[{"status":"public","publication":"European Test Symposium, The Hague, Netherlands, May 20-24, 2024","type":"conference","language":[{"iso":"eng"}],"_id":"52744","department":[{"_id":"48"}],"user_id":"209","year":"2024","page":"6","citation":{"ieee":"H. Jafarzadeh, F. Klemme, H. Amrouch, S. Hellebrand, and H.-J. Wunderlich, “Time and Space Optimized Storage-based BIST under Multiple Voltages and Variations,” in <i>European Test Symposium, The Hague, Netherlands, May 20-24, 2024</i>, The Hague, NL, p. 6.","chicago":"Jafarzadeh, Hanieh, Florian Klemme, Hussam Amrouch, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Time and Space Optimized Storage-Based BIST under Multiple Voltages and Variations.” In <i>European Test Symposium, The Hague, Netherlands, May 20-24, 2024</i>, 6. IEEE, n.d.","ama":"Jafarzadeh H, Klemme F, Amrouch H, Hellebrand S, Wunderlich H-J. Time and Space Optimized Storage-based BIST under Multiple Voltages and Variations. In: <i>European Test Symposium, The Hague, Netherlands, May 20-24, 2024</i>. IEEE; :6.","bibtex":"@inproceedings{Jafarzadeh_Klemme_Amrouch_Hellebrand_Wunderlich, title={Time and Space Optimized Storage-based BIST under Multiple Voltages and Variations}, booktitle={European Test Symposium, The Hague, Netherlands, May 20-24, 2024}, publisher={IEEE}, author={Jafarzadeh, Hanieh and Klemme, Florian and Amrouch, Hussam and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, pages={6} }","short":"H. Jafarzadeh, F. Klemme, H. Amrouch, S. Hellebrand, H.-J. Wunderlich, in: European Test Symposium, The Hague, Netherlands, May 20-24, 2024, IEEE, n.d., p. 6.","mla":"Jafarzadeh, Hanieh, et al. “Time and Space Optimized Storage-Based BIST under Multiple Voltages and Variations.” <i>European Test Symposium, The Hague, Netherlands, May 20-24, 2024</i>, IEEE, p. 6.","apa":"Jafarzadeh, H., Klemme, F., Amrouch, H., Hellebrand, S., &#38; Wunderlich, H.-J. (n.d.). Time and Space Optimized Storage-based BIST under Multiple Voltages and Variations. <i>European Test Symposium, The Hague, Netherlands, May 20-24, 2024</i>, 6."},"quality_controlled":"1","publication_status":"accepted","title":"Time and Space Optimized Storage-based BIST under Multiple Voltages and Variations","conference":{"end_date":"2024-05-24","location":"The Hague, NL","name":"IEEE European Test Symposium","start_date":"2024-05-20"},"date_updated":"2024-03-22T17:05:29Z","publisher":"IEEE","author":[{"first_name":"Hanieh","last_name":"Jafarzadeh","full_name":"Jafarzadeh, Hanieh"},{"first_name":"Florian","last_name":"Klemme","full_name":"Klemme, Florian"},{"last_name":"Amrouch","full_name":"Amrouch, Hussam","first_name":"Hussam"},{"full_name":"Hellebrand, Sybille","id":"209","last_name":"Hellebrand","orcid":"0000-0002-3717-3939","first_name":"Sybille"},{"first_name":"Hans-Joachim","full_name":"Wunderlich, Hans-Joachim","last_name":"Wunderlich"}],"date_created":"2024-03-22T17:04:25Z"},{"publication":"IEEE Latin American Test Symposium (LATS), Maceió, Brazil, April 9-12, 2024","type":"conference","status":"public","_id":"52742","department":[{"_id":"48"}],"user_id":"209","language":[{"iso":"eng"}],"quality_controlled":"1","publication_status":"accepted","year":"2024","page":"6","citation":{"chicago":"Jafarzadeh, Hanieh, Florian Klemme, Hussam Amrouch, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Vmin Testing under Variations: Defect vs. Fault Coverage.” In <i>IEEE Latin American Test Symposium (LATS), Maceió, Brazil, April 9-12, 2024</i>, 6. IEEE, n.d.","ieee":"H. Jafarzadeh, F. Klemme, H. Amrouch, S. Hellebrand, and H.-J. Wunderlich, “Vmin Testing under Variations: Defect vs. Fault Coverage,” in <i>IEEE Latin American Test Symposium (LATS), Maceió, Brazil, April 9-12, 2024</i>, Maceió, p. 6.","ama":"Jafarzadeh H, Klemme F, Amrouch H, Hellebrand S, Wunderlich H-J. Vmin Testing under Variations: Defect vs. Fault Coverage. In: <i>IEEE Latin American Test Symposium (LATS), Maceió, Brazil, April 9-12, 2024</i>. IEEE; :6.","apa":"Jafarzadeh, H., Klemme, F., Amrouch, H., Hellebrand, S., &#38; Wunderlich, H.-J. (n.d.). Vmin Testing under Variations: Defect vs. Fault Coverage. <i>IEEE Latin American Test Symposium (LATS), Maceió, Brazil, April 9-12, 2024</i>, 6.","mla":"Jafarzadeh, Hanieh, et al. “Vmin Testing under Variations: Defect vs. Fault Coverage.” <i>IEEE Latin American Test Symposium (LATS), Maceió, Brazil, April 9-12, 2024</i>, IEEE, p. 6.","bibtex":"@inproceedings{Jafarzadeh_Klemme_Amrouch_Hellebrand_Wunderlich, title={Vmin Testing under Variations: Defect vs. Fault Coverage}, booktitle={IEEE Latin American Test Symposium (LATS), Maceió, Brazil, April 9-12, 2024}, publisher={IEEE}, author={Jafarzadeh, Hanieh and Klemme, Florian and Amrouch, Hussam and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, pages={6} }","short":"H. Jafarzadeh, F. Klemme, H. Amrouch, S. Hellebrand, H.-J. Wunderlich, in: IEEE Latin American Test Symposium (LATS), Maceió, Brazil, April 9-12, 2024, IEEE, n.d., p. 6."},"publisher":"IEEE","date_updated":"2024-03-22T17:06:40Z","date_created":"2024-03-22T16:49:22Z","author":[{"full_name":"Jafarzadeh, Hanieh","last_name":"Jafarzadeh","first_name":"Hanieh"},{"last_name":"Klemme","full_name":"Klemme, Florian","first_name":"Florian"},{"last_name":"Amrouch","full_name":"Amrouch, Hussam","first_name":"Hussam"},{"id":"209","full_name":"Hellebrand, Sybille","orcid":"0000-0002-3717-3939","last_name":"Hellebrand","first_name":"Sybille"},{"last_name":"Wunderlich","full_name":"Wunderlich, Hans-Joachim","first_name":"Hans-Joachim"}],"title":"Vmin Testing under Variations: Defect vs. Fault Coverage","conference":{"end_date":"2024-04-12","location":"Maceió","name":"IEEE Latin American Test Symposium (LATS)","start_date":"2024-04-09"}},{"department":[{"_id":"48"}],"user_id":"209","_id":"52743","language":[{"iso":"eng"}],"publication":"International Symposium of EDA (ISEDA), Xi'an, China, May 10-13, 2024","type":"conference","status":"public","date_created":"2024-03-22T16:57:53Z","author":[{"orcid":"0000-0002-3717-3939","last_name":"Hellebrand","full_name":"Hellebrand, Sybille","id":"209","first_name":"Sybille"},{"first_name":"Somayeh","full_name":"Sadeghi-Kohan, Somayeh","id":"78614","last_name":"Sadeghi-Kohan","orcid":"https://orcid.org/0000-0001-7246-0610"},{"last_name":"Wunderlich","full_name":"Wunderlich, Hans-Joachim","first_name":"Hans-Joachim"}],"date_updated":"2024-03-22T17:06:02Z","conference":{"name":"International Symposium of EDA (ISEDA)","start_date":"2024-05-10","end_date":"2024-05-13","location":"Xi'an, China"},"title":"Functional Safety and Reliability of Interconnects throughout the Silicon Life Cycle","publication_status":"accepted","page":"1","citation":{"ama":"Hellebrand S, Sadeghi-Kohan S, Wunderlich H-J. Functional Safety and Reliability of Interconnects throughout the Silicon Life Cycle. In: <i>International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>. ; :1.","ieee":"S. Hellebrand, S. Sadeghi-Kohan, and H.-J. Wunderlich, “Functional Safety and Reliability of Interconnects throughout the Silicon Life Cycle,” in <i>International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>, Xi’an, China, p. 1.","chicago":"Hellebrand, Sybille, Somayeh Sadeghi-Kohan, and Hans-Joachim Wunderlich. “Functional Safety and Reliability of Interconnects throughout the Silicon Life Cycle.” In <i>International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>, 1, n.d.","bibtex":"@inproceedings{Hellebrand_Sadeghi-Kohan_Wunderlich, title={Functional Safety and Reliability of Interconnects throughout the Silicon Life Cycle}, booktitle={International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024}, author={Hellebrand, Sybille and Sadeghi-Kohan, Somayeh and Wunderlich, Hans-Joachim}, pages={1} }","mla":"Hellebrand, Sybille, et al. “Functional Safety and Reliability of Interconnects throughout the Silicon Life Cycle.” <i>International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>, p. 1.","short":"S. Hellebrand, S. Sadeghi-Kohan, H.-J. Wunderlich, in: International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024, n.d., p. 1.","apa":"Hellebrand, S., Sadeghi-Kohan, S., &#38; Wunderlich, H.-J. (n.d.). Functional Safety and Reliability of Interconnects throughout the Silicon Life Cycle. <i>International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>, 1."},"year":"2024"},{"publication_status":"accepted","year":"2024","page":"1","citation":{"chicago":"Wunderlich, Hans-Joachim, Hanieh Jafarzadeh, and Sybille Hellebrand. “Robust Test of Small Delay Faults under  PVT-Variations.” In <i>International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>, 1, n.d.","ieee":"H.-J. Wunderlich, H. Jafarzadeh, and S. Hellebrand, “Robust Test of Small Delay Faults under  PVT-Variations,” in <i>International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>, Xi’an, China, p. 1.","ama":"Wunderlich H-J, Jafarzadeh H, Hellebrand S. Robust Test of Small Delay Faults under  PVT-Variations. In: <i>International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>. ; :1.","apa":"Wunderlich, H.-J., Jafarzadeh, H., &#38; Hellebrand, S. (n.d.). Robust Test of Small Delay Faults under  PVT-Variations. <i>International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>, 1.","mla":"Wunderlich, Hans-Joachim, et al. “Robust Test of Small Delay Faults under  PVT-Variations.” <i>International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>, p. 1.","bibtex":"@inproceedings{Wunderlich_Jafarzadeh_Hellebrand, title={Robust Test of Small Delay Faults under  PVT-Variations}, booktitle={International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024}, author={Wunderlich, Hans-Joachim and Jafarzadeh, Hanieh and Hellebrand, Sybille}, pages={1} }","short":"H.-J. Wunderlich, H. Jafarzadeh, S. Hellebrand, in: International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024, n.d., p. 1."},"date_updated":"2024-03-22T17:11:16Z","author":[{"full_name":"Wunderlich, Hans-Joachim","last_name":"Wunderlich","first_name":"Hans-Joachim"},{"full_name":"Jafarzadeh, Hanieh","last_name":"Jafarzadeh","first_name":"Hanieh"},{"first_name":"Sybille","full_name":"Hellebrand, Sybille","id":"209","orcid":"0000-0002-3717-3939","last_name":"Hellebrand"}],"date_created":"2024-03-22T17:11:03Z","title":"Robust Test of Small Delay Faults under  PVT-Variations","conference":{"start_date":"2024-05-10","name":"International Symposium of EDA (ISEDA)","location":"Xi’an, China","end_date":"2024-05-13"},"publication":"International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024","type":"conference","status":"public","_id":"52745","department":[{"_id":"48"}],"user_id":"209","language":[{"iso":"eng"}]},{"language":[{"iso":"eng"}],"user_id":"209","department":[{"_id":"48"}],"_id":"50284","status":"public","type":"misc","title":"Modeling Crosstalk-induced Interconnect Delay with Polynomial Regression","date_created":"2024-01-08T08:47:32Z","author":[{"first_name":"Alisa","full_name":"Stiballe, Alisa","last_name":"Stiballe"},{"first_name":"Jan Dennis","last_name":"Reimer","id":"36703","full_name":"Reimer, Jan Dennis"},{"first_name":"Somayeh","orcid":"https://orcid.org/0000-0001-7246-0610","last_name":"Sadeghi-Kohan","full_name":"Sadeghi-Kohan, Somayeh","id":"78614"},{"last_name":"Hellebrand","orcid":"0000-0002-3717-3939","id":"209","full_name":"Hellebrand, Sybille","first_name":"Sybille"}],"publisher":"37. ITG / GMM / GI -Workshop \"Testmethoden und Zuverlässigkeit von Schaltungen und Systemen\"  (TuZ'24), Feb. 2024","date_updated":"2024-03-22T17:12:39Z","citation":{"ieee":"A. Stiballe, J. D. Reimer, S. Sadeghi-Kohan, and S. Hellebrand, <i>Modeling Crosstalk-induced Interconnect Delay with Polynomial Regression</i>. Darmstadt, Germany: 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024, 2024.","chicago":"Stiballe, Alisa, Jan Dennis Reimer, Somayeh Sadeghi-Kohan, and Sybille Hellebrand. <i>Modeling Crosstalk-Induced Interconnect Delay with Polynomial Regression</i>. Darmstadt, Germany: 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024, 2024.","ama":"Stiballe A, Reimer JD, Sadeghi-Kohan S, Hellebrand S. <i>Modeling Crosstalk-Induced Interconnect Delay with Polynomial Regression</i>. 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024; 2024.","apa":"Stiballe, A., Reimer, J. D., Sadeghi-Kohan, S., &#38; Hellebrand, S. (2024). <i>Modeling Crosstalk-induced Interconnect Delay with Polynomial Regression</i>. 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024.","mla":"Stiballe, Alisa, et al. <i>Modeling Crosstalk-Induced Interconnect Delay with Polynomial Regression</i>. 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024, 2024.","bibtex":"@book{Stiballe_Reimer_Sadeghi-Kohan_Hellebrand_2024, place={Darmstadt, Germany}, title={Modeling Crosstalk-induced Interconnect Delay with Polynomial Regression}, publisher={37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024}, author={Stiballe, Alisa and Reimer, Jan Dennis and Sadeghi-Kohan, Somayeh and Hellebrand, Sybille}, year={2024} }","short":"A. Stiballe, J.D. Reimer, S. Sadeghi-Kohan, S. Hellebrand, Modeling Crosstalk-Induced Interconnect Delay with Polynomial Regression, 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024, Darmstadt, Germany, 2024."},"year":"2024","place":"Darmstadt, Germany","publication_status":"published"},{"language":[{"iso":"eng"}],"user_id":"209","_id":"51799","status":"public","type":"misc","title":"Crosstalk-Aware Simulation of Interconnects Using Artificial Neural Networks","author":[{"last_name":"Ustimova","full_name":"Ustimova, Magdalina ","first_name":"Magdalina "},{"first_name":"Somayeh","last_name":"Sadeghi-Kohan","orcid":"https://orcid.org/0000-0001-7246-0610","id":"78614","full_name":"Sadeghi-Kohan, Somayeh"},{"orcid":"0000-0002-3717-3939","last_name":"Hellebrand","full_name":"Hellebrand, Sybille","id":"209","first_name":"Sybille"}],"date_created":"2024-02-23T12:07:20Z","publisher":"37. ITG / GMM / GI -Workshop \"Testmethoden und Zuverlässigkeit von Schaltungen und Systemen\"  (TuZ'24), Feb. 2024","date_updated":"2024-03-22T17:12:00Z","citation":{"apa":"Ustimova, M., Sadeghi-Kohan, S., &#38; Hellebrand, S. (2024). <i>Crosstalk-Aware Simulation of Interconnects Using Artificial Neural Networks</i>. 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024.","mla":"Ustimova, Magdalina, et al. <i>Crosstalk-Aware Simulation of Interconnects Using Artificial Neural Networks</i>. 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024, 2024.","short":"M. Ustimova, S. Sadeghi-Kohan, S. Hellebrand, Crosstalk-Aware Simulation of Interconnects Using Artificial Neural Networks, 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024, Darmstadt, Germany, 2024.","bibtex":"@book{Ustimova_Sadeghi-Kohan_Hellebrand_2024, place={Darmstadt, Germany}, title={Crosstalk-Aware Simulation of Interconnects Using Artificial Neural Networks}, publisher={37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024}, author={Ustimova, Magdalina  and Sadeghi-Kohan, Somayeh and Hellebrand, Sybille}, year={2024} }","ama":"Ustimova M, Sadeghi-Kohan S, Hellebrand S. <i>Crosstalk-Aware Simulation of Interconnects Using Artificial Neural Networks</i>. 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024; 2024.","chicago":"Ustimova, Magdalina , Somayeh Sadeghi-Kohan, and Sybille Hellebrand. <i>Crosstalk-Aware Simulation of Interconnects Using Artificial Neural Networks</i>. Darmstadt, Germany: 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024, 2024.","ieee":"M. Ustimova, S. Sadeghi-Kohan, and S. Hellebrand, <i>Crosstalk-Aware Simulation of Interconnects Using Artificial Neural Networks</i>. Darmstadt, Germany: 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024, 2024."},"place":"Darmstadt, Germany","year":"2024","publication_status":"published"},{"citation":{"short":"H. Jafarzadeh, F. Klemme, J.D. Reimer, H.  Amrouch, S. Hellebrand, H.-J. Wunderlich, in: In: IEEE International Test Conference (ITC’24), San Diego, CA, USA, November 2024, IEEE, San Diego, CA, 2024.","bibtex":"@inproceedings{Jafarzadeh_Klemme_Reimer_ Amrouch_Hellebrand_Wunderlich_2024, place={San Diego, CA}, title={Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient (ZTC) for Robust Delay Fault Testing}, booktitle={In: IEEE International Test Conference (ITC’24), San Diego, CA, USA, November 2024}, publisher={IEEE}, author={Jafarzadeh, Hanieh and Klemme, Florian and Reimer, Jan Dennis and  Amrouch, Hussam and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2024} }","mla":"Jafarzadeh, Hanieh, et al. “Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient (ZTC) for Robust Delay Fault Testing.” <i>In: IEEE International Test Conference (ITC’24), San Diego, CA, USA, November 2024</i>, IEEE, 2024.","apa":"Jafarzadeh, H., Klemme, F., Reimer, J. D.,  Amrouch, H., Hellebrand, S., &#38; Wunderlich, H.-J. (2024). Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient (ZTC) for Robust Delay Fault Testing. <i>In: IEEE International Test Conference (ITC’24), San Diego, CA, USA, November 2024</i>. IEEE International Test Conference (ITC’24), San Diego, CA, USA.","ieee":"H. Jafarzadeh, F. Klemme, J. D. Reimer, H.  Amrouch, S. Hellebrand, and H.-J. Wunderlich, “Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient (ZTC) for Robust Delay Fault Testing,” presented at the IEEE International Test Conference (ITC’24), San Diego, CA, USA, 2024.","chicago":"Jafarzadeh, Hanieh, Florian Klemme, Jan Dennis Reimer, Hussam  Amrouch, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient (ZTC) for Robust Delay Fault Testing.” In <i>In: IEEE International Test Conference (ITC’24), San Diego, CA, USA, November 2024</i>. San Diego, CA: IEEE, 2024.","ama":"Jafarzadeh H, Klemme F, Reimer JD,  Amrouch H, Hellebrand S, Wunderlich H-J. Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient (ZTC) for Robust Delay Fault Testing. In: <i>In: IEEE International Test Conference (ITC’24), San Diego, CA, USA, November 2024</i>. IEEE; 2024."},"place":"San Diego, CA","year":"2024","author":[{"first_name":"Hanieh","full_name":"Jafarzadeh, Hanieh","last_name":"Jafarzadeh"},{"full_name":"Klemme, Florian","last_name":"Klemme","first_name":"Florian"},{"first_name":"Jan Dennis","last_name":"Reimer","id":"36703","full_name":"Reimer, Jan Dennis"},{"full_name":" Amrouch, Hussam","last_name":" Amrouch","first_name":"Hussam"},{"first_name":"Sybille","id":"209","full_name":"Hellebrand, Sybille","orcid":"0000-0002-3717-3939","last_name":"Hellebrand"},{"first_name":"Hans-Joachim","full_name":"Wunderlich, Hans-Joachim","last_name":"Wunderlich"}],"date_created":"2024-09-04T09:25:20Z","date_updated":"2025-03-31T15:57:16Z","publisher":"IEEE","conference":{"name":"IEEE International Test Conference (ITC'24)","start_date":"2024-11-03","end_date":"2024-11-08","location":"San Diego, CA, USA"},"title":"Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient (ZTC) for Robust Delay Fault Testing","publication":"In: IEEE International Test Conference (ITC'24), San Diego, CA, USA, November 2024","type":"conference","status":"public","department":[{"_id":"48"}],"user_id":"36703","_id":"56014","language":[{"iso":"eng"}]},{"title":"Optimizing the Streaming of Sensor Data with Approximate Communication","conference":{"end_date":"2023-10-17","start_date":"2023-10-14","name":"IEEE Asian Test Symposium (ATS'23)"},"date_updated":"2024-01-08T08:49:08Z","author":[{"id":"78614","full_name":"Sadeghi-Kohan, Somayeh","orcid":"https://orcid.org/0000-0001-7246-0610","last_name":"Sadeghi-Kohan","first_name":"Somayeh"},{"first_name":"Jan Dennis","full_name":"Reimer, Jan Dennis","id":"36703","last_name":"Reimer"},{"id":"209","full_name":"Hellebrand, Sybille","orcid":"0000-0002-3717-3939","last_name":"Hellebrand","first_name":"Sybille"},{"last_name":"Wunderlich","full_name":"Wunderlich, Hans-Joachim","first_name":"Hans-Joachim"}],"date_created":"2023-08-26T08:47:52Z","year":"2023","place":"Beijing, China","citation":{"ieee":"S. Sadeghi-Kohan, J. D. Reimer, S. Hellebrand, and H.-J. Wunderlich, “Optimizing the Streaming of Sensor Data with Approximate Communication,” presented at the IEEE Asian Test Symposium (ATS’23), 2023.","chicago":"Sadeghi-Kohan, Somayeh, Jan Dennis Reimer, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Optimizing the Streaming of Sensor Data with Approximate Communication.” In <i>IEEE Asian Test Symposium (ATS’23), October 2023</i>. Beijing, China, 2023.","ama":"Sadeghi-Kohan S, Reimer JD, Hellebrand S, Wunderlich H-J. Optimizing the Streaming of Sensor Data with Approximate Communication. In: <i>IEEE Asian Test Symposium (ATS’23), October 2023</i>. ; 2023.","bibtex":"@inproceedings{Sadeghi-Kohan_Reimer_Hellebrand_Wunderlich_2023, place={Beijing, China}, title={Optimizing the Streaming of Sensor Data with Approximate Communication}, booktitle={IEEE Asian Test Symposium (ATS’23), October 2023}, author={Sadeghi-Kohan, Somayeh and Reimer, Jan Dennis and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2023} }","short":"S. Sadeghi-Kohan, J.D. Reimer, S. Hellebrand, H.-J. Wunderlich, in: IEEE Asian Test Symposium (ATS’23), October 2023, Beijing, China, 2023.","mla":"Sadeghi-Kohan, Somayeh, et al. “Optimizing the Streaming of Sensor Data with Approximate Communication.” <i>IEEE Asian Test Symposium (ATS’23), October 2023</i>, 2023.","apa":"Sadeghi-Kohan, S., Reimer, J. D., Hellebrand, S., &#38; Wunderlich, H.-J. (2023). Optimizing the Streaming of Sensor Data with Approximate Communication. <i>IEEE Asian Test Symposium (ATS’23), October 2023</i>. IEEE Asian Test Symposium (ATS’23)."},"language":[{"iso":"eng"}],"_id":"46738","department":[{"_id":"48"}],"user_id":"36703","status":"public","publication":"IEEE Asian Test Symposium (ATS'23), October 2023","type":"conference"},{"_id":"46264","department":[{"_id":"48"}],"user_id":"209","keyword":["Electrical and Electronic Engineering","Hardware and Architecture","Software"],"article_type":"original","language":[{"iso":"eng"}],"publication":"IEEE Design &Test","type":"journal_article","abstract":[{"lang":"eng","text":"System-level interconnects provide the\r\nbackbone for increasingly complex systems on a chip. Their\r\nvulnerability to electromigration and crosstalk can lead to\r\nserious reliability and safety issues during the system lifetime.\r\nThis article presents an approach for periodic in-system testing\r\nwhich maintains a reliability profile to detect potential\r\nproblems before they actually cause a failure. Relying on a\r\ncommon infrastructure for EM-aware system workload\r\nmanagement and test, it minimizes the stress induced by the\r\ntest itself and contributes to the self-healing of system-induced\r\nelectromigration degradations. "}],"status":"public","publisher":"Institute of Electrical and Electronics Engineers (IEEE)","date_updated":"2024-03-22T17:15:10Z","date_created":"2023-08-02T11:07:43Z","author":[{"first_name":"Somayeh","orcid":"https://orcid.org/0000-0001-7246-0610","last_name":"Sadeghi-Kohan","full_name":"Sadeghi-Kohan, Somayeh","id":"78614"},{"orcid":"0000-0002-3717-3939","last_name":"Hellebrand","full_name":"Hellebrand, Sybille","id":"209","first_name":"Sybille"},{"first_name":"Hans-Joachim","last_name":"Wunderlich","full_name":"Wunderlich, Hans-Joachim"}],"title":"Workload-Aware Periodic Interconnect BIST","doi":"10.1109/mdat.2023.3298849","main_file_link":[{"url":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10194315"}],"publication_identifier":{"issn":["2168-2356","2168-2364"]},"publication_status":"published","year":"2023","page":"1-1","citation":{"short":"S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, IEEE Design &#38;Test (2023) 1–1.","bibtex":"@article{Sadeghi-Kohan_Hellebrand_Wunderlich_2023, title={Workload-Aware Periodic Interconnect BIST}, DOI={<a href=\"https://doi.org/10.1109/mdat.2023.3298849\">10.1109/mdat.2023.3298849</a>}, journal={IEEE Design &#38;Test}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2023}, pages={1–1} }","mla":"Sadeghi-Kohan, Somayeh, et al. “Workload-Aware Periodic Interconnect BIST.” <i>IEEE Design &#38;Test</i>, Institute of Electrical and Electronics Engineers (IEEE), 2023, pp. 1–1, doi:<a href=\"https://doi.org/10.1109/mdat.2023.3298849\">10.1109/mdat.2023.3298849</a>.","apa":"Sadeghi-Kohan, S., Hellebrand, S., &#38; Wunderlich, H.-J. (2023). Workload-Aware Periodic Interconnect BIST. <i>IEEE Design &#38;Test</i>, 1–1. <a href=\"https://doi.org/10.1109/mdat.2023.3298849\">https://doi.org/10.1109/mdat.2023.3298849</a>","ama":"Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. Workload-Aware Periodic Interconnect BIST. <i>IEEE Design &#38;Test</i>. Published online 2023:1-1. doi:<a href=\"https://doi.org/10.1109/mdat.2023.3298849\">10.1109/mdat.2023.3298849</a>","chicago":"Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Workload-Aware Periodic Interconnect BIST.” <i>IEEE Design &#38;Test</i>, 2023, 1–1. <a href=\"https://doi.org/10.1109/mdat.2023.3298849\">https://doi.org/10.1109/mdat.2023.3298849</a>.","ieee":"S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, “Workload-Aware Periodic Interconnect BIST,” <i>IEEE Design &#38;Test</i>, pp. 1–1, 2023, doi: <a href=\"https://doi.org/10.1109/mdat.2023.3298849\">10.1109/mdat.2023.3298849</a>."}},{"status":"public","type":"conference","publication":"IEEE International Test Conference (ITC'23), Anaheim, USA, October 2023","language":[{"iso":"eng"}],"_id":"45830","user_id":"209","department":[{"_id":"48"}],"year":"2023","place":"Anaheim, CA, USA","citation":{"chicago":"Jafarzadeh, Hanieh, Florian Klemme, Jan Dennis Reimer, Zahra Paria Najafi Haghi, Hussam  Amrouch, Sybille Hellebrand, and Hans-Joachim  Wunderlich. “Robust Pattern Generation for Small Delay Faults under Process Variations.” In <i>IEEE International Test Conference (ITC’23), Anaheim, USA, October 2023</i>. Anaheim, CA, USA: IEEE, 2023.","ieee":"H. Jafarzadeh <i>et al.</i>, “Robust Pattern Generation for Small Delay Faults under Process Variations,” presented at the IEEE International Test Conference (ITC’23), Anaheim, USA, 2023.","ama":"Jafarzadeh H, Klemme F, Reimer JD, et al. Robust Pattern Generation for Small Delay Faults under Process Variations. In: <i>IEEE International Test Conference (ITC’23), Anaheim, USA, October 2023</i>. IEEE; 2023.","bibtex":"@inproceedings{Jafarzadeh_Klemme_Reimer_Najafi Haghi_ Amrouch_Hellebrand_ Wunderlich_2023, place={Anaheim, CA, USA}, title={Robust Pattern Generation for Small Delay Faults under Process Variations}, booktitle={IEEE International Test Conference (ITC’23), Anaheim, USA, October 2023}, publisher={IEEE}, author={Jafarzadeh, Hanieh and Klemme, Florian and Reimer, Jan Dennis and Najafi Haghi, Zahra Paria and  Amrouch, Hussam and Hellebrand, Sybille and  Wunderlich, Hans-Joachim}, year={2023} }","mla":"Jafarzadeh, Hanieh, et al. “Robust Pattern Generation for Small Delay Faults under Process Variations.” <i>IEEE International Test Conference (ITC’23), Anaheim, USA, October 2023</i>, IEEE, 2023.","short":"H. Jafarzadeh, F. Klemme, J.D. Reimer, Z.P. Najafi Haghi, H.  Amrouch, S. Hellebrand, H.-J.  Wunderlich, in: IEEE International Test Conference (ITC’23), Anaheim, USA, October 2023, IEEE, Anaheim, CA, USA, 2023.","apa":"Jafarzadeh, H., Klemme, F., Reimer, J. D., Najafi Haghi, Z. P.,  Amrouch, H., Hellebrand, S., &#38;  Wunderlich, H.-J. (2023). Robust Pattern Generation for Small Delay Faults under Process Variations. <i>IEEE International Test Conference (ITC’23), Anaheim, USA, October 2023</i>. IEEE International Test Conference (ITC’23), Anaheim, USA."},"publication_status":"published","title":"Robust Pattern Generation for Small Delay Faults under Process Variations","conference":{"end_date":"2023-10-13","location":"Anaheim, USA","name":"IEEE International Test Conference (ITC'23)","start_date":"2023-10-08"},"publisher":"IEEE","date_updated":"2024-03-22T17:14:02Z","author":[{"first_name":"Hanieh","last_name":"Jafarzadeh","full_name":"Jafarzadeh, Hanieh"},{"full_name":"Klemme, Florian","last_name":"Klemme","first_name":"Florian"},{"first_name":"Jan Dennis","last_name":"Reimer","full_name":"Reimer, Jan Dennis","id":"36703"},{"first_name":"Zahra Paria","last_name":"Najafi Haghi","full_name":"Najafi Haghi, Zahra Paria"},{"full_name":" Amrouch, Hussam","last_name":" Amrouch","first_name":"Hussam"},{"full_name":"Hellebrand, Sybille","id":"209","orcid":"0000-0002-3717-3939","last_name":"Hellebrand","first_name":"Sybille"},{"last_name":" Wunderlich","full_name":" Wunderlich, Hans-Joachim","first_name":"Hans-Joachim"}],"date_created":"2023-07-03T08:20:17Z"},{"year":"2023","place":"Erfurt, Germany","page":"2","citation":{"chicago":"Ghazal, Abdulkarim, Somayeh Sadeghi-Kohan, Jan Dennis Reimer, and Sybille Hellebrand. <i>On Cryptography Effects on Interconnect Reliability</i>. Erfurt, Germany: 35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023, 2023.","ieee":"A. Ghazal, S. Sadeghi-Kohan, J. D. Reimer, and S. Hellebrand, <i>On Cryptography Effects on Interconnect Reliability</i>. Erfurt, Germany: 35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023, 2023.","ama":"Ghazal A, Sadeghi-Kohan S, Reimer JD, Hellebrand S. <i>On Cryptography Effects on Interconnect Reliability</i>. 35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023; 2023.","bibtex":"@book{Ghazal_Sadeghi-Kohan_Reimer_Hellebrand_2023, place={Erfurt, Germany}, title={On Cryptography Effects on Interconnect Reliability}, publisher={35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023}, author={Ghazal, Abdulkarim and Sadeghi-Kohan, Somayeh and Reimer, Jan Dennis and Hellebrand, Sybille}, year={2023} }","short":"A. Ghazal, S. Sadeghi-Kohan, J.D. Reimer, S. Hellebrand, On Cryptography Effects on Interconnect Reliability, 35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023, Erfurt, Germany, 2023.","mla":"Ghazal, Abdulkarim, et al. <i>On Cryptography Effects on Interconnect Reliability</i>. 35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023, 2023.","apa":"Ghazal, A., Sadeghi-Kohan, S., Reimer, J. D., &#38; Hellebrand, S. (2023). <i>On Cryptography Effects on Interconnect Reliability</i>. 35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023."},"title":"On Cryptography Effects on Interconnect Reliability","date_updated":"2023-04-06T21:06:37Z","publisher":"35. Workshop \"Testmethoden und Zuverlässigkeit von Schaltungen und Systemen\" (TuZ'23), Feb. 2023","author":[{"last_name":"Ghazal","full_name":"Ghazal, Abdulkarim","first_name":"Abdulkarim"},{"full_name":"Sadeghi-Kohan, Somayeh","id":"78614","last_name":"Sadeghi-Kohan","first_name":"Somayeh"},{"first_name":"Jan Dennis","full_name":"Reimer, Jan Dennis","id":"36703","last_name":"Reimer"},{"first_name":"Sybille","orcid":"0000-0002-3717-3939","last_name":"Hellebrand","id":"209","full_name":"Hellebrand, Sybille"}],"date_created":"2023-01-04T10:20:41Z","status":"public","type":"misc","keyword":["WORKSHOP"],"language":[{"iso":"eng"}],"_id":"35204","department":[{"_id":"48"}],"user_id":"36703"},{"user_id":"36703","_id":"41875","language":[{"iso":"eng"}],"type":"conference","publication":"28th IEEE European Test Symposium (ETS'23), May 2023","status":"public","author":[{"first_name":"Abdalrhman ","full_name":"Badran, Abdalrhman ","last_name":"Badran"},{"first_name":"Somayeh","last_name":"Sadeghi-Kohan","full_name":"Sadeghi-Kohan, Somayeh","id":"78614"},{"first_name":"Jan Dennis","full_name":"Reimer, Jan Dennis","id":"36703","last_name":"Reimer"},{"id":"209","full_name":"Hellebrand, Sybille","orcid":"0000-0002-3717-3939","last_name":"Hellebrand","first_name":"Sybille"}],"date_created":"2023-02-07T13:57:34Z","date_updated":"2023-06-19T14:21:47Z","conference":{"end_date":"2023-05-26","start_date":"2023-05-22"},"title":"Approximate Computing: Balancing Performance, Power, Reliability, and Safety","citation":{"short":"A. Badran, S. Sadeghi-Kohan, J.D. Reimer, S. Hellebrand, in: 28th IEEE European Test Symposium (ETS’23), May 2023, Venice, Italy, 2023.","mla":"Badran, Abdalrhman, et al. “Approximate Computing: Balancing Performance, Power, Reliability, and Safety.” <i>28th IEEE European Test Symposium (ETS’23), May 2023</i>, 2023.","bibtex":"@inproceedings{Badran_Sadeghi-Kohan_Reimer_Hellebrand_2023, place={Venice, Italy}, title={Approximate Computing: Balancing Performance, Power, Reliability, and Safety}, booktitle={28th IEEE European Test Symposium (ETS’23), May 2023}, author={Badran, Abdalrhman  and Sadeghi-Kohan, Somayeh and Reimer, Jan Dennis and Hellebrand, Sybille}, year={2023} }","apa":"Badran, A., Sadeghi-Kohan, S., Reimer, J. D., &#38; Hellebrand, S. (2023). Approximate Computing: Balancing Performance, Power, Reliability, and Safety. <i>28th IEEE European Test Symposium (ETS’23), May 2023</i>.","ama":"Badran A, Sadeghi-Kohan S, Reimer JD, Hellebrand S. Approximate Computing: Balancing Performance, Power, Reliability, and Safety. In: <i>28th IEEE European Test Symposium (ETS’23), May 2023</i>. ; 2023.","ieee":"A. Badran, S. Sadeghi-Kohan, J. D. Reimer, and S. Hellebrand, “Approximate Computing: Balancing Performance, Power, Reliability, and Safety,” 2023.","chicago":"Badran, Abdalrhman , Somayeh Sadeghi-Kohan, Jan Dennis Reimer, and Sybille Hellebrand. “Approximate Computing: Balancing Performance, Power, Reliability, and Safety.” In <i>28th IEEE European Test Symposium (ETS’23), May 2023</i>. Venice, Italy, 2023."},"place":"Venice, Italy","year":"2023"},{"type":"conference","publication":"2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W)","status":"public","user_id":"78614","department":[{"_id":"48"}],"_id":"46739","language":[{"iso":"eng"}],"publication_status":"published","citation":{"ama":"Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication. In: <i>2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W)</i>. IEEE; 2023. doi:<a href=\"https://doi.org/10.1109/dsn-w58399.2023.00056\">10.1109/dsn-w58399.2023.00056</a>","chicago":"Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication.” In <i>2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W)</i>. IEEE, 2023. <a href=\"https://doi.org/10.1109/dsn-w58399.2023.00056\">https://doi.org/10.1109/dsn-w58399.2023.00056</a>.","ieee":"S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, “Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication,” 2023, doi: <a href=\"https://doi.org/10.1109/dsn-w58399.2023.00056\">10.1109/dsn-w58399.2023.00056</a>.","apa":"Sadeghi-Kohan, S., Hellebrand, S., &#38; Wunderlich, H.-J. (2023). Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication. <i>2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W)</i>. <a href=\"https://doi.org/10.1109/dsn-w58399.2023.00056\">https://doi.org/10.1109/dsn-w58399.2023.00056</a>","mla":"Sadeghi-Kohan, Somayeh, et al. “Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication.” <i>2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W)</i>, IEEE, 2023, doi:<a href=\"https://doi.org/10.1109/dsn-w58399.2023.00056\">10.1109/dsn-w58399.2023.00056</a>.","short":"S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, in: 2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W), IEEE, 2023.","bibtex":"@inproceedings{Sadeghi-Kohan_Hellebrand_Wunderlich_2023, title={Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication}, DOI={<a href=\"https://doi.org/10.1109/dsn-w58399.2023.00056\">10.1109/dsn-w58399.2023.00056</a>}, booktitle={2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W)}, publisher={IEEE}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2023} }"},"year":"2023","author":[{"orcid":"https://orcid.org/0000-0001-7246-0610","last_name":"Sadeghi-Kohan","full_name":"Sadeghi-Kohan, Somayeh","id":"78614","first_name":"Somayeh"},{"first_name":"Sybille","last_name":"Hellebrand","orcid":"0000-0002-3717-3939","full_name":"Hellebrand, Sybille","id":"209"},{"last_name":"Wunderlich","full_name":"Wunderlich, Hans-Joachim","first_name":"Hans-Joachim"}],"date_created":"2023-08-26T10:48:31Z","publisher":"IEEE","date_updated":"2023-08-26T10:49:07Z","doi":"10.1109/dsn-w58399.2023.00056","title":"Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication"},{"author":[{"last_name":"Sadeghi-Kohan","full_name":"Sadeghi-Kohan, Somayeh","id":"78614","first_name":"Somayeh"},{"first_name":"Sybille","full_name":"Hellebrand, Sybille","id":"209","last_name":"Hellebrand","orcid":"0000-0002-3717-3939"},{"full_name":"Wunderlich, Hans-Joachim","last_name":"Wunderlich","first_name":"Hans-Joachim"}],"date_created":"2022-01-14T11:16:34Z","publisher":"Springer Science and Business Media LLC","date_updated":"2022-05-11T16:10:01Z","doi":"10.1007/s10836-021-05979-5","title":"Stress-Aware Periodic Test of Interconnects","publication_status":"published","publication_identifier":{"issn":["0923-8174","1573-0727"]},"citation":{"mla":"Sadeghi-Kohan, Somayeh, et al. “Stress-Aware Periodic Test of Interconnects.” <i>Journal of Electronic Testing</i>, Springer Science and Business Media LLC, 2022, doi:<a href=\"https://doi.org/10.1007/s10836-021-05979-5\">10.1007/s10836-021-05979-5</a>.","bibtex":"@article{Sadeghi-Kohan_Hellebrand_Wunderlich_2022, title={Stress-Aware Periodic Test of Interconnects}, DOI={<a href=\"https://doi.org/10.1007/s10836-021-05979-5\">10.1007/s10836-021-05979-5</a>}, journal={Journal of Electronic Testing}, publisher={Springer Science and Business Media LLC}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2022} }","short":"S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, Journal of Electronic Testing (2022).","apa":"Sadeghi-Kohan, S., Hellebrand, S., &#38; Wunderlich, H.-J. (2022). Stress-Aware Periodic Test of Interconnects. <i>Journal of Electronic Testing</i>. <a href=\"https://doi.org/10.1007/s10836-021-05979-5\">https://doi.org/10.1007/s10836-021-05979-5</a>","ieee":"S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, “Stress-Aware Periodic Test of Interconnects,” <i>Journal of Electronic Testing</i>, 2022, doi: <a href=\"https://doi.org/10.1007/s10836-021-05979-5\">10.1007/s10836-021-05979-5</a>.","chicago":"Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Stress-Aware Periodic Test of Interconnects.” <i>Journal of Electronic Testing</i>, 2022. <a href=\"https://doi.org/10.1007/s10836-021-05979-5\">https://doi.org/10.1007/s10836-021-05979-5</a>.","ama":"Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. Stress-Aware Periodic Test of Interconnects. <i>Journal of Electronic Testing</i>. Published online 2022. doi:<a href=\"https://doi.org/10.1007/s10836-021-05979-5\">10.1007/s10836-021-05979-5</a>"},"year":"2022","user_id":"209","department":[{"_id":"48"}],"_id":"29351","language":[{"iso":"eng"}],"article_type":"original","keyword":["Electrical and Electronic Engineering"],"type":"journal_article","publication":"Journal of Electronic Testing","status":"public","abstract":[{"lang":"eng","text":"Safety-critical systems have to follow extremely high dependability requirements as specified in the standards for automotive, air, and space applications. The required high fault coverage at runtime is usually obtained by a combination of concurrent error detection or correction and periodic tests within rather short time intervals. The concurrent scheme ensures the integrity of computed results while the periodic test has to identify potential aging problems and to prevent any fault accumulation which may invalidate the concurrent error detection mechanism. Such periodic built-in self-test (BIST) schemes are already commercialized for memories and for random logic. The paper at hand extends this approach to interconnect structures. A BIST scheme is presented which targets interconnect defects before they will actually affect the system functionality at nominal speed. A BIST schedule is developed which significantly reduces aging caused by electromigration during the lifetime application of the periodic test."}]},{"publication_status":"published","year":"2022","place":"Online","page":"2","citation":{"apa":"Sadeghi-Kohan, S., Hellebrand, S., &#38; Wunderlich, H.-J. (2022). <i>EM-Aware Interconnect BIST</i>. European Workshop on Silicon Lifecycle Management, March 18, 2022.","mla":"Sadeghi-Kohan, Somayeh, et al. <i>EM-Aware Interconnect BIST</i>. European Workshop on Silicon Lifecycle Management, March 18, 2022, 2022.","bibtex":"@book{Sadeghi-Kohan_Hellebrand_Wunderlich_2022, place={Online}, title={EM-Aware Interconnect BIST}, publisher={European Workshop on Silicon Lifecycle Management, March 18, 2022}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2022} }","short":"S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, EM-Aware Interconnect BIST, European Workshop on Silicon Lifecycle Management, March 18, 2022, Online, 2022.","ama":"Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. <i>EM-Aware Interconnect BIST</i>. European Workshop on Silicon Lifecycle Management, March 18, 2022; 2022.","chicago":"Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich. <i>EM-Aware Interconnect BIST</i>. Online: European Workshop on Silicon Lifecycle Management, March 18, 2022, 2022.","ieee":"S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, <i>EM-Aware Interconnect BIST</i>. Online: European Workshop on Silicon Lifecycle Management, March 18, 2022, 2022."},"date_updated":"2022-05-11T17:07:24Z","publisher":"European Workshop on Silicon Lifecycle Management, March 18, 2022","date_created":"2022-02-19T14:21:24Z","author":[{"first_name":"Somayeh","id":"78614","full_name":"Sadeghi-Kohan, Somayeh","last_name":"Sadeghi-Kohan"},{"first_name":"Sybille","id":"209","full_name":"Hellebrand, Sybille","last_name":"Hellebrand","orcid":"0000-0002-3717-3939"},{"full_name":"Wunderlich, Hans-Joachim","last_name":"Wunderlich","first_name":"Hans-Joachim"}],"title":"EM-Aware Interconnect BIST","type":"misc","status":"public","_id":"29890","department":[{"_id":"48"}],"user_id":"209","keyword":["WORKSHOP"],"language":[{"iso":"eng"}]},{"status":"public","type":"conference","publication":"IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT’20), October 2020","language":[{"iso":"eng"}],"user_id":"209","department":[{"_id":"48"}],"_id":"19422","citation":{"ama":"Sprenger A, Sadeghi-Kohan S, Reimer JD, Hellebrand S. Variation-Aware Test for Logic Interconnects using Neural Networks - A Case Study. In: <i>IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT’20), October 2020</i>. ; 2020.","ieee":"A. Sprenger, S. Sadeghi-Kohan, J. D. Reimer, and S. Hellebrand, “Variation-Aware Test for Logic Interconnects using Neural Networks - A Case Study,” 2020.","chicago":"Sprenger, Alexander, Somayeh Sadeghi-Kohan, Jan Dennis Reimer, and Sybille Hellebrand. “Variation-Aware Test for Logic Interconnects Using Neural Networks - A Case Study.” In <i>IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT’20), October 2020</i>. Virtual Conference - Originally Frascati (Rome), Italy, 2020.","apa":"Sprenger, A., Sadeghi-Kohan, S., Reimer, J. D., &#38; Hellebrand, S. (2020). Variation-Aware Test for Logic Interconnects using Neural Networks - A Case Study. <i>IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT’20), October 2020</i>.","mla":"Sprenger, Alexander, et al. “Variation-Aware Test for Logic Interconnects Using Neural Networks - A Case Study.” <i>IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT’20), October 2020</i>, 2020.","short":"A. Sprenger, S. Sadeghi-Kohan, J.D. Reimer, S. 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