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In: <i>IEEE Asian Test Symposium (ATS’23), October 2023</i>. ; 2023."},"date_updated":"2024-01-08T08:49:08Z","author":[{"full_name":"Sadeghi-Kohan, Somayeh","id":"78614","orcid":"https://orcid.org/0000-0001-7246-0610","last_name":"Sadeghi-Kohan","first_name":"Somayeh"},{"first_name":"Jan Dennis","last_name":"Reimer","id":"36703","full_name":"Reimer, Jan Dennis"},{"last_name":"Hellebrand","orcid":"0000-0002-3717-3939","full_name":"Hellebrand, Sybille","id":"209","first_name":"Sybille"},{"first_name":"Hans-Joachim","full_name":"Wunderlich, Hans-Joachim","last_name":"Wunderlich"}],"date_created":"2023-08-26T08:47:52Z","title":"Optimizing the Streaming of Sensor Data with Approximate Communication","conference":{"end_date":"2023-10-17","name":"IEEE Asian Test Symposium (ATS'23)","start_date":"2023-10-14"},"publication":"IEEE Asian Test Symposium (ATS'23), October 2023","type":"conference","status":"public","_id":"46738","department":[{"_id":"48"}],"user_id":"36703","language":[{"iso":"eng"}]},{"page":"1-1","citation":{"ama":"Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. Workload-Aware Periodic Interconnect BIST. <i>IEEE Design &#38;Test</i>. Published online 2023:1-1. doi:<a href=\"https://doi.org/10.1109/mdat.2023.3298849\">10.1109/mdat.2023.3298849</a>","ieee":"S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, “Workload-Aware Periodic Interconnect BIST,” <i>IEEE Design &#38;Test</i>, pp. 1–1, 2023, doi: <a href=\"https://doi.org/10.1109/mdat.2023.3298849\">10.1109/mdat.2023.3298849</a>.","chicago":"Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Workload-Aware Periodic Interconnect BIST.” <i>IEEE Design &#38;Test</i>, 2023, 1–1. <a href=\"https://doi.org/10.1109/mdat.2023.3298849\">https://doi.org/10.1109/mdat.2023.3298849</a>.","bibtex":"@article{Sadeghi-Kohan_Hellebrand_Wunderlich_2023, title={Workload-Aware Periodic Interconnect BIST}, DOI={<a href=\"https://doi.org/10.1109/mdat.2023.3298849\">10.1109/mdat.2023.3298849</a>}, journal={IEEE Design &#38;Test}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2023}, pages={1–1} }","short":"S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, IEEE Design &#38;Test (2023) 1–1.","mla":"Sadeghi-Kohan, Somayeh, et al. “Workload-Aware Periodic Interconnect BIST.” <i>IEEE Design &#38;Test</i>, Institute of Electrical and Electronics Engineers (IEEE), 2023, pp. 1–1, doi:<a href=\"https://doi.org/10.1109/mdat.2023.3298849\">10.1109/mdat.2023.3298849</a>.","apa":"Sadeghi-Kohan, S., Hellebrand, S., &#38; Wunderlich, H.-J. (2023). Workload-Aware Periodic Interconnect BIST. <i>IEEE Design &#38;Test</i>, 1–1. <a href=\"https://doi.org/10.1109/mdat.2023.3298849\">https://doi.org/10.1109/mdat.2023.3298849</a>"},"year":"2023","publication_identifier":{"issn":["2168-2356","2168-2364"]},"publication_status":"published","doi":"10.1109/mdat.2023.3298849","main_file_link":[{"url":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10194315"}],"title":"Workload-Aware Periodic Interconnect BIST","author":[{"full_name":"Sadeghi-Kohan, Somayeh","id":"78614","last_name":"Sadeghi-Kohan","orcid":"https://orcid.org/0000-0001-7246-0610","first_name":"Somayeh"},{"orcid":"0000-0002-3717-3939","last_name":"Hellebrand","full_name":"Hellebrand, Sybille","id":"209","first_name":"Sybille"},{"first_name":"Hans-Joachim","last_name":"Wunderlich","full_name":"Wunderlich, Hans-Joachim"}],"date_created":"2023-08-02T11:07:43Z","date_updated":"2024-03-22T17:15:10Z","publisher":"Institute of Electrical and Electronics Engineers (IEEE)","status":"public","abstract":[{"lang":"eng","text":"System-level interconnects provide the\r\nbackbone for increasingly complex systems on a chip. Their\r\nvulnerability to electromigration and crosstalk can lead to\r\nserious reliability and safety issues during the system lifetime.\r\nThis article presents an approach for periodic in-system testing\r\nwhich maintains a reliability profile to detect potential\r\nproblems before they actually cause a failure. Relying on a\r\ncommon infrastructure for EM-aware system workload\r\nmanagement and test, it minimizes the stress induced by the\r\ntest itself and contributes to the self-healing of system-induced\r\nelectromigration degradations. "}],"publication":"IEEE Design &Test","type":"journal_article","language":[{"iso":"eng"}],"keyword":["Electrical and Electronic Engineering","Hardware and Architecture","Software"],"article_type":"original","department":[{"_id":"48"}],"user_id":"209","_id":"46264"},{"title":"Robust Pattern Generation for Small Delay Faults under Process Variations","conference":{"start_date":"2023-10-08","name":"IEEE International Test Conference (ITC'23)","location":"Anaheim, USA","end_date":"2023-10-13"},"publisher":"IEEE","date_updated":"2024-03-22T17:14:02Z","date_created":"2023-07-03T08:20:17Z","author":[{"last_name":"Jafarzadeh","full_name":"Jafarzadeh, Hanieh","first_name":"Hanieh"},{"full_name":"Klemme, Florian","last_name":"Klemme","first_name":"Florian"},{"id":"36703","full_name":"Reimer, Jan Dennis","last_name":"Reimer","first_name":"Jan Dennis"},{"first_name":"Zahra Paria","last_name":"Najafi Haghi","full_name":"Najafi Haghi, Zahra Paria"},{"last_name":" Amrouch","full_name":" Amrouch, Hussam","first_name":"Hussam"},{"orcid":"0000-0002-3717-3939","last_name":"Hellebrand","id":"209","full_name":"Hellebrand, Sybille","first_name":"Sybille"},{"last_name":" Wunderlich","full_name":" Wunderlich, Hans-Joachim","first_name":"Hans-Joachim"}],"place":"Anaheim, CA, USA","year":"2023","citation":{"mla":"Jafarzadeh, Hanieh, et al. “Robust Pattern Generation for Small Delay Faults under Process Variations.” <i>IEEE International Test Conference (ITC’23), Anaheim, USA, October 2023</i>, IEEE, 2023.","short":"H. Jafarzadeh, F. Klemme, J.D. Reimer, Z.P. Najafi Haghi, H.  Amrouch, S. Hellebrand, H.-J.  Wunderlich, in: IEEE International Test Conference (ITC’23), Anaheim, USA, October 2023, IEEE, Anaheim, CA, USA, 2023.","bibtex":"@inproceedings{Jafarzadeh_Klemme_Reimer_Najafi Haghi_ Amrouch_Hellebrand_ Wunderlich_2023, place={Anaheim, CA, USA}, title={Robust Pattern Generation for Small Delay Faults under Process Variations}, booktitle={IEEE International Test Conference (ITC’23), Anaheim, USA, October 2023}, publisher={IEEE}, author={Jafarzadeh, Hanieh and Klemme, Florian and Reimer, Jan Dennis and Najafi Haghi, Zahra Paria and  Amrouch, Hussam and Hellebrand, Sybille and  Wunderlich, Hans-Joachim}, year={2023} }","apa":"Jafarzadeh, H., Klemme, F., Reimer, J. D., Najafi Haghi, Z. P.,  Amrouch, H., Hellebrand, S., &#38;  Wunderlich, H.-J. (2023). Robust Pattern Generation for Small Delay Faults under Process Variations. <i>IEEE International Test Conference (ITC’23), Anaheim, USA, October 2023</i>. IEEE International Test Conference (ITC’23), Anaheim, USA.","ama":"Jafarzadeh H, Klemme F, Reimer JD, et al. Robust Pattern Generation for Small Delay Faults under Process Variations. In: <i>IEEE International Test Conference (ITC’23), Anaheim, USA, October 2023</i>. IEEE; 2023.","chicago":"Jafarzadeh, Hanieh, Florian Klemme, Jan Dennis Reimer, Zahra Paria Najafi Haghi, Hussam  Amrouch, Sybille Hellebrand, and Hans-Joachim  Wunderlich. “Robust Pattern Generation for Small Delay Faults under Process Variations.” In <i>IEEE International Test Conference (ITC’23), Anaheim, USA, October 2023</i>. Anaheim, CA, USA: IEEE, 2023.","ieee":"H. Jafarzadeh <i>et al.</i>, “Robust Pattern Generation for Small Delay Faults under Process Variations,” presented at the IEEE International Test Conference (ITC’23), Anaheim, USA, 2023."},"publication_status":"published","language":[{"iso":"eng"}],"_id":"45830","department":[{"_id":"48"}],"user_id":"209","status":"public","publication":"IEEE International Test Conference (ITC'23), Anaheim, USA, October 2023","type":"conference"},{"place":"Erfurt, Germany","year":"2023","citation":{"chicago":"Ghazal, Abdulkarim, Somayeh Sadeghi-Kohan, Jan Dennis Reimer, and Sybille Hellebrand. <i>On Cryptography Effects on Interconnect Reliability</i>. Erfurt, Germany: 35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023, 2023.","ieee":"A. Ghazal, S. Sadeghi-Kohan, J. D. Reimer, and S. Hellebrand, <i>On Cryptography Effects on Interconnect Reliability</i>. Erfurt, Germany: 35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023, 2023.","ama":"Ghazal A, Sadeghi-Kohan S, Reimer JD, Hellebrand S. <i>On Cryptography Effects on Interconnect Reliability</i>. 35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023; 2023.","apa":"Ghazal, A., Sadeghi-Kohan, S., Reimer, J. D., &#38; Hellebrand, S. (2023). <i>On Cryptography Effects on Interconnect Reliability</i>. 35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023.","short":"A. Ghazal, S. Sadeghi-Kohan, J.D. Reimer, S. Hellebrand, On Cryptography Effects on Interconnect Reliability, 35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023, Erfurt, Germany, 2023.","bibtex":"@book{Ghazal_Sadeghi-Kohan_Reimer_Hellebrand_2023, place={Erfurt, Germany}, title={On Cryptography Effects on Interconnect Reliability}, publisher={35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023}, author={Ghazal, Abdulkarim and Sadeghi-Kohan, Somayeh and Reimer, Jan Dennis and Hellebrand, Sybille}, year={2023} }","mla":"Ghazal, Abdulkarim, et al. <i>On Cryptography Effects on Interconnect Reliability</i>. 35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023, 2023."},"page":"2","title":"On Cryptography Effects on Interconnect Reliability","date_updated":"2023-04-06T21:06:37Z","publisher":"35. Workshop \"Testmethoden und Zuverlässigkeit von Schaltungen und Systemen\" (TuZ'23), Feb. 2023","author":[{"full_name":"Ghazal, Abdulkarim","last_name":"Ghazal","first_name":"Abdulkarim"},{"full_name":"Sadeghi-Kohan, Somayeh","id":"78614","last_name":"Sadeghi-Kohan","first_name":"Somayeh"},{"id":"36703","full_name":"Reimer, Jan Dennis","last_name":"Reimer","first_name":"Jan Dennis"},{"first_name":"Sybille","full_name":"Hellebrand, Sybille","id":"209","orcid":"0000-0002-3717-3939","last_name":"Hellebrand"}],"date_created":"2023-01-04T10:20:41Z","status":"public","type":"misc","keyword":["WORKSHOP"],"language":[{"iso":"eng"}],"_id":"35204","user_id":"36703","department":[{"_id":"48"}]},{"language":[{"iso":"eng"}],"user_id":"36703","_id":"41875","status":"public","publication":"28th IEEE European Test Symposium (ETS'23), May 2023","type":"conference","conference":{"start_date":"2023-05-22","end_date":"2023-05-26"},"title":"Approximate Computing: Balancing Performance, Power, Reliability, and Safety","author":[{"last_name":"Badran","full_name":"Badran, Abdalrhman ","first_name":"Abdalrhman "},{"id":"78614","full_name":"Sadeghi-Kohan, Somayeh","last_name":"Sadeghi-Kohan","first_name":"Somayeh"},{"last_name":"Reimer","full_name":"Reimer, Jan Dennis","id":"36703","first_name":"Jan Dennis"},{"first_name":"Sybille","full_name":"Hellebrand, Sybille","id":"209","last_name":"Hellebrand","orcid":"0000-0002-3717-3939"}],"date_created":"2023-02-07T13:57:34Z","date_updated":"2023-06-19T14:21:47Z","citation":{"ama":"Badran A, Sadeghi-Kohan S, Reimer JD, Hellebrand S. Approximate Computing: Balancing Performance, Power, Reliability, and Safety. In: <i>28th IEEE European Test Symposium (ETS’23), May 2023</i>. ; 2023.","chicago":"Badran, Abdalrhman , Somayeh Sadeghi-Kohan, Jan Dennis Reimer, and Sybille Hellebrand. “Approximate Computing: Balancing Performance, Power, Reliability, and Safety.” In <i>28th IEEE European Test Symposium (ETS’23), May 2023</i>. Venice, Italy, 2023.","ieee":"A. Badran, S. Sadeghi-Kohan, J. D. Reimer, and S. Hellebrand, “Approximate Computing: Balancing Performance, Power, Reliability, and Safety,” 2023.","apa":"Badran, A., Sadeghi-Kohan, S., Reimer, J. D., &#38; Hellebrand, S. (2023). Approximate Computing: Balancing Performance, Power, Reliability, and Safety. <i>28th IEEE European Test Symposium (ETS’23), May 2023</i>.","mla":"Badran, Abdalrhman, et al. “Approximate Computing: Balancing Performance, Power, Reliability, and Safety.” <i>28th IEEE European Test Symposium (ETS’23), May 2023</i>, 2023.","bibtex":"@inproceedings{Badran_Sadeghi-Kohan_Reimer_Hellebrand_2023, place={Venice, Italy}, title={Approximate Computing: Balancing Performance, Power, Reliability, and Safety}, booktitle={28th IEEE European Test Symposium (ETS’23), May 2023}, author={Badran, Abdalrhman  and Sadeghi-Kohan, Somayeh and Reimer, Jan Dennis and Hellebrand, Sybille}, year={2023} }","short":"A. Badran, S. Sadeghi-Kohan, J.D. Reimer, S. Hellebrand, in: 28th IEEE European Test Symposium (ETS’23), May 2023, Venice, Italy, 2023."},"year":"2023","place":"Venice, Italy"},{"publication_status":"published","year":"2023","citation":{"chicago":"Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication.” In <i>2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W)</i>. IEEE, 2023. <a href=\"https://doi.org/10.1109/dsn-w58399.2023.00056\">https://doi.org/10.1109/dsn-w58399.2023.00056</a>.","ieee":"S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, “Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication,” 2023, doi: <a href=\"https://doi.org/10.1109/dsn-w58399.2023.00056\">10.1109/dsn-w58399.2023.00056</a>.","ama":"Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication. In: <i>2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W)</i>. IEEE; 2023. doi:<a href=\"https://doi.org/10.1109/dsn-w58399.2023.00056\">10.1109/dsn-w58399.2023.00056</a>","bibtex":"@inproceedings{Sadeghi-Kohan_Hellebrand_Wunderlich_2023, title={Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication}, DOI={<a href=\"https://doi.org/10.1109/dsn-w58399.2023.00056\">10.1109/dsn-w58399.2023.00056</a>}, booktitle={2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W)}, publisher={IEEE}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2023} }","short":"S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, in: 2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W), IEEE, 2023.","mla":"Sadeghi-Kohan, Somayeh, et al. “Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication.” <i>2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W)</i>, IEEE, 2023, doi:<a href=\"https://doi.org/10.1109/dsn-w58399.2023.00056\">10.1109/dsn-w58399.2023.00056</a>.","apa":"Sadeghi-Kohan, S., Hellebrand, S., &#38; Wunderlich, H.-J. (2023). Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication. <i>2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W)</i>. <a href=\"https://doi.org/10.1109/dsn-w58399.2023.00056\">https://doi.org/10.1109/dsn-w58399.2023.00056</a>"},"publisher":"IEEE","date_updated":"2023-08-26T10:49:07Z","author":[{"full_name":"Sadeghi-Kohan, Somayeh","id":"78614","last_name":"Sadeghi-Kohan","orcid":"https://orcid.org/0000-0001-7246-0610","first_name":"Somayeh"},{"last_name":"Hellebrand","orcid":"0000-0002-3717-3939","full_name":"Hellebrand, Sybille","id":"209","first_name":"Sybille"},{"first_name":"Hans-Joachim","last_name":"Wunderlich","full_name":"Wunderlich, Hans-Joachim"}],"date_created":"2023-08-26T10:48:31Z","title":"Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication","doi":"10.1109/dsn-w58399.2023.00056","type":"conference","publication":"2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W)","status":"public","_id":"46739","user_id":"78614","department":[{"_id":"48"}],"language":[{"iso":"eng"}]},{"language":[{"iso":"eng"}],"article_type":"original","keyword":["Electrical and Electronic Engineering"],"user_id":"209","department":[{"_id":"48"}],"_id":"29351","status":"public","abstract":[{"lang":"eng","text":"Safety-critical systems have to follow extremely high dependability requirements as specified in the standards for automotive, air, and space applications. The required high fault coverage at runtime is usually obtained by a combination of concurrent error detection or correction and periodic tests within rather short time intervals. The concurrent scheme ensures the integrity of computed results while the periodic test has to identify potential aging problems and to prevent any fault accumulation which may invalidate the concurrent error detection mechanism. Such periodic built-in self-test (BIST) schemes are already commercialized for memories and for random logic. The paper at hand extends this approach to interconnect structures. A BIST scheme is presented which targets interconnect defects before they will actually affect the system functionality at nominal speed. A BIST schedule is developed which significantly reduces aging caused by electromigration during the lifetime application of the periodic test."}],"type":"journal_article","publication":"Journal of Electronic Testing","doi":"10.1007/s10836-021-05979-5","title":"Stress-Aware Periodic Test of Interconnects","date_created":"2022-01-14T11:16:34Z","author":[{"id":"78614","full_name":"Sadeghi-Kohan, Somayeh","last_name":"Sadeghi-Kohan","first_name":"Somayeh"},{"first_name":"Sybille","last_name":"Hellebrand","orcid":"0000-0002-3717-3939","id":"209","full_name":"Hellebrand, Sybille"},{"full_name":"Wunderlich, Hans-Joachim","last_name":"Wunderlich","first_name":"Hans-Joachim"}],"publisher":"Springer Science and Business Media LLC","date_updated":"2022-05-11T16:10:01Z","citation":{"chicago":"Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Stress-Aware Periodic Test of Interconnects.” <i>Journal of Electronic Testing</i>, 2022. <a href=\"https://doi.org/10.1007/s10836-021-05979-5\">https://doi.org/10.1007/s10836-021-05979-5</a>.","ieee":"S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, “Stress-Aware Periodic Test of Interconnects,” <i>Journal of Electronic Testing</i>, 2022, doi: <a href=\"https://doi.org/10.1007/s10836-021-05979-5\">10.1007/s10836-021-05979-5</a>.","ama":"Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. Stress-Aware Periodic Test of Interconnects. <i>Journal of Electronic Testing</i>. Published online 2022. doi:<a href=\"https://doi.org/10.1007/s10836-021-05979-5\">10.1007/s10836-021-05979-5</a>","mla":"Sadeghi-Kohan, Somayeh, et al. “Stress-Aware Periodic Test of Interconnects.” <i>Journal of Electronic Testing</i>, Springer Science and Business Media LLC, 2022, doi:<a href=\"https://doi.org/10.1007/s10836-021-05979-5\">10.1007/s10836-021-05979-5</a>.","bibtex":"@article{Sadeghi-Kohan_Hellebrand_Wunderlich_2022, title={Stress-Aware Periodic Test of Interconnects}, DOI={<a href=\"https://doi.org/10.1007/s10836-021-05979-5\">10.1007/s10836-021-05979-5</a>}, journal={Journal of Electronic Testing}, publisher={Springer Science and Business Media LLC}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2022} }","short":"S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, Journal of Electronic Testing (2022).","apa":"Sadeghi-Kohan, S., Hellebrand, S., &#38; Wunderlich, H.-J. (2022). Stress-Aware Periodic Test of Interconnects. <i>Journal of Electronic Testing</i>. <a href=\"https://doi.org/10.1007/s10836-021-05979-5\">https://doi.org/10.1007/s10836-021-05979-5</a>"},"year":"2022","publication_status":"published","publication_identifier":{"issn":["0923-8174","1573-0727"]}},{"_id":"29890","department":[{"_id":"48"}],"user_id":"209","keyword":["WORKSHOP"],"language":[{"iso":"eng"}],"type":"misc","status":"public","date_updated":"2022-05-11T17:07:24Z","publisher":"European Workshop on Silicon Lifecycle Management, March 18, 2022","author":[{"first_name":"Somayeh","last_name":"Sadeghi-Kohan","id":"78614","full_name":"Sadeghi-Kohan, Somayeh"},{"first_name":"Sybille","id":"209","full_name":"Hellebrand, Sybille","orcid":"0000-0002-3717-3939","last_name":"Hellebrand"},{"first_name":"Hans-Joachim","full_name":"Wunderlich, Hans-Joachim","last_name":"Wunderlich"}],"date_created":"2022-02-19T14:21:24Z","title":"EM-Aware Interconnect BIST","publication_status":"published","place":"Online","year":"2022","page":"2","citation":{"ieee":"S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, <i>EM-Aware Interconnect BIST</i>. Online: European Workshop on Silicon Lifecycle Management, March 18, 2022, 2022.","chicago":"Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich. <i>EM-Aware Interconnect BIST</i>. Online: European Workshop on Silicon Lifecycle Management, March 18, 2022, 2022.","ama":"Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. <i>EM-Aware Interconnect BIST</i>. European Workshop on Silicon Lifecycle Management, March 18, 2022; 2022.","apa":"Sadeghi-Kohan, S., Hellebrand, S., &#38; Wunderlich, H.-J. (2022). <i>EM-Aware Interconnect BIST</i>. European Workshop on Silicon Lifecycle Management, March 18, 2022.","mla":"Sadeghi-Kohan, Somayeh, et al. <i>EM-Aware Interconnect BIST</i>. European Workshop on Silicon Lifecycle Management, March 18, 2022, 2022.","bibtex":"@book{Sadeghi-Kohan_Hellebrand_Wunderlich_2022, place={Online}, title={EM-Aware Interconnect BIST}, publisher={European Workshop on Silicon Lifecycle Management, March 18, 2022}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2022} }","short":"S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, EM-Aware Interconnect BIST, European Workshop on Silicon Lifecycle Management, March 18, 2022, Online, 2022."}},{"status":"public","publication":"IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT’20), October 2020","type":"conference","language":[{"iso":"eng"}],"department":[{"_id":"48"}],"user_id":"209","_id":"19422","citation":{"short":"A. Sprenger, S. Sadeghi-Kohan, J.D. Reimer, S. Hellebrand, in: IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT’20), October 2020, Virtual Conference - Originally Frascati (Rome), Italy, 2020.","mla":"Sprenger, Alexander, et al. “Variation-Aware Test for Logic Interconnects Using Neural Networks - A Case Study.” <i>IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT’20), October 2020</i>, 2020.","bibtex":"@inproceedings{Sprenger_Sadeghi-Kohan_Reimer_Hellebrand_2020, place={Virtual Conference - Originally Frascati (Rome), Italy}, title={Variation-Aware Test for Logic Interconnects using Neural Networks - A Case Study}, booktitle={IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT’20), October 2020}, author={Sprenger, Alexander and Sadeghi-Kohan, Somayeh and Reimer, Jan Dennis and Hellebrand, Sybille}, year={2020} }","apa":"Sprenger, A., Sadeghi-Kohan, S., Reimer, J. 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