_name":"Müller","first_name":"Wolfgang"},{"first_name":"Bernd","last_name":"Kleinjohann","full_name":"Kleinjohann, Bernd"},{"last_name":"Scheytt","orcid":"0000-0002-5950-6618 ","id":"37144","full_name":"Scheytt, J. Christoph","first_name":"J. Christoph"}],"date_created":"2021-09-28T11:12:00Z","status":"public","publication":"Design Automation and Testing in Europe (DATE)","type":"conference","language":[{"iso":"eng"}],"_id":"25069","department":[{"_id":"672"}],"user_id":"5603"},{"publication":"Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)","type":"conference","abstract":[{"text":"Electronic systems, like they are embedded in road vehicles, have to be compliant to functional safety standards like ISO 26262 [1], which limit the impacts of malfunctions for safety critical systems. ISO 26262, for instance, defines different safety levels for road vehicles, which require different means and measures for a safety compliant system and its development process like risk analysis and fault effect simulation. For fault effect simulation it is important to investigate the impact of physical and hardware related effects to the correct function of a system. This article first studies code and model mutations for fault injection in the context of fault effect simulation through different system abstraction levels. It demonstrates how high level mutations correlate to bit flips of software binaries by examples from the TriCore™ instruction set and finally presents a virtual platform based implementation for automated injection of bit flip based mutations into software binaries. Experimental results demonstrate the efficiency of the implemented approach.","lang":"eng"}],"status":"public","_id":"24264","department":[{"_id":"58"}],"user_id":"15931","language":[{"iso":"eng"}],"publication_identifier":{"eissn":["2324-8440"]},"related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/7753545"}]},"place":"Tallin, Estonia","year":"2016","citation":{"mla":"Adelt, Peer, et al. “Fast Dynamic Fault Injection for Virtual Microcontroller Platforms.” <i>Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)</i>, 2016, doi:<a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">10.1109/VLSI-SoC.2016.7753545</a>.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Becker_Kleinjohann_Scheytt_2016, place={Tallin, Estonia}, title={Fast Dynamic Fault Injection for Virtual Microcontroller Platforms}, DOI={<a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">10.1109/VLSI-SoC.2016.7753545</a>}, booktitle={Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Becker, Markus and Kleinjohann, Bernd and Scheytt, Christoph}, year={2016} }","short":"P. Adelt, B. Koppelmann, W. Müller, M. Becker, B. Kleinjohann, C. Scheytt, in: Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC), Tallin, Estonia, 2016.","apa":"Adelt, P., Koppelmann, B., Müller, W., Becker, M., Kleinjohann, B., &#38; Scheytt, C. (2016). Fast Dynamic Fault Injection for Virtual Microcontroller Platforms. <i>Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)</i>. <a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">https://doi.org/10.1109/VLSI-SoC.2016.7753545</a>","ieee":"P. Adelt, B. Koppelmann, W. Müller, M. Becker, B. Kleinjohann, and C. Scheytt, “Fast Dynamic Fault Injection for Virtual Microcontroller Platforms,” 2016, doi: <a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">10.1109/VLSI-SoC.2016.7753545</a>.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Markus Becker, Bernd Kleinjohann, and Christoph Scheytt. “Fast Dynamic Fault Injection for Virtual Microcontroller Platforms.” In <i>Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)</i>. Tallin, Estonia, 2016. <a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">https://doi.org/10.1109/VLSI-SoC.2016.7753545</a>.","ama":"Adelt P, Koppelmann B, Müller W, Becker M, Kleinjohann B, Scheytt C. Fast Dynamic Fault Injection for Virtual Microcontroller Platforms. In: <i>Proceedings of the IEEE/IFIP International Conference on VLSI (VLSI-SOC)</i>. ; 2016. doi:<a href=\"https://doi.org/10.1109/VLSI-SoC.2016.7753545\">10.1109/VLSI-SoC.2016.7753545</a>"},"date_updated":"2022-02-17T13:57:45Z","author":[{"first_name":"Peer","last_name":"Adelt","id":"5603","full_name":"Adelt, Peer"},{"first_name":"Bastian","last_name":"Koppelmann","full_name":"Koppelmann, Bastian","id":"25260"},{"id":"16243","full_name":"Müller, Wolfgang","last_name":"Müller","first_name":"Wolfgang"},{"full_name":"Becker, Markus","last_name":"Becker","first_name":"Markus"},{"last_name":"Kleinjohann","full_name":"Kleinjohann, Bernd","first_name":"Bernd"},{"last_name":"Scheytt","id":"37144","full_name":"Scheytt, Christoph","first_name":"Christoph"}],"date_created":"2021-09-13T09:44:30Z","title":"Fast Dynamic Fault Injection for Virtual Microcontroller Platforms","doi":"10.1109/VLSI-SoC.2016.7753545","conference":{"end_date":"2016.09.28","start_date":"2016.09.26"}},{"related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/7584296/"}]},"publication_identifier":{"isbn":["978-3-8007-4265-3"]},"citation":{"ama":"Abughannam S, Wu L, Müller W, Scheytt C, Ecker W, Novello C. Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study. In: <i>Analog 2016 - VDE</i>. ; 2016.","ieee":"S. Abughannam, L. Wu, W. Müller, C. Scheytt, W. Ecker, and C. Novello, “Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study,” 2016.","chicago":"Abughannam, Saed, Liang Wu, Wolfgang Müller, Christoph Scheytt, Wolfgang Ecker, and Christiano Novello. “Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study.” In <i>Analog 2016 - VDE</i>, 2016.","apa":"Abughannam, S., Wu, L., Müller, W., Scheytt, C., Ecker, W., &#38; Novello, C. (2016). Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study. <i>Analog 2016 - VDE</i>.","bibtex":"@inproceedings{Abughannam_Wu_Müller_Scheytt_Ecker_Novello_2016, title={Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study}, booktitle={Analog 2016 - VDE}, author={Abughannam, Saed and Wu, Liang and Müller, Wolfgang and Scheytt, Christoph and Ecker, Wolfgang and Novello, Christiano}, year={2016} }","short":"S. Abughannam, L. Wu, W. Müller, C. Scheytt, W. Ecker, C. Novello, in: Analog 2016 - VDE, 2016.","mla":"Abughannam, Saed, et al. “Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study.” <i>Analog 2016 - VDE</i>, 2016."},"year":"2016","date_created":"2021-09-13T09:44:29Z","author":[{"last_name":"Abughannam","id":"37628","full_name":"Abughannam, Saed","first_name":"Saed"},{"last_name":"Wu","full_name":"Wu, Liang","id":"30401","first_name":"Liang"},{"first_name":"Wolfgang","last_name":"Müller","id":"16243","full_name":"Müller, Wolfgang"},{"first_name":"Christoph","last_name":"Scheytt","id":"37144","full_name":"Scheytt, Christoph"},{"full_name":"Ecker, Wolfgang","last_name":"Ecker","first_name":"Wolfgang"},{"full_name":"Novello, Christiano","last_name":"Novello","first_name":"Christiano"}],"date_updated":"2022-02-17T13:58:08Z","conference":{"start_date":"2016.09.12","end_date":"2016.09.14"},"title":"Fault Injection and Mixed-Level Simulation for Analog Circuits - A Case Study","publication":"Analog 2016 - VDE","type":"conference","status":"public","abstract":[{"lang":"eng","text":"The design of safety critical systems requires an efficient methodology for an effective fault effect simulation for analog and digital circuits where analog fault injection and fault effect simulation is currently a field of active research and commercial tools are not available yet. This article begins by discussing fault injection strategies for analog circuits applied on a case study with two topologies of a Voltage Controlled Oscillator (VCO). In the second part it performs on the basis of the example of a Wireless Sensor Network (WSN) node, how far different mixed level implementations with Verilog-A and SPICE can affect the simulation time and points out which component consumes the major part of the simulation time."}],"department":[{"_id":"58"}],"user_id":"15931","_id":"24263","language":[{"iso":"eng"}]},{"language":[{"iso":"eng"}],"_id":"24289","user_id":"15931","department":[{"_id":"58"}],"editor":[{"first_name":"Daniel","last_name":"Mueller-Gritschneder","full_name":"Mueller-Gritschneder, Daniel"},{"full_name":"Müller, Wolfgang","last_name":"Müller","first_name":"Wolfgang"},{"first_name":"Subhasish","last_name":"Mitra","full_name":"Mitra, Subhasish"}],"status":"public","type":"conference","publication":"Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems (REES 2014)","title":"On the Correlation of HW Faults and SW Errors","date_updated":"2022-02-17T10:08:53Z","date_created":"2021-09-14T07:06:31Z","author":[{"id":"16243","full_name":"Müller, Wolfgang","last_name":"Müller","first_name":"Wolfgang"},{"id":"30401","full_name":"Wu, Liang","last_name":"Wu","first_name":"Liang"},{"first_name":"Christoph","last_name":"Scheytt","id":"37144","full_name":"Scheytt, Christoph"},{"first_name":"Markus","last_name":"Becker","full_name":"Becker, Markus"},{"first_name":"Sven","last_name":"Schoenberg","full_name":"Schoenberg, Sven"}],"year":"2015","place":"Amsterdam, Netherland","citation":{"ama":"Müller W, Wu L, Scheytt C, Becker M, Schoenberg S. On the Correlation of HW Faults and SW Errors. In: Mueller-Gritschneder D, Müller W, Mitra S, eds. <i>Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems (REES 2014)</i>. ; 2015.","chicago":"Müller, Wolfgang, Liang Wu, Christoph Scheytt, Markus Becker, and Sven Schoenberg. “On the Correlation of HW Faults and SW Errors.” In <i>Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems (REES 2014)</i>, edited by Daniel Mueller-Gritschneder, Wolfgang Müller, and Subhasish Mitra. Amsterdam, Netherland, 2015.","ieee":"W. Müller, L. Wu, C. Scheytt, M. Becker, and S. Schoenberg, “On the Correlation of HW Faults and SW Errors,” in <i>Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems (REES 2014)</i>, 2015.","apa":"Müller, W., Wu, L., Scheytt, C., Becker, M., &#38; Schoenberg, S. (2015). On the Correlation of HW Faults and SW Errors. In D. Mueller-Gritschneder, W. Müller, &#38; S. Mitra (Eds.), <i>Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems (REES 2014)</i>.","short":"W. Müller, L. Wu, C. Scheytt, M. Becker, S. Schoenberg, in: D. Mueller-Gritschneder, W. Müller, S. Mitra (Eds.), Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems (REES 2014), Amsterdam, Netherland, 2015.","mla":"Müller, Wolfgang, et al. “On the Correlation of HW Faults and SW Errors.” <i>Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems (REES 2014)</i>, edited by Daniel Mueller-Gritschneder et al., 2015.","bibtex":"@inproceedings{Müller_Wu_Scheytt_Becker_Schoenberg_2015, place={Amsterdam, Netherland}, title={On the Correlation of HW Faults and SW Errors}, booktitle={Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems (REES 2014)}, author={Müller, Wolfgang and Wu, Liang and Scheytt, Christoph and Becker, Markus and Schoenberg, Sven}, editor={Mueller-Gritschneder, Daniel and Müller, Wolfgang and Mitra, Subhasish}, year={2015} }"}},{"status":"public","editor":[{"full_name":"Müller-Gridschneder, Daniel","last_name":"Müller-Gridschneder","first_name":"Daniel"},{"first_name":"Wolfgang","last_name":"Müller","full_name":"Müller, Wolfgang","id":"16243"},{"full_name":"Mitra, Subhasish","last_name":"Mitra","first_name":"Subhasish"}],"type":"book_editor","language":[{"iso":"eng"}],"user_id":"16243","department":[{"_id":"58"}],"_id":"53590","citation":{"ama":"Müller-Gridschneder D, Müller W, Mitra S, eds. <i>Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems</i>.; 2015.","ieee":"D. Müller-Gridschneder, W. Müller, and S. Mitra, Eds., <i>Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems</i>. Amsterdam, Netherlands, 2015.","chicago":"Müller-Gridschneder, Daniel, Wolfgang Müller, and Subhasish Mitra, eds. <i>Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems</i>. Amsterdam, Netherlands, 2015.","apa":"Müller-Gridschneder, D., Müller, W., &#38; Mitra, S. (Eds.). (2015). <i>Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems</i>.","mla":"Müller-Gridschneder, Daniel, et al., editors. <i>Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems</i>. 2015.","bibtex":"@book{Müller-Gridschneder_Müller_Mitra_2015, place={Amsterdam, Netherlands}, title={Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems}, year={2015} }","short":"D. Müller-Gridschneder, W. Müller, S. Mitra, eds., Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems, Amsterdam, Netherlands, 2015."},"place":"Amsterdam, Netherlands","year":"2015","title":"Proceedings of the 1st International Workshop on Resiliency in Embedded Electronic Systems","date_created":"2024-04-18T21:37:18Z","date_updated":"2024-04-18T22:13:15Z"},{"date_updated":"2022-01-06T06:56:53Z","author":[{"first_name":"Markus","full_name":"Becker, Markus","last_name":"Becker"},{"first_name":"Christoph","full_name":"Kuznik, Christoph","last_name":"Kuznik"},{"last_name":"Müller","full_name":"Müller, Wolfgang","id":"16243","first_name":"Wolfgang"}],"date_created":"2021-09-30T07:15:48Z","title":"Virtual Platforms for Model-Based Design of Dependable Cyber-Physical System Software","year":"2014","citation":{"mla":"Becker, Markus, et al. “Virtual Platforms for Model-Based Design of Dependable Cyber-Physical System Software.” <i>17th Euromicro Conference on Digital Systems Design (DSD)</i>, 2014.","bibtex":"@inproceedings{Becker_Kuznik_Müller_2014, title={Virtual Platforms for Model-Based Design of Dependable Cyber-Physical System Software}, booktitle={17th Euromicro Conference on Digital Systems Design (DSD)}, author={Becker, Markus and Kuznik, Christoph and Müller, Wolfgang}, year={2014} }","short":"M. Becker, C. Kuznik, W. Müller, in: 17th Euromicro Conference on Digital Systems Design (DSD), 2014.","apa":"Becker, M., Kuznik, C., &#38; Müller, W. (2014). Virtual Platforms for Model-Based Design of Dependable Cyber-Physical System Software. <i>17th Euromicro Conference on Digital Systems Design (DSD)</i>.","chicago":"Becker, Markus, Christoph Kuznik, and Wolfgang Müller. “Virtual Platforms for Model-Based Design of Dependable Cyber-Physical System Software.” In <i>17th Euromicro Conference on Digital Systems Design (DSD)</i>, 2014.","ieee":"M. Becker, C. Kuznik, and W. Müller, “Virtual Platforms for Model-Based Design of Dependable Cyber-Physical System Software,” 2014.","ama":"Becker M, Kuznik C, Müller W. Virtual Platforms for Model-Based Design of Dependable Cyber-Physical System Software. In: <i>17th Euromicro Conference on Digital Systems Design (DSD)</i>. ; 2014."},"_id":"25145","department":[{"_id":"672"}],"user_id":"21240","language":[{"iso":"eng"}],"publication":"17th Euromicro Conference on Digital Systems Design (DSD)","type":"conference","status":"public"},{"citation":{"ama":"Becker M, Kuznik C, Müller W. Fault Effect Modeling in a Heterogeneous SystemC Virtual Platform Framework for Cyber-Physical Systems. In: <i>ACM/IEEE 5th International Conference on Cyber-Physical Systems</i>. ; 2014.","chicago":"Becker, Markus, Christoph Kuznik, and Wolfgang Müller. “Fault Effect Modeling in a Heterogeneous SystemC Virtual Platform Framework for Cyber-Physical Systems.” In <i>ACM/IEEE 5th International Conference on Cyber-Physical Systems</i>, 2014.","ieee":"M. Becker, C. Kuznik, and W. Müller, “Fault Effect Modeling in a Heterogeneous SystemC Virtual Platform Framework for Cyber-Physical Systems,” 2014.","short":"M. Becker, C. Kuznik, W. Müller, in: ACM/IEEE 5th International Conference on Cyber-Physical Systems, 2014.","bibtex":"@inproceedings{Becker_Kuznik_Müller_2014, title={Fault Effect Modeling in a Heterogeneous SystemC Virtual Platform Framework for Cyber-Physical Systems}, booktitle={ACM/IEEE 5th International Conference on Cyber-Physical Systems}, author={Becker, Markus and Kuznik, Christoph and Müller, Wolfgang}, year={2014} }","mla":"Becker, Markus, et al. “Fault Effect Modeling in a Heterogeneous SystemC Virtual Platform Framework for Cyber-Physical Systems.” <i>ACM/IEEE 5th International Conference on Cyber-Physical Systems</i>, 2014.","apa":"Becker, M., Kuznik, C., &#38; Müller, W. (2014). Fault Effect Modeling in a Heterogeneous SystemC Virtual Platform Framework for Cyber-Physical Systems. <i>ACM/IEEE 5th International Conference on Cyber-Physical Systems</i>."},"year":"2014","date_created":"2021-09-30T08:17:50Z","author":[{"first_name":"Markus","full_name":"Becker, Markus","last_name":"Becker"},{"first_name":"Christoph","last_name":"Kuznik","full_name":"Kuznik, Christoph"},{"last_name":"Müller","full_name":"Müller, Wolfgang","id":"16243","first_name":"Wolfgang"}],"date_updated":"2022-01-06T06:56:53Z","title":"Fault Effect Modeling in a Heterogeneous SystemC Virtual Platform Framework for Cyber-Physical Systems","type":"conference","publication":"ACM/IEEE 5th International Conference on Cyber-Physical Systems","status":"public","user_id":"21240","department":[{"_id":"672"}],"_id":"25155","language":[{"iso":"eng"}]},{"year":"2014","citation":{"bibtex":"@inproceedings{Koppelmann_Becker_Müller_2014, title={Portierung der TriCore-Architektur auf QEMU}, booktitle={17. Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV 2014) }, author={Koppelmann, Bastian and Becker, Markus and Müller, Wolfgang}, year={2014} }","short":"B. Koppelmann, M. Becker, W. Müller, in: 17. Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2014) , 2014.","mla":"Koppelmann, Bastian, et al. “Portierung Der TriCore-Architektur Auf QEMU.” <i>17. Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2014) </i>, 2014.","apa":"Koppelmann, B., Becker, M., &#38; Müller, W. (2014). Portierung der TriCore-Architektur auf QEMU. <i>17. Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2014) </i>.","ieee":"B. Koppelmann, M. Becker, and W. Müller, “Portierung der TriCore-Architektur auf QEMU,” 2014.","chicago":"Koppelmann, Bastian, Markus Becker, and Wolfgang Müller. “Portierung Der TriCore-Architektur Auf QEMU.” In <i>17. Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2014) </i>, 2014.","ama":"Koppelmann B, Becker M, Müller W. Portierung der TriCore-Architektur auf QEMU. In: <i>17. Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2014) </i>. ; 2014."},"title":"Portierung der TriCore-Architektur auf QEMU","date_updated":"2022-01-06T06:56:53Z","author":[{"first_name":"Bastian","id":"25260","full_name":"Koppelmann, Bastian","last_name":"Koppelmann"},{"first_name":"Markus","last_name":"Becker","full_name":"Becker, Markus"},{"full_name":"Müller, Wolfgang","id":"16243","last_name":"Müller","first_name":"Wolfgang"}],"date_created":"2021-09-30T09:51:08Z","status":"public","type":"conference","publication":"17. Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV 2014) ","language":[{"iso":"eng"}],"_id":"25161","user_id":"21240","department":[{"_id":"672"}]},{"abstract":[{"text":"Energy efficiency drives the development of more and more complex low-power designs. Based on dynamic power management techniques, multiple voltage islands as well as a huge amount of power states are specified that have to be tested carefully. In this context, low-power design should start at an early stage using state-of-the-art system-level modeling and simulation techniques. However, there is neither a programming language nor any modeling standard that reflects variable power together with its functional side effects in a well-suited abstract manner. To overcome this limitation, we present a modeling approach on top of SystemC TLM to capture low-power design characteristics at electronic system-level. We demonstrate the usability by means of an existing open-source low-power design. The experimental results show that appropriate TLM instrumentation cause only minimal simulation overhead, but offer sufficient details to identify common low-power design errors.","lang":"eng"}],"status":"public","publication":"Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XIV)","type":"conference","language":[{"iso":"eng"}],"_id":"24305","department":[{"_id":"58"}],"user_id":"15931","place":"Greece","year":"2014","citation":{"ama":"Mischkalla F, Müller W. Architectural Low-Power Design Using Transaction-Based System Modeling and Simulation. In: <i>Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XIV)</i>. IEEE; 2014. doi:<a href=\"https://doi.org/10.1109/SAMOS.2014.6893219\">10.1109/SAMOS.2014.6893219</a>","ieee":"F. Mischkalla and W. Müller, “Architectural Low-Power Design Using Transaction-Based System Modeling and Simulation,” 2014, doi: <a href=\"https://doi.org/10.1109/SAMOS.2014.6893219\">10.1109/SAMOS.2014.6893219</a>.","chicago":"Mischkalla, Fabian, and Wolfgang Müller. “Architectural Low-Power Design Using Transaction-Based System Modeling and Simulation.” In <i>Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XIV)</i>. Greece: IEEE, 2014. <a href=\"https://doi.org/10.1109/SAMOS.2014.6893219\">https://doi.org/10.1109/SAMOS.2014.6893219</a>.","apa":"Mischkalla, F., &#38; Müller, W. (2014). Architectural Low-Power Design Using Transaction-Based System Modeling and Simulation. <i>Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XIV)</i>. <a href=\"https://doi.org/10.1109/SAMOS.2014.6893219\">https://doi.org/10.1109/SAMOS.2014.6893219</a>","short":"F. Mischkalla, W. Müller, in: Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XIV), IEEE, Greece, 2014.","mla":"Mischkalla, Fabian, and Wolfgang Müller. “Architectural Low-Power Design Using Transaction-Based System Modeling and Simulation.” <i>Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XIV)</i>, IEEE, 2014, doi:<a href=\"https://doi.org/10.1109/SAMOS.2014.6893219\">10.1109/SAMOS.2014.6893219</a>.","bibtex":"@inproceedings{Mischkalla_Müller_2014, place={Greece}, title={Architectural Low-Power Design Using Transaction-Based System Modeling and Simulation}, DOI={<a href=\"https://doi.org/10.1109/SAMOS.2014.6893219\">10.1109/SAMOS.2014.6893219</a>}, booktitle={Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XIV)}, publisher={IEEE}, author={Mischkalla, Fabian and Müller, Wolfgang}, year={2014} }"},"publication_identifier":{"eisbn":["978-1-4799-3770-7"]},"related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/6893219"}]},"title":"Architectural Low-Power Design Using Transaction-Based System Modeling and Simulation","conference":{"start_date":"2014.07.14","end_date":"2014.07.17"},"doi":"10.1109/SAMOS.2014.6893219","publisher":"IEEE","date_updated":"2022-02-17T12:46:32Z","date_created":"2021-09-14T07:06:51Z","author":[{"first_name":"Fabian","last_name":"Mischkalla","full_name":"Mischkalla, Fabian"},{"id":"16243","full_name":"Müller, Wolfgang","last_name":"Müller","first_name":"Wolfgang"}]},{"date_updated":"2022-02-17T12:34:27Z","author":[{"full_name":"Koppelmann, Bastian","id":"25260","last_name":"Koppelmann","first_name":"Bastian"},{"full_name":"Messidat, Bernd","last_name":"Messidat","first_name":"Bernd"},{"first_name":"Markus","full_name":"Becker, Markus","last_name":"Becker"},{"full_name":"Kuznik, Christoph","last_name":"Kuznik","first_name":"Christoph"},{"first_name":"Wolfgang","full_name":"Müller, Wolfgang","id":"16243","last_name":"Müller"},{"first_name":"Christoph","id":"37144","full_name":"Scheytt, Christoph","last_name":"Scheytt"}],"date_created":"2021-09-14T07:06:47Z","title":"Fast and Open Virtual Platforms for TriCore-based SoCs Using QEMU","conference":{"start_date":"2014.10.14","location":"München, Germany"},"related_material":{"link":[{"url":"http://dvcon-europe.org/conference/dvcon-europe-2014/","relation":"confirmation"}]},"year":"2014","citation":{"apa":"Koppelmann, B., Messidat, B., Becker, M., Kuznik, C., Müller, W., &#38; Scheytt, C. (2014). Fast and Open Virtual Platforms for TriCore-based SoCs Using QEMU. <i>Design and Verification Conference (DVCON EUROPE)</i>.","mla":"Koppelmann, Bastian, et al. “Fast and Open Virtual Platforms for TriCore-Based SoCs Using QEMU.” <i>Design and Verification Conference (DVCON EUROPE)</i>, 2014.","short":"B. Koppelmann, B. Messidat, M. Becker, C. Kuznik, W. Müller, C. Scheytt, Design and Verification Conference (DVCON EUROPE) (2014).","bibtex":"@article{Koppelmann_Messidat_Becker_Kuznik_Müller_Scheytt_2014, title={Fast and Open Virtual Platforms for TriCore-based SoCs Using QEMU}, journal={Design and Verification Conference (DVCON EUROPE)}, author={Koppelmann, Bastian and Messidat, Bernd and Becker, Markus and Kuznik, Christoph and Müller, Wolfgang and Scheytt, Christoph}, year={2014} }","ama":"Koppelmann B, Messidat B, Becker M, Kuznik C, Müller W, Scheytt C. Fast and Open Virtual Platforms for TriCore-based SoCs Using QEMU. <i>Design and Verification Conference (DVCON EUROPE)</i>. Published online 2014.","chicago":"Koppelmann, Bastian, Bernd Messidat, Markus Becker, Christoph Kuznik, Wolfgang Müller, and Christoph Scheytt. “Fast and Open Virtual Platforms for TriCore-Based SoCs Using QEMU.” <i>Design and Verification Conference (DVCON EUROPE)</i>, 2014.","ieee":"B. Koppelmann, B. Messidat, M. Becker, C. Kuznik, W. Müller, and C. Scheytt, “Fast and Open Virtual Platforms for TriCore-based SoCs Using QEMU,” <i>Design and Verification Conference (DVCON EUROPE)</i>, 2014."},"_id":"24302","user_id":"15931","department":[{"_id":"58"}],"language":[{"iso":"eng"}],"type":"journal_article","publication":"Design and Verification Conference (DVCON EUROPE)","abstract":[{"text":"In this paper, we present an efficient approach to virtual platform modeling for TriCore-based SoCs by combining fast and open software emulation with IEEE-1666 Standard SystemC simulation.  For evaluation we consider Infineon's recently introduced AURIX processor family as a target platform, which utilizes multiple CPU cores operating in lockstep mode, memories, hierarchical buses, and a rich set of peripherals. For SoC prototyping, we integrate the fast and open instruction accurate QEMU software emulator with the TLMu library for SystemC co-verification. This article reports our most recent efforts of the implementation of the TriCore instruction set for QEMU. The experimental results demonstrate the functional correctness and performance of our TriCore implementation.","lang":"eng"}],"status":"public"},{"year":"2014","citation":{"apa":"Kuznik, C., &#38; Müller, W. (2014). Verific-MM: Systematized Verification Metrics Generation with UCIS for Improved Automation on Verification Closure. <i>Design, Automation and Test in Europe DATE, University Booth, Dresden</i>.","short":"C. Kuznik, W. Müller, Design, Automation and Test in Europe DATE, University Booth, Dresden (2014).","bibtex":"@article{Kuznik_Müller_2014, title={Verific-MM: Systematized Verification Metrics Generation with UCIS for Improved Automation on Verification Closure}, journal={Design, Automation and Test in Europe DATE, University Booth, Dresden}, author={Kuznik, Christoph and Müller, Wolfgang}, year={2014} }","mla":"Kuznik, Christoph, and Wolfgang Müller. “Verific-MM: Systematized Verification Metrics Generation with UCIS for Improved Automation on Verification Closure.” <i>Design, Automation and Test in Europe DATE, University Booth, Dresden</i>, 2014.","ieee":"C. Kuznik and W. Müller, “Verific-MM: Systematized Verification Metrics Generation with UCIS for Improved Automation on Verification Closure,” <i>Design, Automation and Test in Europe DATE, University Booth, Dresden</i>, 2014.","chicago":"Kuznik, Christoph, and Wolfgang Müller. “Verific-MM: Systematized Verification Metrics Generation with UCIS for Improved Automation on Verification Closure.” <i>Design, Automation and Test in Europe DATE, University Booth, Dresden</i>, 2014.","ama":"Kuznik C, Müller W. Verific-MM: Systematized Verification Metrics Generation with UCIS for Improved Automation on Verification Closure. <i>Design, Automation and Test in Europe DATE, University Booth, Dresden</i>. Published online 2014."},"related_material":{"link":[{"url":"https://www.edacentrum.de/effektiv/content/verific-mm-systematized-verification-metrics-generation-ucis-improved-automation-verificatio","relation":"confirmation"}]},"title":"Verific-MM: Systematized Verification Metrics Generation with UCIS for Improved Automation on Verification Closure","conference":{"start_date":"2014.03.25"},"date_updated":"2022-02-17T13:14:13Z","date_created":"2021-09-14T07:06:56Z","author":[{"first_name":"Christoph","last_name":"Kuznik","full_name":"Kuznik, Christoph"},{"full_name":"Müller, Wolfgang","id":"16243","last_name":"Müller","first_name":"Wolfgang"}],"abstract":[{"lang":"eng","text":"Verific-MM is an approach to systematize and accelerate the coverage plan engineering as well as the verification environment’s (functional) metric code generation -- usually a time-consuming and error-prone task -- in particular by (i) improving automation via assisted model-based approaches, utilizing recent industry standards such as UCIS and (ii) a supporting methodology suitable for various target (functional coverage) languages (IEEE-1800 SystemVerilog, IEEE-1647 e, IEEE-1666 SystemC)."}],"status":"public","publication":"Design, Automation and Test in Europe DATE, University Booth, Dresden","type":"journal_article","language":[{"iso":"eng"}],"_id":"24309","department":[{"_id":"58"}],"user_id":"15931"}]