---
_id: '52744'
author:
- first_name: Hanieh
  full_name: Jafarzadeh, Hanieh
  last_name: Jafarzadeh
- first_name: Florian
  full_name: Klemme, Florian
  last_name: Klemme
- first_name: Hussam
  full_name: Amrouch, Hussam
  last_name: Amrouch
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
- first_name: Hans-Joachim
  full_name: Wunderlich, Hans-Joachim
  last_name: Wunderlich
citation:
  ama: 'Jafarzadeh H, Klemme F, Amrouch H, Hellebrand S, Wunderlich H-J. Time and
    Space Optimized Storage-based BIST under Multiple Voltages and Variations. In:
    <i>European Test Symposium, The Hague, Netherlands, May 20-24, 2024</i>. IEEE;
    :6.'
  apa: Jafarzadeh, H., Klemme, F., Amrouch, H., Hellebrand, S., &#38; Wunderlich,
    H.-J. (n.d.). Time and Space Optimized Storage-based BIST under Multiple Voltages
    and Variations. <i>European Test Symposium, The Hague, Netherlands, May 20-24,
    2024</i>, 6.
  bibtex: '@inproceedings{Jafarzadeh_Klemme_Amrouch_Hellebrand_Wunderlich, title={Time
    and Space Optimized Storage-based BIST under Multiple Voltages and Variations},
    booktitle={European Test Symposium, The Hague, Netherlands, May 20-24, 2024},
    publisher={IEEE}, author={Jafarzadeh, Hanieh and Klemme, Florian and Amrouch,
    Hussam and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, pages={6} }'
  chicago: Jafarzadeh, Hanieh, Florian Klemme, Hussam Amrouch, Sybille Hellebrand,
    and Hans-Joachim Wunderlich. “Time and Space Optimized Storage-Based BIST under
    Multiple Voltages and Variations.” In <i>European Test Symposium, The Hague, Netherlands,
    May 20-24, 2024</i>, 6. IEEE, n.d.
  ieee: H. Jafarzadeh, F. Klemme, H. Amrouch, S. Hellebrand, and H.-J. Wunderlich,
    “Time and Space Optimized Storage-based BIST under Multiple Voltages and Variations,”
    in <i>European Test Symposium, The Hague, Netherlands, May 20-24, 2024</i>, The
    Hague, NL, p. 6.
  mla: Jafarzadeh, Hanieh, et al. “Time and Space Optimized Storage-Based BIST under
    Multiple Voltages and Variations.” <i>European Test Symposium, The Hague, Netherlands,
    May 20-24, 2024</i>, IEEE, p. 6.
  short: 'H. Jafarzadeh, F. Klemme, H. Amrouch, S. Hellebrand, H.-J. Wunderlich, in:
    European Test Symposium, The Hague, Netherlands, May 20-24, 2024, IEEE, n.d.,
    p. 6.'
conference:
  end_date: 2024-05-24
  location: The Hague, NL
  name: IEEE European Test Symposium
  start_date: 2024-05-20
date_created: 2024-03-22T17:04:25Z
date_updated: 2024-03-22T17:05:29Z
department:
- _id: '48'
language:
- iso: eng
page: '6'
publication: European Test Symposium, The Hague, Netherlands, May 20-24, 2024
publication_status: accepted
publisher: IEEE
quality_controlled: '1'
status: public
title: Time and Space Optimized Storage-based BIST under Multiple Voltages and Variations
type: conference
user_id: '209'
year: '2024'
...
---
_id: '52742'
author:
- first_name: Hanieh
  full_name: Jafarzadeh, Hanieh
  last_name: Jafarzadeh
- first_name: Florian
  full_name: Klemme, Florian
  last_name: Klemme
- first_name: Hussam
  full_name: Amrouch, Hussam
  last_name: Amrouch
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
- first_name: Hans-Joachim
  full_name: Wunderlich, Hans-Joachim
  last_name: Wunderlich
citation:
  ama: 'Jafarzadeh H, Klemme F, Amrouch H, Hellebrand S, Wunderlich H-J. Vmin Testing
    under Variations: Defect vs. Fault Coverage. In: <i>IEEE Latin American Test Symposium
    (LATS), Maceió, Brazil, April 9-12, 2024</i>. IEEE; :6.'
  apa: 'Jafarzadeh, H., Klemme, F., Amrouch, H., Hellebrand, S., &#38; Wunderlich,
    H.-J. (n.d.). Vmin Testing under Variations: Defect vs. Fault Coverage. <i>IEEE
    Latin American Test Symposium (LATS), Maceió, Brazil, April 9-12, 2024</i>, 6.'
  bibtex: '@inproceedings{Jafarzadeh_Klemme_Amrouch_Hellebrand_Wunderlich, title={Vmin
    Testing under Variations: Defect vs. Fault Coverage}, booktitle={IEEE Latin American
    Test Symposium (LATS), Maceió, Brazil, April 9-12, 2024}, publisher={IEEE}, author={Jafarzadeh,
    Hanieh and Klemme, Florian and Amrouch, Hussam and Hellebrand, Sybille and Wunderlich,
    Hans-Joachim}, pages={6} }'
  chicago: 'Jafarzadeh, Hanieh, Florian Klemme, Hussam Amrouch, Sybille Hellebrand,
    and Hans-Joachim Wunderlich. “Vmin Testing under Variations: Defect vs. Fault
    Coverage.” In <i>IEEE Latin American Test Symposium (LATS), Maceió, Brazil, April
    9-12, 2024</i>, 6. IEEE, n.d.'
  ieee: 'H. Jafarzadeh, F. Klemme, H. Amrouch, S. Hellebrand, and H.-J. Wunderlich,
    “Vmin Testing under Variations: Defect vs. Fault Coverage,” in <i>IEEE Latin American
    Test Symposium (LATS), Maceió, Brazil, April 9-12, 2024</i>, Maceió, p. 6.'
  mla: 'Jafarzadeh, Hanieh, et al. “Vmin Testing under Variations: Defect vs. Fault
    Coverage.” <i>IEEE Latin American Test Symposium (LATS), Maceió, Brazil, April
    9-12, 2024</i>, IEEE, p. 6.'
  short: 'H. Jafarzadeh, F. Klemme, H. Amrouch, S. Hellebrand, H.-J. Wunderlich, in:
    IEEE Latin American Test Symposium (LATS), Maceió, Brazil, April 9-12, 2024, IEEE,
    n.d., p. 6.'
conference:
  end_date: 2024-04-12
  location: Maceió
  name: IEEE Latin American Test Symposium (LATS)
  start_date: 2024-04-09
date_created: 2024-03-22T16:49:22Z
date_updated: 2024-03-22T17:06:40Z
department:
- _id: '48'
language:
- iso: eng
page: '6'
publication: IEEE Latin American Test Symposium (LATS), Maceió, Brazil, April 9-12,
  2024
publication_status: accepted
publisher: IEEE
quality_controlled: '1'
status: public
title: 'Vmin Testing under Variations: Defect vs. Fault Coverage'
type: conference
user_id: '209'
year: '2024'
...
---
_id: '52743'
author:
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
  orcid: https://orcid.org/0000-0001-7246-0610
- first_name: Hans-Joachim
  full_name: Wunderlich, Hans-Joachim
  last_name: Wunderlich
citation:
  ama: 'Hellebrand S, Sadeghi-Kohan S, Wunderlich H-J. Functional Safety and Reliability
    of Interconnects throughout the Silicon Life Cycle. In: <i>International Symposium
    of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>. ; :1.'
  apa: Hellebrand, S., Sadeghi-Kohan, S., &#38; Wunderlich, H.-J. (n.d.). Functional
    Safety and Reliability of Interconnects throughout the Silicon Life Cycle. <i>International
    Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>, 1.
  bibtex: '@inproceedings{Hellebrand_Sadeghi-Kohan_Wunderlich, title={Functional Safety
    and Reliability of Interconnects throughout the Silicon Life Cycle}, booktitle={International
    Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024}, author={Hellebrand,
    Sybille and Sadeghi-Kohan, Somayeh and Wunderlich, Hans-Joachim}, pages={1} }'
  chicago: Hellebrand, Sybille, Somayeh Sadeghi-Kohan, and Hans-Joachim Wunderlich.
    “Functional Safety and Reliability of Interconnects throughout the Silicon Life
    Cycle.” In <i>International Symposium of EDA (ISEDA), Xi’an, China, May 10-13,
    2024</i>, 1, n.d.
  ieee: S. Hellebrand, S. Sadeghi-Kohan, and H.-J. Wunderlich, “Functional Safety
    and Reliability of Interconnects throughout the Silicon Life Cycle,” in <i>International
    Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>, Xi’an, China, p.
    1.
  mla: Hellebrand, Sybille, et al. “Functional Safety and Reliability of Interconnects
    throughout the Silicon Life Cycle.” <i>International Symposium of EDA (ISEDA),
    Xi’an, China, May 10-13, 2024</i>, p. 1.
  short: 'S. Hellebrand, S. Sadeghi-Kohan, H.-J. Wunderlich, in: International Symposium
    of EDA (ISEDA), Xi’an, China, May 10-13, 2024, n.d., p. 1.'
conference:
  end_date: 2024-05-13
  location: Xi'an, China
  name: International Symposium of EDA (ISEDA)
  start_date: 2024-05-10
date_created: 2024-03-22T16:57:53Z
date_updated: 2024-03-22T17:06:02Z
department:
- _id: '48'
language:
- iso: eng
page: '1'
publication: International Symposium of EDA (ISEDA), Xi'an, China, May 10-13, 2024
publication_status: accepted
status: public
title: Functional Safety and Reliability of Interconnects throughout the Silicon Life
  Cycle
type: conference
user_id: '209'
year: '2024'
...
---
_id: '52745'
author:
- first_name: Hans-Joachim
  full_name: Wunderlich, Hans-Joachim
  last_name: Wunderlich
- first_name: Hanieh
  full_name: Jafarzadeh, Hanieh
  last_name: Jafarzadeh
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
citation:
  ama: 'Wunderlich H-J, Jafarzadeh H, Hellebrand S. Robust Test of Small Delay Faults
    under  PVT-Variations. In: <i>International Symposium of EDA (ISEDA), Xi’an, China,
    May 10-13, 2024</i>. ; :1.'
  apa: Wunderlich, H.-J., Jafarzadeh, H., &#38; Hellebrand, S. (n.d.). Robust Test
    of Small Delay Faults under  PVT-Variations. <i>International Symposium of EDA
    (ISEDA), Xi’an, China, May 10-13, 2024</i>, 1.
  bibtex: '@inproceedings{Wunderlich_Jafarzadeh_Hellebrand, title={Robust Test of
    Small Delay Faults under  PVT-Variations}, booktitle={International Symposium
    of EDA (ISEDA), Xi’an, China, May 10-13, 2024}, author={Wunderlich, Hans-Joachim
    and Jafarzadeh, Hanieh and Hellebrand, Sybille}, pages={1} }'
  chicago: Wunderlich, Hans-Joachim, Hanieh Jafarzadeh, and Sybille Hellebrand. “Robust
    Test of Small Delay Faults under  PVT-Variations.” In <i>International Symposium
    of EDA (ISEDA), Xi’an, China, May 10-13, 2024</i>, 1, n.d.
  ieee: H.-J. Wunderlich, H. Jafarzadeh, and S. Hellebrand, “Robust Test of Small
    Delay Faults under  PVT-Variations,” in <i>International Symposium of EDA (ISEDA),
    Xi’an, China, May 10-13, 2024</i>, Xi’an, China, p. 1.
  mla: Wunderlich, Hans-Joachim, et al. “Robust Test of Small Delay Faults under 
    PVT-Variations.” <i>International Symposium of EDA (ISEDA), Xi’an, China, May
    10-13, 2024</i>, p. 1.
  short: 'H.-J. Wunderlich, H. Jafarzadeh, S. Hellebrand, in: International Symposium
    of EDA (ISEDA), Xi’an, China, May 10-13, 2024, n.d., p. 1.'
conference:
  end_date: 2024-05-13
  location: Xi’an, China
  name: International Symposium of EDA (ISEDA)
  start_date: 2024-05-10
date_created: 2024-03-22T17:11:03Z
date_updated: 2024-03-22T17:11:16Z
department:
- _id: '48'
language:
- iso: eng
page: '1'
publication: International Symposium of EDA (ISEDA), Xi’an, China, May 10-13, 2024
publication_status: accepted
status: public
title: Robust Test of Small Delay Faults under  PVT-Variations
type: conference
user_id: '209'
year: '2024'
...
---
_id: '50284'
author:
- first_name: Alisa
  full_name: Stiballe, Alisa
  last_name: Stiballe
- first_name: Jan Dennis
  full_name: Reimer, Jan Dennis
  id: '36703'
  last_name: Reimer
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
  orcid: https://orcid.org/0000-0001-7246-0610
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
citation:
  ama: Stiballe A, Reimer JD, Sadeghi-Kohan S, Hellebrand S. <i>Modeling Crosstalk-Induced
    Interconnect Delay with Polynomial Regression</i>. 37. ITG / GMM / GI -Workshop
    “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb.
    2024; 2024.
  apa: Stiballe, A., Reimer, J. D., Sadeghi-Kohan, S., &#38; Hellebrand, S. (2024).
    <i>Modeling Crosstalk-induced Interconnect Delay with Polynomial Regression</i>.
    37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen
    und Systemen”  (TuZ’24), Feb. 2024.
  bibtex: '@book{Stiballe_Reimer_Sadeghi-Kohan_Hellebrand_2024, place={Darmstadt,
    Germany}, title={Modeling Crosstalk-induced Interconnect Delay with Polynomial
    Regression}, publisher={37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit
    von Schaltungen und Systemen”  (TuZ’24), Feb. 2024}, author={Stiballe, Alisa and
    Reimer, Jan Dennis and Sadeghi-Kohan, Somayeh and Hellebrand, Sybille}, year={2024}
    }'
  chicago: 'Stiballe, Alisa, Jan Dennis Reimer, Somayeh Sadeghi-Kohan, and Sybille
    Hellebrand. <i>Modeling Crosstalk-Induced Interconnect Delay with Polynomial Regression</i>.
    Darmstadt, Germany: 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit
    von Schaltungen und Systemen”  (TuZ’24), Feb. 2024, 2024.'
  ieee: 'A. Stiballe, J. D. Reimer, S. Sadeghi-Kohan, and S. Hellebrand, <i>Modeling
    Crosstalk-induced Interconnect Delay with Polynomial Regression</i>. Darmstadt,
    Germany: 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen
    und Systemen”  (TuZ’24), Feb. 2024, 2024.'
  mla: Stiballe, Alisa, et al. <i>Modeling Crosstalk-Induced Interconnect Delay with
    Polynomial Regression</i>. 37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit
    von Schaltungen und Systemen”  (TuZ’24), Feb. 2024, 2024.
  short: A. Stiballe, J.D. Reimer, S. Sadeghi-Kohan, S. Hellebrand, Modeling Crosstalk-Induced
    Interconnect Delay with Polynomial Regression, 37. ITG / GMM / GI -Workshop “Testmethoden
    und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024, Darmstadt,
    Germany, 2024.
date_created: 2024-01-08T08:47:32Z
date_updated: 2024-03-22T17:12:39Z
department:
- _id: '48'
language:
- iso: eng
place: Darmstadt, Germany
publication_status: published
publisher: 37. ITG / GMM / GI -Workshop "Testmethoden und Zuverlässigkeit von Schaltungen
  und Systemen"  (TuZ'24), Feb. 2024
status: public
title: Modeling Crosstalk-induced Interconnect Delay with Polynomial Regression
type: misc
user_id: '209'
year: '2024'
...
---
_id: '51799'
author:
- first_name: 'Magdalina '
  full_name: 'Ustimova, Magdalina '
  last_name: Ustimova
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
  orcid: https://orcid.org/0000-0001-7246-0610
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
citation:
  ama: Ustimova M, Sadeghi-Kohan S, Hellebrand S. <i>Crosstalk-Aware Simulation of
    Interconnects Using Artificial Neural Networks</i>. 37. ITG / GMM / GI -Workshop
    “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb.
    2024; 2024.
  apa: Ustimova, M., Sadeghi-Kohan, S., &#38; Hellebrand, S. (2024). <i>Crosstalk-Aware
    Simulation of Interconnects Using Artificial Neural Networks</i>. 37. ITG / GMM
    / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” 
    (TuZ’24), Feb. 2024.
  bibtex: '@book{Ustimova_Sadeghi-Kohan_Hellebrand_2024, place={Darmstadt, Germany},
    title={Crosstalk-Aware Simulation of Interconnects Using Artificial Neural Networks},
    publisher={37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von
    Schaltungen und Systemen”  (TuZ’24), Feb. 2024}, author={Ustimova, Magdalina  and
    Sadeghi-Kohan, Somayeh and Hellebrand, Sybille}, year={2024} }'
  chicago: 'Ustimova, Magdalina , Somayeh Sadeghi-Kohan, and Sybille Hellebrand. <i>Crosstalk-Aware
    Simulation of Interconnects Using Artificial Neural Networks</i>. Darmstadt, Germany:
    37. ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen
    und Systemen”  (TuZ’24), Feb. 2024, 2024.'
  ieee: 'M. Ustimova, S. Sadeghi-Kohan, and S. Hellebrand, <i>Crosstalk-Aware Simulation
    of Interconnects Using Artificial Neural Networks</i>. Darmstadt, Germany: 37.
    ITG / GMM / GI -Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und
    Systemen”  (TuZ’24), Feb. 2024, 2024.'
  mla: Ustimova, Magdalina, et al. <i>Crosstalk-Aware Simulation of Interconnects
    Using Artificial Neural Networks</i>. 37. ITG / GMM / GI -Workshop “Testmethoden
    und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb. 2024, 2024.
  short: M. Ustimova, S. Sadeghi-Kohan, S. Hellebrand, Crosstalk-Aware Simulation
    of Interconnects Using Artificial Neural Networks, 37. ITG / GMM / GI -Workshop
    “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”  (TuZ’24), Feb.
    2024, Darmstadt, Germany, 2024.
date_created: 2024-02-23T12:07:20Z
date_updated: 2024-03-22T17:12:00Z
language:
- iso: eng
place: Darmstadt, Germany
publication_status: published
publisher: 37. ITG / GMM / GI -Workshop "Testmethoden und Zuverlässigkeit von Schaltungen
  und Systemen"  (TuZ'24), Feb. 2024
status: public
title: Crosstalk-Aware Simulation of Interconnects Using Artificial Neural Networks
type: misc
user_id: '209'
year: '2024'
...
---
_id: '56014'
author:
- first_name: Hanieh
  full_name: Jafarzadeh, Hanieh
  last_name: Jafarzadeh
- first_name: Florian
  full_name: Klemme, Florian
  last_name: Klemme
- first_name: Jan Dennis
  full_name: Reimer, Jan Dennis
  id: '36703'
  last_name: Reimer
- first_name: Hussam
  full_name: ' Amrouch, Hussam'
  last_name: ' Amrouch'
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
- first_name: Hans-Joachim
  full_name: Wunderlich, Hans-Joachim
  last_name: Wunderlich
citation:
  ama: 'Jafarzadeh H, Klemme F, Reimer JD,  Amrouch H, Hellebrand S, Wunderlich H-J.
    Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient (ZTC)
    for Robust Delay Fault Testing. In: <i>In: IEEE International Test Conference
    (ITC’24), San Diego, CA, USA, November 2024</i>. IEEE; 2024.'
  apa: 'Jafarzadeh, H., Klemme, F., Reimer, J. D.,  Amrouch, H., Hellebrand, S., &#38;
    Wunderlich, H.-J. (2024). Minimizing PVT-Variability by Exploiting the Zero Temperature
    Coefficient (ZTC) for Robust Delay Fault Testing. <i>In: IEEE International Test
    Conference (ITC’24), San Diego, CA, USA, November 2024</i>. IEEE International
    Test Conference (ITC’24), San Diego, CA, USA.'
  bibtex: '@inproceedings{Jafarzadeh_Klemme_Reimer_ Amrouch_Hellebrand_Wunderlich_2024,
    place={San Diego, CA}, title={Minimizing PVT-Variability by Exploiting the Zero
    Temperature Coefficient (ZTC) for Robust Delay Fault Testing}, booktitle={In:
    IEEE International Test Conference (ITC’24), San Diego, CA, USA, November 2024},
    publisher={IEEE}, author={Jafarzadeh, Hanieh and Klemme, Florian and Reimer, Jan
    Dennis and  Amrouch, Hussam and Hellebrand, Sybille and Wunderlich, Hans-Joachim},
    year={2024} }'
  chicago: 'Jafarzadeh, Hanieh, Florian Klemme, Jan Dennis Reimer, Hussam  Amrouch,
    Sybille Hellebrand, and Hans-Joachim Wunderlich. “Minimizing PVT-Variability by
    Exploiting the Zero Temperature Coefficient (ZTC) for Robust Delay Fault Testing.”
    In <i>In: IEEE International Test Conference (ITC’24), San Diego, CA, USA, November
    2024</i>. San Diego, CA: IEEE, 2024.'
  ieee: H. Jafarzadeh, F. Klemme, J. D. Reimer, H.  Amrouch, S. Hellebrand, and H.-J.
    Wunderlich, “Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient
    (ZTC) for Robust Delay Fault Testing,” presented at the IEEE International Test
    Conference (ITC’24), San Diego, CA, USA, 2024.
  mla: 'Jafarzadeh, Hanieh, et al. “Minimizing PVT-Variability by Exploiting the Zero
    Temperature Coefficient (ZTC) for Robust Delay Fault Testing.” <i>In: IEEE International
    Test Conference (ITC’24), San Diego, CA, USA, November 2024</i>, IEEE, 2024.'
  short: 'H. Jafarzadeh, F. Klemme, J.D. Reimer, H.  Amrouch, S. Hellebrand, H.-J.
    Wunderlich, in: In: IEEE International Test Conference (ITC’24), San Diego, CA,
    USA, November 2024, IEEE, San Diego, CA, 2024.'
conference:
  end_date: 2024-11-08
  location: San Diego, CA, USA
  name: IEEE International Test Conference (ITC'24)
  start_date: 2024-11-03
date_created: 2024-09-04T09:25:20Z
date_updated: 2025-03-31T15:57:16Z
department:
- _id: '48'
language:
- iso: eng
place: San Diego, CA
publication: 'In: IEEE International Test Conference (ITC''24), San Diego, CA, USA,
  November 2024'
publisher: IEEE
status: public
title: Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient (ZTC)
  for Robust Delay Fault Testing
type: conference
user_id: '36703'
year: '2024'
...
---
_id: '46738'
author:
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
  orcid: https://orcid.org/0000-0001-7246-0610
- first_name: Jan Dennis
  full_name: Reimer, Jan Dennis
  id: '36703'
  last_name: Reimer
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
- first_name: Hans-Joachim
  full_name: Wunderlich, Hans-Joachim
  last_name: Wunderlich
citation:
  ama: 'Sadeghi-Kohan S, Reimer JD, Hellebrand S, Wunderlich H-J. Optimizing the Streaming
    of Sensor Data with Approximate Communication. In: <i>IEEE Asian Test Symposium
    (ATS’23), October 2023</i>. ; 2023.'
  apa: Sadeghi-Kohan, S., Reimer, J. D., Hellebrand, S., &#38; Wunderlich, H.-J. (2023).
    Optimizing the Streaming of Sensor Data with Approximate Communication. <i>IEEE
    Asian Test Symposium (ATS’23), October 2023</i>. IEEE Asian Test Symposium (ATS’23).
  bibtex: '@inproceedings{Sadeghi-Kohan_Reimer_Hellebrand_Wunderlich_2023, place={Beijing,
    China}, title={Optimizing the Streaming of Sensor Data with Approximate Communication},
    booktitle={IEEE Asian Test Symposium (ATS’23), October 2023}, author={Sadeghi-Kohan,
    Somayeh and Reimer, Jan Dennis and Hellebrand, Sybille and Wunderlich, Hans-Joachim},
    year={2023} }'
  chicago: Sadeghi-Kohan, Somayeh, Jan Dennis Reimer, Sybille Hellebrand, and Hans-Joachim
    Wunderlich. “Optimizing the Streaming of Sensor Data with Approximate Communication.”
    In <i>IEEE Asian Test Symposium (ATS’23), October 2023</i>. Beijing, China, 2023.
  ieee: S. Sadeghi-Kohan, J. D. Reimer, S. Hellebrand, and H.-J. Wunderlich, “Optimizing
    the Streaming of Sensor Data with Approximate Communication,” presented at the
    IEEE Asian Test Symposium (ATS’23), 2023.
  mla: Sadeghi-Kohan, Somayeh, et al. “Optimizing the Streaming of Sensor Data with
    Approximate Communication.” <i>IEEE Asian Test Symposium (ATS’23), October 2023</i>,
    2023.
  short: 'S. Sadeghi-Kohan, J.D. Reimer, S. Hellebrand, H.-J. Wunderlich, in: IEEE
    Asian Test Symposium (ATS’23), October 2023, Beijing, China, 2023.'
conference:
  end_date: 2023-10-17
  name: IEEE Asian Test Symposium (ATS'23)
  start_date: 2023-10-14
date_created: 2023-08-26T08:47:52Z
date_updated: 2024-01-08T08:49:08Z
department:
- _id: '48'
language:
- iso: eng
place: Beijing, China
publication: IEEE Asian Test Symposium (ATS'23), October 2023
status: public
title: Optimizing the Streaming of Sensor Data with Approximate Communication
type: conference
user_id: '36703'
year: '2023'
...
---
_id: '46264'
abstract:
- lang: eng
  text: "System-level interconnects provide the\r\nbackbone for increasingly complex
    systems on a chip. Their\r\nvulnerability to electromigration and crosstalk can
    lead to\r\nserious reliability and safety issues during the system lifetime.\r\nThis
    article presents an approach for periodic in-system testing\r\nwhich maintains
    a reliability profile to detect potential\r\nproblems before they actually cause
    a failure. Relying on a\r\ncommon infrastructure for EM-aware system workload\r\nmanagement
    and test, it minimizes the stress induced by the\r\ntest itself and contributes
    to the self-healing of system-induced\r\nelectromigration degradations. "
article_type: original
author:
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
  orcid: https://orcid.org/0000-0001-7246-0610
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
- first_name: Hans-Joachim
  full_name: Wunderlich, Hans-Joachim
  last_name: Wunderlich
citation:
  ama: Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. Workload-Aware Periodic Interconnect
    BIST. <i>IEEE Design &#38;Test</i>. Published online 2023:1-1. doi:<a href="https://doi.org/10.1109/mdat.2023.3298849">10.1109/mdat.2023.3298849</a>
  apa: Sadeghi-Kohan, S., Hellebrand, S., &#38; Wunderlich, H.-J. (2023). Workload-Aware
    Periodic Interconnect BIST. <i>IEEE Design &#38;Test</i>, 1–1. <a href="https://doi.org/10.1109/mdat.2023.3298849">https://doi.org/10.1109/mdat.2023.3298849</a>
  bibtex: '@article{Sadeghi-Kohan_Hellebrand_Wunderlich_2023, title={Workload-Aware
    Periodic Interconnect BIST}, DOI={<a href="https://doi.org/10.1109/mdat.2023.3298849">10.1109/mdat.2023.3298849</a>},
    journal={IEEE Design &#38;Test}, publisher={Institute of Electrical and Electronics
    Engineers (IEEE)}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and
    Wunderlich, Hans-Joachim}, year={2023}, pages={1–1} }'
  chicago: Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich.
    “Workload-Aware Periodic Interconnect BIST.” <i>IEEE Design &#38;Test</i>, 2023,
    1–1. <a href="https://doi.org/10.1109/mdat.2023.3298849">https://doi.org/10.1109/mdat.2023.3298849</a>.
  ieee: 'S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, “Workload-Aware Periodic
    Interconnect BIST,” <i>IEEE Design &#38;Test</i>, pp. 1–1, 2023, doi: <a href="https://doi.org/10.1109/mdat.2023.3298849">10.1109/mdat.2023.3298849</a>.'
  mla: Sadeghi-Kohan, Somayeh, et al. “Workload-Aware Periodic Interconnect BIST.”
    <i>IEEE Design &#38;Test</i>, Institute of Electrical and Electronics Engineers
    (IEEE), 2023, pp. 1–1, doi:<a href="https://doi.org/10.1109/mdat.2023.3298849">10.1109/mdat.2023.3298849</a>.
  short: S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, IEEE Design &#38;Test
    (2023) 1–1.
date_created: 2023-08-02T11:07:43Z
date_updated: 2024-03-22T17:15:10Z
department:
- _id: '48'
doi: 10.1109/mdat.2023.3298849
keyword:
- Electrical and Electronic Engineering
- Hardware and Architecture
- Software
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10194315
page: 1-1
publication: IEEE Design &Test
publication_identifier:
  issn:
  - 2168-2356
  - 2168-2364
publication_status: published
publisher: Institute of Electrical and Electronics Engineers (IEEE)
status: public
title: Workload-Aware Periodic Interconnect BIST
type: journal_article
user_id: '209'
year: '2023'
...
---
_id: '45830'
author:
- first_name: Hanieh
  full_name: Jafarzadeh, Hanieh
  last_name: Jafarzadeh
- first_name: Florian
  full_name: Klemme, Florian
  last_name: Klemme
- first_name: Jan Dennis
  full_name: Reimer, Jan Dennis
  id: '36703'
  last_name: Reimer
- first_name: Zahra Paria
  full_name: Najafi Haghi, Zahra Paria
  last_name: Najafi Haghi
- first_name: Hussam
  full_name: ' Amrouch, Hussam'
  last_name: ' Amrouch'
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
- first_name: Hans-Joachim
  full_name: ' Wunderlich, Hans-Joachim'
  last_name: ' Wunderlich'
citation:
  ama: 'Jafarzadeh H, Klemme F, Reimer JD, et al. Robust Pattern Generation for Small
    Delay Faults under Process Variations. In: <i>IEEE International Test Conference
    (ITC’23), Anaheim, USA, October 2023</i>. IEEE; 2023.'
  apa: Jafarzadeh, H., Klemme, F., Reimer, J. D., Najafi Haghi, Z. P.,  Amrouch, H.,
    Hellebrand, S., &#38;  Wunderlich, H.-J. (2023). Robust Pattern Generation for
    Small Delay Faults under Process Variations. <i>IEEE International Test Conference
    (ITC’23), Anaheim, USA, October 2023</i>. IEEE International Test Conference (ITC’23),
    Anaheim, USA.
  bibtex: '@inproceedings{Jafarzadeh_Klemme_Reimer_Najafi Haghi_ Amrouch_Hellebrand_
    Wunderlich_2023, place={Anaheim, CA, USA}, title={Robust Pattern Generation for
    Small Delay Faults under Process Variations}, booktitle={IEEE International Test
    Conference (ITC’23), Anaheim, USA, October 2023}, publisher={IEEE}, author={Jafarzadeh,
    Hanieh and Klemme, Florian and Reimer, Jan Dennis and Najafi Haghi, Zahra Paria
    and  Amrouch, Hussam and Hellebrand, Sybille and  Wunderlich, Hans-Joachim}, year={2023}
    }'
  chicago: 'Jafarzadeh, Hanieh, Florian Klemme, Jan Dennis Reimer, Zahra Paria Najafi
    Haghi, Hussam  Amrouch, Sybille Hellebrand, and Hans-Joachim  Wunderlich. “Robust
    Pattern Generation for Small Delay Faults under Process Variations.” In <i>IEEE
    International Test Conference (ITC’23), Anaheim, USA, October 2023</i>. Anaheim,
    CA, USA: IEEE, 2023.'
  ieee: H. Jafarzadeh <i>et al.</i>, “Robust Pattern Generation for Small Delay Faults
    under Process Variations,” presented at the IEEE International Test Conference
    (ITC’23), Anaheim, USA, 2023.
  mla: Jafarzadeh, Hanieh, et al. “Robust Pattern Generation for Small Delay Faults
    under Process Variations.” <i>IEEE International Test Conference (ITC’23), Anaheim,
    USA, October 2023</i>, IEEE, 2023.
  short: 'H. Jafarzadeh, F. Klemme, J.D. Reimer, Z.P. Najafi Haghi, H.  Amrouch, S.
    Hellebrand, H.-J.  Wunderlich, in: IEEE International Test Conference (ITC’23),
    Anaheim, USA, October 2023, IEEE, Anaheim, CA, USA, 2023.'
conference:
  end_date: 2023-10-13
  location: Anaheim, USA
  name: IEEE International Test Conference (ITC'23)
  start_date: 2023-10-08
date_created: 2023-07-03T08:20:17Z
date_updated: 2024-03-22T17:14:02Z
department:
- _id: '48'
language:
- iso: eng
place: Anaheim, CA, USA
publication: IEEE International Test Conference (ITC'23), Anaheim, USA, October 2023
publication_status: published
publisher: IEEE
status: public
title: Robust Pattern Generation for Small Delay Faults under Process Variations
type: conference
user_id: '209'
year: '2023'
...
---
_id: '35204'
author:
- first_name: Abdulkarim
  full_name: Ghazal, Abdulkarim
  last_name: Ghazal
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
- first_name: Jan Dennis
  full_name: Reimer, Jan Dennis
  id: '36703'
  last_name: Reimer
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
citation:
  ama: Ghazal A, Sadeghi-Kohan S, Reimer JD, Hellebrand S. <i>On Cryptography Effects
    on Interconnect Reliability</i>. 35. Workshop “Testmethoden und Zuverlässigkeit
    von Schaltungen und Systemen” (TuZ’23), Feb. 2023; 2023.
  apa: Ghazal, A., Sadeghi-Kohan, S., Reimer, J. D., &#38; Hellebrand, S. (2023).
    <i>On Cryptography Effects on Interconnect Reliability</i>. 35. Workshop “Testmethoden
    und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023.
  bibtex: '@book{Ghazal_Sadeghi-Kohan_Reimer_Hellebrand_2023, place={Erfurt, Germany},
    title={On Cryptography Effects on Interconnect Reliability}, publisher={35. Workshop
    “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb.
    2023}, author={Ghazal, Abdulkarim and Sadeghi-Kohan, Somayeh and Reimer, Jan Dennis
    and Hellebrand, Sybille}, year={2023} }'
  chicago: 'Ghazal, Abdulkarim, Somayeh Sadeghi-Kohan, Jan Dennis Reimer, and Sybille
    Hellebrand. <i>On Cryptography Effects on Interconnect Reliability</i>. Erfurt,
    Germany: 35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”
    (TuZ’23), Feb. 2023, 2023.'
  ieee: 'A. Ghazal, S. Sadeghi-Kohan, J. D. Reimer, and S. Hellebrand, <i>On Cryptography
    Effects on Interconnect Reliability</i>. Erfurt, Germany: 35. Workshop “Testmethoden
    und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23), Feb. 2023, 2023.'
  mla: Ghazal, Abdulkarim, et al. <i>On Cryptography Effects on Interconnect Reliability</i>.
    35. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’23),
    Feb. 2023, 2023.
  short: A. Ghazal, S. Sadeghi-Kohan, J.D. Reimer, S. Hellebrand, On Cryptography
    Effects on Interconnect Reliability, 35. Workshop “Testmethoden und Zuverlässigkeit
    von Schaltungen und Systemen” (TuZ’23), Feb. 2023, Erfurt, Germany, 2023.
date_created: 2023-01-04T10:20:41Z
date_updated: 2023-04-06T21:06:37Z
department:
- _id: '48'
keyword:
- WORKSHOP
language:
- iso: eng
page: '2'
place: Erfurt, Germany
publisher: 35. Workshop "Testmethoden und Zuverlässigkeit von Schaltungen und Systemen"
  (TuZ'23), Feb. 2023
status: public
title: On Cryptography Effects on Interconnect Reliability
type: misc
user_id: '36703'
year: '2023'
...
---
_id: '41875'
author:
- first_name: 'Abdalrhman '
  full_name: 'Badran, Abdalrhman '
  last_name: Badran
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
- first_name: Jan Dennis
  full_name: Reimer, Jan Dennis
  id: '36703'
  last_name: Reimer
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
citation:
  ama: 'Badran A, Sadeghi-Kohan S, Reimer JD, Hellebrand S. Approximate Computing:
    Balancing Performance, Power, Reliability, and Safety. In: <i>28th IEEE European
    Test Symposium (ETS’23), May 2023</i>. ; 2023.'
  apa: 'Badran, A., Sadeghi-Kohan, S., Reimer, J. D., &#38; Hellebrand, S. (2023).
    Approximate Computing: Balancing Performance, Power, Reliability, and Safety.
    <i>28th IEEE European Test Symposium (ETS’23), May 2023</i>.'
  bibtex: '@inproceedings{Badran_Sadeghi-Kohan_Reimer_Hellebrand_2023, place={Venice,
    Italy}, title={Approximate Computing: Balancing Performance, Power, Reliability,
    and Safety}, booktitle={28th IEEE European Test Symposium (ETS’23), May 2023},
    author={Badran, Abdalrhman  and Sadeghi-Kohan, Somayeh and Reimer, Jan Dennis
    and Hellebrand, Sybille}, year={2023} }'
  chicago: 'Badran, Abdalrhman , Somayeh Sadeghi-Kohan, Jan Dennis Reimer, and Sybille
    Hellebrand. “Approximate Computing: Balancing Performance, Power, Reliability,
    and Safety.” In <i>28th IEEE European Test Symposium (ETS’23), May 2023</i>. Venice,
    Italy, 2023.'
  ieee: 'A. Badran, S. Sadeghi-Kohan, J. D. Reimer, and S. Hellebrand, “Approximate
    Computing: Balancing Performance, Power, Reliability, and Safety,” 2023.'
  mla: 'Badran, Abdalrhman, et al. “Approximate Computing: Balancing Performance,
    Power, Reliability, and Safety.” <i>28th IEEE European Test Symposium (ETS’23),
    May 2023</i>, 2023.'
  short: 'A. Badran, S. Sadeghi-Kohan, J.D. Reimer, S. Hellebrand, in: 28th IEEE European
    Test Symposium (ETS’23), May 2023, Venice, Italy, 2023.'
conference:
  end_date: 2023-05-26
  start_date: 2023-05-22
date_created: 2023-02-07T13:57:34Z
date_updated: 2023-06-19T14:21:47Z
language:
- iso: eng
place: Venice, Italy
publication: 28th IEEE European Test Symposium (ETS'23), May 2023
status: public
title: 'Approximate Computing: Balancing Performance, Power, Reliability, and Safety'
type: conference
user_id: '36703'
year: '2023'
...
---
_id: '46739'
author:
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
  orcid: https://orcid.org/0000-0001-7246-0610
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
- first_name: Hans-Joachim
  full_name: Wunderlich, Hans-Joachim
  last_name: Wunderlich
citation:
  ama: 'Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. Low Power Streaming of Sensor
    Data Using Gray Code-Based Approximate Communication. In: <i>2023 53rd Annual
    IEEE/IFIP International Conference on Dependable Systems and Networks Workshops
    (DSN-W)</i>. IEEE; 2023. doi:<a href="https://doi.org/10.1109/dsn-w58399.2023.00056">10.1109/dsn-w58399.2023.00056</a>'
  apa: Sadeghi-Kohan, S., Hellebrand, S., &#38; Wunderlich, H.-J. (2023). Low Power
    Streaming of Sensor Data Using Gray Code-Based Approximate Communication. <i>2023
    53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks
    Workshops (DSN-W)</i>. <a href="https://doi.org/10.1109/dsn-w58399.2023.00056">https://doi.org/10.1109/dsn-w58399.2023.00056</a>
  bibtex: '@inproceedings{Sadeghi-Kohan_Hellebrand_Wunderlich_2023, title={Low Power
    Streaming of Sensor Data Using Gray Code-Based Approximate Communication}, DOI={<a
    href="https://doi.org/10.1109/dsn-w58399.2023.00056">10.1109/dsn-w58399.2023.00056</a>},
    booktitle={2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems
    and Networks Workshops (DSN-W)}, publisher={IEEE}, author={Sadeghi-Kohan, Somayeh
    and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2023} }'
  chicago: Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich.
    “Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication.”
    In <i>2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems
    and Networks Workshops (DSN-W)</i>. IEEE, 2023. <a href="https://doi.org/10.1109/dsn-w58399.2023.00056">https://doi.org/10.1109/dsn-w58399.2023.00056</a>.
  ieee: 'S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, “Low Power Streaming
    of Sensor Data Using Gray Code-Based Approximate Communication,” 2023, doi: <a
    href="https://doi.org/10.1109/dsn-w58399.2023.00056">10.1109/dsn-w58399.2023.00056</a>.'
  mla: Sadeghi-Kohan, Somayeh, et al. “Low Power Streaming of Sensor Data Using Gray
    Code-Based Approximate Communication.” <i>2023 53rd Annual IEEE/IFIP International
    Conference on Dependable Systems and Networks Workshops (DSN-W)</i>, IEEE, 2023,
    doi:<a href="https://doi.org/10.1109/dsn-w58399.2023.00056">10.1109/dsn-w58399.2023.00056</a>.
  short: 'S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, in: 2023 53rd Annual
    IEEE/IFIP International Conference on Dependable Systems and Networks Workshops
    (DSN-W), IEEE, 2023.'
date_created: 2023-08-26T10:48:31Z
date_updated: 2023-08-26T10:49:07Z
department:
- _id: '48'
doi: 10.1109/dsn-w58399.2023.00056
language:
- iso: eng
publication: 2023 53rd Annual IEEE/IFIP International Conference on Dependable Systems
  and Networks Workshops (DSN-W)
publication_status: published
publisher: IEEE
status: public
title: Low Power Streaming of Sensor Data Using Gray Code-Based Approximate Communication
type: conference
user_id: '78614'
year: '2023'
...
---
_id: '29351'
abstract:
- lang: eng
  text: Safety-critical systems have to follow extremely high dependability requirements
    as specified in the standards for automotive, air, and space applications. The
    required high fault coverage at runtime is usually obtained by a combination of
    concurrent error detection or correction and periodic tests within rather short
    time intervals. The concurrent scheme ensures the integrity of computed results
    while the periodic test has to identify potential aging problems and to prevent
    any fault accumulation which may invalidate the concurrent error detection mechanism.
    Such periodic built-in self-test (BIST) schemes are already commercialized for
    memories and for random logic. The paper at hand extends this approach to interconnect
    structures. A BIST scheme is presented which targets interconnect defects before
    they will actually affect the system functionality at nominal speed. A BIST schedule
    is developed which significantly reduces aging caused by electromigration during
    the lifetime application of the periodic test.
article_type: original
author:
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
- first_name: Hans-Joachim
  full_name: Wunderlich, Hans-Joachim
  last_name: Wunderlich
citation:
  ama: Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. Stress-Aware Periodic Test of
    Interconnects. <i>Journal of Electronic Testing</i>. Published online 2022. doi:<a
    href="https://doi.org/10.1007/s10836-021-05979-5">10.1007/s10836-021-05979-5</a>
  apa: Sadeghi-Kohan, S., Hellebrand, S., &#38; Wunderlich, H.-J. (2022). Stress-Aware
    Periodic Test of Interconnects. <i>Journal of Electronic Testing</i>. <a href="https://doi.org/10.1007/s10836-021-05979-5">https://doi.org/10.1007/s10836-021-05979-5</a>
  bibtex: '@article{Sadeghi-Kohan_Hellebrand_Wunderlich_2022, title={Stress-Aware
    Periodic Test of Interconnects}, DOI={<a href="https://doi.org/10.1007/s10836-021-05979-5">10.1007/s10836-021-05979-5</a>},
    journal={Journal of Electronic Testing}, publisher={Springer Science and Business
    Media LLC}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and Wunderlich,
    Hans-Joachim}, year={2022} }'
  chicago: Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich.
    “Stress-Aware Periodic Test of Interconnects.” <i>Journal of Electronic Testing</i>,
    2022. <a href="https://doi.org/10.1007/s10836-021-05979-5">https://doi.org/10.1007/s10836-021-05979-5</a>.
  ieee: 'S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, “Stress-Aware Periodic
    Test of Interconnects,” <i>Journal of Electronic Testing</i>, 2022, doi: <a href="https://doi.org/10.1007/s10836-021-05979-5">10.1007/s10836-021-05979-5</a>.'
  mla: Sadeghi-Kohan, Somayeh, et al. “Stress-Aware Periodic Test of Interconnects.”
    <i>Journal of Electronic Testing</i>, Springer Science and Business Media LLC,
    2022, doi:<a href="https://doi.org/10.1007/s10836-021-05979-5">10.1007/s10836-021-05979-5</a>.
  short: S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, Journal of Electronic
    Testing (2022).
date_created: 2022-01-14T11:16:34Z
date_updated: 2022-05-11T16:10:01Z
department:
- _id: '48'
doi: 10.1007/s10836-021-05979-5
keyword:
- Electrical and Electronic Engineering
language:
- iso: eng
publication: Journal of Electronic Testing
publication_identifier:
  issn:
  - 0923-8174
  - 1573-0727
publication_status: published
publisher: Springer Science and Business Media LLC
status: public
title: Stress-Aware Periodic Test of Interconnects
type: journal_article
user_id: '209'
year: '2022'
...
---
_id: '29890'
author:
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
- first_name: Hans-Joachim
  full_name: Wunderlich, Hans-Joachim
  last_name: Wunderlich
citation:
  ama: Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. <i>EM-Aware Interconnect BIST</i>.
    European Workshop on Silicon Lifecycle Management, March 18, 2022; 2022.
  apa: Sadeghi-Kohan, S., Hellebrand, S., &#38; Wunderlich, H.-J. (2022). <i>EM-Aware
    Interconnect BIST</i>. European Workshop on Silicon Lifecycle Management, March
    18, 2022.
  bibtex: '@book{Sadeghi-Kohan_Hellebrand_Wunderlich_2022, place={Online}, title={EM-Aware
    Interconnect BIST}, publisher={European Workshop on Silicon Lifecycle Management,
    March 18, 2022}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and Wunderlich,
    Hans-Joachim}, year={2022} }'
  chicago: 'Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich.
    <i>EM-Aware Interconnect BIST</i>. Online: European Workshop on Silicon Lifecycle
    Management, March 18, 2022, 2022.'
  ieee: 'S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, <i>EM-Aware Interconnect
    BIST</i>. Online: European Workshop on Silicon Lifecycle Management, March 18,
    2022, 2022.'
  mla: Sadeghi-Kohan, Somayeh, et al. <i>EM-Aware Interconnect BIST</i>. European
    Workshop on Silicon Lifecycle Management, March 18, 2022, 2022.
  short: S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, EM-Aware Interconnect
    BIST, European Workshop on Silicon Lifecycle Management, March 18, 2022, Online,
    2022.
date_created: 2022-02-19T14:21:24Z
date_updated: 2022-05-11T17:07:24Z
department:
- _id: '48'
keyword:
- WORKSHOP
language:
- iso: eng
page: '2'
place: Online
publication_status: published
publisher: European Workshop on Silicon Lifecycle Management, March 18, 2022
status: public
title: EM-Aware Interconnect BIST
type: misc
user_id: '209'
year: '2022'
...
---
_id: '19422'
author:
- first_name: Alexander
  full_name: Sprenger, Alexander
  id: '22707'
  last_name: Sprenger
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
- first_name: Jan Dennis
  full_name: Reimer, Jan Dennis
  id: '36703'
  last_name: Reimer
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
citation:
  ama: 'Sprenger A, Sadeghi-Kohan S, Reimer JD, Hellebrand S. Variation-Aware Test
    for Logic Interconnects using Neural Networks - A Case Study. In: <i>IEEE International
    Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT’20),
    October 2020</i>. ; 2020.'
  apa: Sprenger, A., Sadeghi-Kohan, S., Reimer, J. D., &#38; Hellebrand, S. (2020).
    Variation-Aware Test for Logic Interconnects using Neural Networks - A Case Study.
    <i>IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology
    Systems (DFT’20), October 2020</i>.
  bibtex: '@inproceedings{Sprenger_Sadeghi-Kohan_Reimer_Hellebrand_2020, place={Virtual
    Conference - Originally Frascati (Rome), Italy}, title={Variation-Aware Test for
    Logic Interconnects using Neural Networks - A Case Study}, booktitle={IEEE International
    Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT’20),
    October 2020}, author={Sprenger, Alexander and Sadeghi-Kohan, Somayeh and Reimer,
    Jan Dennis and Hellebrand, Sybille}, year={2020} }'
  chicago: Sprenger, Alexander, Somayeh Sadeghi-Kohan, Jan Dennis Reimer, and Sybille
    Hellebrand. “Variation-Aware Test for Logic Interconnects Using Neural Networks
    - A Case Study.” In <i>IEEE International Symposium on Defect and Fault Tolerance
    in VLSI and Nanotechnology Systems (DFT’20), October 2020</i>. Virtual Conference
    - Originally Frascati (Rome), Italy, 2020.
  ieee: A. Sprenger, S. Sadeghi-Kohan, J. D. Reimer, and S. Hellebrand, “Variation-Aware
    Test for Logic Interconnects using Neural Networks - A Case Study,” 2020.
  mla: Sprenger, Alexander, et al. “Variation-Aware Test for Logic Interconnects Using
    Neural Networks - A Case Study.” <i>IEEE International Symposium on Defect and
    Fault Tolerance in VLSI and Nanotechnology Systems (DFT’20), October 2020</i>,
    2020.
  short: 'A. Sprenger, S. Sadeghi-Kohan, J.D. Reimer, S. Hellebrand, in: IEEE International
    Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT’20),
    October 2020, Virtual Conference - Originally Frascati (Rome), Italy, 2020.'
conference:
  end_date: 2020-10-21
  start_date: 2020-10-19
date_created: 2020-09-15T14:03:02Z
date_updated: 2022-02-19T14:16:58Z
department:
- _id: '48'
language:
- iso: eng
place: Virtual Conference - Originally Frascati (Rome), Italy
publication: IEEE International Symposium on Defect and Fault Tolerance in VLSI and
  Nanotechnology Systems (DFT’20), October 2020
publication_status: published
status: public
title: Variation-Aware Test for Logic Interconnects using Neural Networks - A Case
  Study
type: conference
user_id: '209'
year: '2020'
...
---
_id: '15419'
author:
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
citation:
  ama: Sadeghi-Kohan S, Hellebrand S. <i>Dynamic Multi-Frequency Test Method for Hidden
    Interconnect Defects</i>. 32. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen
    und Systemen” (TuZ’20), 16. - 18. Februar 2020; 2020.
  apa: Sadeghi-Kohan, S., &#38; Hellebrand, S. (2020). <i>Dynamic Multi-Frequency
    Test Method for Hidden Interconnect Defects</i>. 32. Workshop “Testmethoden und
    Zuverlässigkeit von Schaltungen und Systemen” (TuZ’20), 16. - 18. Februar 2020.
  bibtex: '@book{Sadeghi-Kohan_Hellebrand_2020, place={Ludwigsburg}, title={Dynamic
    Multi-Frequency Test Method for Hidden Interconnect Defects}, publisher={32. Workshop
    “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’20), 16.
    - 18. Februar 2020}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille},
    year={2020} }'
  chicago: 'Sadeghi-Kohan, Somayeh, and Sybille Hellebrand. <i>Dynamic Multi-Frequency
    Test Method for Hidden Interconnect Defects</i>. Ludwigsburg: 32. Workshop “Testmethoden
    und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’20), 16. - 18. Februar
    2020, 2020.'
  ieee: 'S. Sadeghi-Kohan and S. Hellebrand, <i>Dynamic Multi-Frequency Test Method
    for Hidden Interconnect Defects</i>. Ludwigsburg: 32. Workshop “Testmethoden und
    Zuverlässigkeit von Schaltungen und Systemen” (TuZ’20), 16. - 18. Februar 2020,
    2020.'
  mla: Sadeghi-Kohan, Somayeh, and Sybille Hellebrand. <i>Dynamic Multi-Frequency
    Test Method for Hidden Interconnect Defects</i>. 32. Workshop “Testmethoden und
    Zuverlässigkeit von Schaltungen und Systemen” (TuZ’20), 16. - 18. Februar 2020,
    2020.
  short: S. Sadeghi-Kohan, S. Hellebrand, Dynamic Multi-Frequency Test Method for
    Hidden Interconnect Defects, 32. Workshop “Testmethoden und Zuverlässigkeit von
    Schaltungen und Systemen” (TuZ’20), 16. - 18. Februar 2020, Ludwigsburg, 2020.
date_created: 2019-12-29T16:13:58Z
date_updated: 2022-04-04T12:30:02Z
department:
- _id: '48'
keyword:
- WORKSHOP
language:
- iso: eng
page: '4'
place: Ludwigsburg
publication_status: published
publisher: 32. Workshop "Testmethoden und Zuverlässigkeit von Schaltungen und Systemen"
  (TuZ'20), 16. - 18. Februar 2020
status: public
title: Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects
type: misc
user_id: '209'
year: '2020'
...
---
_id: '29200'
author:
- first_name: Somayeh
  full_name: Sadeghi-Kohan, Somayeh
  id: '78614'
  last_name: Sadeghi-Kohan
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
citation:
  ama: 'Sadeghi-Kohan S, Hellebrand S. Dynamic Multi-Frequency Test Method for Hidden
    Interconnect Defects. In: <i>38th IEEE VLSI Test Symposium (VTS)</i>. IEEE; 2020.
    doi:<a href="https://doi.org/10.1109/vts48691.2020.9107591">10.1109/vts48691.2020.9107591</a>'
  apa: Sadeghi-Kohan, S., &#38; Hellebrand, S. (2020). Dynamic Multi-Frequency Test
    Method for Hidden Interconnect Defects. <i>38th IEEE VLSI Test Symposium (VTS)</i>.
    <a href="https://doi.org/10.1109/vts48691.2020.9107591">https://doi.org/10.1109/vts48691.2020.9107591</a>
  bibtex: '@inproceedings{Sadeghi-Kohan_Hellebrand_2020, place={Virtual Conference
    - Originally San Diego, CA, USA}, title={Dynamic Multi-Frequency Test Method for
    Hidden Interconnect Defects}, DOI={<a href="https://doi.org/10.1109/vts48691.2020.9107591">10.1109/vts48691.2020.9107591</a>},
    booktitle={38th IEEE VLSI Test Symposium (VTS)}, publisher={IEEE}, author={Sadeghi-Kohan,
    Somayeh and Hellebrand, Sybille}, year={2020} }'
  chicago: 'Sadeghi-Kohan, Somayeh, and Sybille Hellebrand. “Dynamic Multi-Frequency
    Test Method for Hidden Interconnect Defects.” In <i>38th IEEE VLSI Test Symposium
    (VTS)</i>. Virtual Conference - Originally San Diego, CA, USA: IEEE, 2020. <a
    href="https://doi.org/10.1109/vts48691.2020.9107591">https://doi.org/10.1109/vts48691.2020.9107591</a>.'
  ieee: 'S. Sadeghi-Kohan and S. Hellebrand, “Dynamic Multi-Frequency Test Method
    for Hidden Interconnect Defects,” 2020, doi: <a href="https://doi.org/10.1109/vts48691.2020.9107591">10.1109/vts48691.2020.9107591</a>.'
  mla: Sadeghi-Kohan, Somayeh, and Sybille Hellebrand. “Dynamic Multi-Frequency Test
    Method for Hidden Interconnect Defects.” <i>38th IEEE VLSI Test Symposium (VTS)</i>,
    IEEE, 2020, doi:<a href="https://doi.org/10.1109/vts48691.2020.9107591">10.1109/vts48691.2020.9107591</a>.
  short: 'S. Sadeghi-Kohan, S. Hellebrand, in: 38th IEEE VLSI Test Symposium (VTS),
    IEEE, Virtual Conference - Originally San Diego, CA, USA, 2020.'
date_created: 2022-01-10T08:38:34Z
date_updated: 2022-05-11T17:06:38Z
department:
- _id: '48'
doi: 10.1109/vts48691.2020.9107591
language:
- iso: eng
place: Virtual Conference - Originally San Diego, CA, USA
publication: 38th IEEE VLSI Test Symposium (VTS)
publication_status: published
publisher: IEEE
status: public
title: Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects
type: conference
user_id: '209'
year: '2020'
...
---
_id: '19421'
author:
- first_name: Stefan
  full_name: Holst, Stefan
  last_name: Holst
- first_name: Matthias
  full_name: Kampmann, Matthias
  id: '10935'
  last_name: Kampmann
- first_name: Alexander
  full_name: Sprenger, Alexander
  id: '22707'
  last_name: Sprenger
- first_name: Jan Dennis
  full_name: Reimer, Jan Dennis
  id: '36703'
  last_name: Reimer
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
- first_name: Hans-Joachim
  full_name: Wunderlich, Hans-Joachim
  last_name: Wunderlich
- first_name: Xiaoqing
  full_name: Weng, Xiaoqing
  last_name: Weng
citation:
  ama: 'Holst S, Kampmann M, Sprenger A, et al. Logic Fault Diagnosis of Hidden Delay
    Defects. In: <i>IEEE International Test Conference (ITC’20), November 2020</i>.
    ; 2020.'
  apa: Holst, S., Kampmann, M., Sprenger, A., Reimer, J. D., Hellebrand, S., Wunderlich,
    H.-J., &#38; Weng, X. (2020). Logic Fault Diagnosis of Hidden Delay Defects. <i>IEEE
    International Test Conference (ITC’20), November 2020</i>.
  bibtex: '@inproceedings{Holst_Kampmann_Sprenger_Reimer_Hellebrand_Wunderlich_Weng_2020,
    place={Virtual Conference - Originally Washington, DC, USA}, title={Logic Fault
    Diagnosis of Hidden Delay Defects}, booktitle={IEEE International Test Conference
    (ITC’20), November 2020}, author={Holst, Stefan and Kampmann, Matthias and Sprenger,
    Alexander and Reimer, Jan Dennis and Hellebrand, Sybille and Wunderlich, Hans-Joachim
    and Weng, Xiaoqing}, year={2020} }'
  chicago: Holst, Stefan, Matthias Kampmann, Alexander Sprenger, Jan Dennis Reimer,
    Sybille Hellebrand, Hans-Joachim Wunderlich, and Xiaoqing Weng. “Logic Fault Diagnosis
    of Hidden Delay Defects.” In <i>IEEE International Test Conference (ITC’20), November
    2020</i>. Virtual Conference - Originally Washington, DC, USA, 2020.
  ieee: S. Holst <i>et al.</i>, “Logic Fault Diagnosis of Hidden Delay Defects,” 2020.
  mla: Holst, Stefan, et al. “Logic Fault Diagnosis of Hidden Delay Defects.” <i>IEEE
    International Test Conference (ITC’20), November 2020</i>, 2020.
  short: 'S. Holst, M. Kampmann, A. Sprenger, J.D. Reimer, S. Hellebrand, H.-J. Wunderlich,
    X. Weng, in: IEEE International Test Conference (ITC’20), November 2020, Virtual
    Conference - Originally Washington, DC, USA, 2020.'
date_created: 2020-09-15T13:56:08Z
date_updated: 2022-05-11T17:08:20Z
department:
- _id: '48'
language:
- iso: eng
place: Virtual Conference - Originally Washington, DC, USA
publication: IEEE International Test Conference (ITC'20), November 2020
publication_status: published
status: public
title: Logic Fault Diagnosis of Hidden Delay Defects
type: conference
user_id: '209'
year: '2020'
...
---
_id: '8112'
author:
- first_name: Mohammad Urf
  full_name: Maaz, Mohammad Urf
  id: '49274'
  last_name: Maaz
- first_name: Alexander
  full_name: Sprenger, Alexander
  id: '22707'
  last_name: Sprenger
- first_name: Sybille
  full_name: Hellebrand, Sybille
  id: '209'
  last_name: Hellebrand
  orcid: 0000-0002-3717-3939
citation:
  ama: 'Maaz MU, Sprenger A, Hellebrand S. <i>A Hybrid Space Compactor for Varying
    X-Rates</i>. Prien am Chiemsee: 31. Workshop “Testmethoden und Zuverlässigkeit
    von Schaltungen und Systemen” (TuZ’19); 2019.'
  apa: 'Maaz, M. U., Sprenger, A., &#38; Hellebrand, S. (2019). <i>A Hybrid Space
    Compactor for Varying X-Rates</i>. Prien am Chiemsee: 31. Workshop “Testmethoden
    und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’19).'
  bibtex: '@book{Maaz_Sprenger_Hellebrand_2019, place={Prien am Chiemsee}, title={A
    Hybrid Space Compactor for Varying X-Rates}, publisher={31. Workshop “Testmethoden
    und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’19)}, author={Maaz, Mohammad
    Urf and Sprenger, Alexander and Hellebrand, Sybille}, year={2019} }'
  chicago: 'Maaz, Mohammad Urf, Alexander Sprenger, and Sybille Hellebrand. <i>A Hybrid
    Space Compactor for Varying X-Rates</i>. Prien am Chiemsee: 31. Workshop “Testmethoden
    und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’19), 2019.'
  ieee: 'M. U. Maaz, A. Sprenger, and S. Hellebrand, <i>A Hybrid Space Compactor for
    Varying X-Rates</i>. Prien am Chiemsee: 31. Workshop “Testmethoden und Zuverlässigkeit
    von Schaltungen und Systemen” (TuZ’19), 2019.'
  mla: Maaz, Mohammad Urf, et al. <i>A Hybrid Space Compactor for Varying X-Rates</i>.
    31. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen” (TuZ’19),
    2019.
  short: M.U. Maaz, A. Sprenger, S. Hellebrand, A Hybrid Space Compactor for Varying
    X-Rates, 31. Workshop “Testmethoden und Zuverlässigkeit von Schaltungen und Systemen”
    (TuZ’19), Prien am Chiemsee, 2019.
date_created: 2019-02-26T15:11:02Z
date_updated: 2022-01-06T07:03:51Z
department:
- _id: '48'
keyword:
- WORKSHOP
language:
- iso: eng
place: Prien am Chiemsee
publisher: 31. Workshop "Testmethoden und Zuverlässigkeit von Schaltungen und Systemen"
  (TuZ'19)
status: public
title: A Hybrid Space Compactor for Varying X-Rates
type: misc
user_id: '209'
year: '2019'
...