[{"publication":"CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems","type":"conference","abstract":[{"lang":"eng","text":"To achieve optimum bond results at ultrasonic bonding thick copper wire on sensitive components is quite challenging.\r\nBearing in mind that high normal force and ultrasonic power are needed for bond quality but as well increase stress and finally failure risk of the substrate, methods should be found to achieve high bond quality even at lower bond parameters. Therefore, bond experiments with different bond tool grove geometries have been conducted for copper and aluminum wire on direct copper bonded (DCB) substrates to investigate the impact of geometric parameters on bond formation and bond quality. The wire material depending impact of geometry changes on the bond formation and deformation was quantified. Additionally, a bonding parameter design of experiments (DOE) has been conducted for the reference and the most promising groove geometry. Higher shear values were achieved at reduced vertical tool displacement for most bonding parameter combinations, compared to the reference tool. This behavior allows for reducing ultrasonic power to obtain equal shear values; consequently, mechanical stresses in the interface decrease. This could potentially reduce the risk of chip damage and thus yield loss."}],"status":"public","_id":"30371","department":[{"_id":"151"}],"user_id":"210","language":[{"iso":"eng"}],"quality_controlled":"1","publication_identifier":{"isbn":["ISBN 978-3-8007-5757-2 "]},"place":"Berlin","year":"2022","page":"138-143","citation":{"ama":"Hagedorn OEC, Broll M, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. In: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems. VDE VERLAG GMBH; 2022:138-143.","ieee":"O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding,” in CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, Berlin, 2022, pp. 138–143.","chicago":"Hagedorn, Oliver Ernst Caspar, Marian Broll, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” In CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–43. Berlin: VDE VERLAG GMBH, 2022.","apa":"Hagedorn, O. E. C., Broll, M., Kirsch, O., Hemsel, T., & Sextro, W. (2022). Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–143.","short":"O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, Berlin, 2022, pp. 138–143.","mla":"Hagedorn, Oliver Ernst Caspar, et al. “Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, 2022, pp. 138–43.","bibtex":"@inproceedings{Hagedorn_Broll_Kirsch_Hemsel_Sextro_2022, place={Berlin}, title={Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding}, booktitle={CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems}, publisher={VDE VERLAG GMBH}, author={Hagedorn, Oliver Ernst Caspar and Broll, Marian and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}, year={2022}, pages={138–143} }"},"date_updated":"2023-09-21T14:22:17Z","publisher":"VDE VERLAG GMBH","date_created":"2022-03-17T15:00:06Z","author":[{"last_name":"Hagedorn","id":"53321","full_name":"Hagedorn, Oliver Ernst Caspar","first_name":"Oliver Ernst Caspar"},{"full_name":"Broll, Marian","last_name":"Broll","first_name":"Marian"},{"last_name":"Kirsch","full_name":"Kirsch, Olaf","first_name":"Olaf"},{"id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel","first_name":"Tobias"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"}],"title":"Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding","conference":{"end_date":"2022.03.17","location":"Berlin","name":"CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems","start_date":"2022.03.15"}},{"_id":"34104","department":[{"_id":"151"}],"user_id":"38259","language":[{"iso":"eng"}],"publication":"2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)","type":"conference","abstract":[{"lang":"eng","text":"ue to the constantly growing energy demand of power electronics and the need to reduce the size of electronic components like power modules for e-mobility, new challenges arise for ultrasonic wire bonding: the electrical connection must endure higher thermal and mechanical stress while the connecting partners become more sensitive or require more energy to get bonded. Past investigations have shown already that multi-dimensional ultrasonic bonding and welding yield the same or even better bond quality while reducing the load on the components. This contribution is intended to show whether multidi-mensional thick wire bonding is a promising concept to over-come the new challenges. The focus is on experimental investi-gations of different bond tool trajectories in ultrasonic wire bonding of aluminum and copper wire on DCB's and chips. The bond quality is analyzed by shear tests, microsections and, in the case of aluminum bonding, by a new machine learning method for an objective automated evaluation of the sheared area."}],"status":"public","publisher":"IEEE","date_updated":"2023-09-22T12:24:18Z","author":[{"last_name":"Scheidemann","id":"38259","full_name":"Scheidemann, Claus","first_name":"Claus"},{"first_name":"Olaf","last_name":"Kirsch","full_name":"Kirsch, Olaf"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"}],"date_created":"2022-11-17T15:17:39Z","title":"Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding","doi":"10.1109/estc55720.2022.9939478","quality_controlled":"1","publication_status":"published","year":"2022","citation":{"ama":"Scheidemann C, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE; 2022. doi:10.1109/estc55720.2022.9939478","ieee":"C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: 10.1109/estc55720.2022.9939478.","chicago":"Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE, 2022. https://doi.org/10.1109/estc55720.2022.9939478.","short":"C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.","mla":"Scheidemann, Claus, et al. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022, doi:10.1109/estc55720.2022.9939478.","bibtex":"@inproceedings{Scheidemann_Kirsch_Hemsel_Sextro_2022, title={Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding}, DOI={10.1109/estc55720.2022.9939478}, booktitle={2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)}, publisher={IEEE}, author={Scheidemann, Claus and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}, year={2022} }","apa":"Scheidemann, C., Kirsch, O., Hemsel, T., & Sextro, W. (2022). Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). https://doi.org/10.1109/estc55720.2022.9939478"}},{"doi":"https://doi.org/10.1016/j.microrel.2021.114077","title":"Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization","date_created":"2021-03-10T09:37:02Z","author":[{"full_name":"Schemmel, Reinhard","id":"28647","last_name":"Schemmel","first_name":"Reinhard"},{"full_name":"Krieger, Viktor","last_name":"Krieger","first_name":"Viktor"},{"first_name":"Tobias","last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"}],"volume":119,"date_updated":"2023-09-21T14:15:33Z","citation":{"ama":"Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability. 2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077","ieee":"R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.","chicago":"Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.","apa":"Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077","short":"R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.","mla":"Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability, vol. 119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.","bibtex":"@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077}, journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }"},"page":"114077","intvolume":" 119","year":"2021","publication_status":"published","publication_identifier":{"issn":["0026-2714"]},"quality_controlled":"1","language":[{"iso":"eng"}],"keyword":["Ultrasonic heavy wire bonding","Co-simulation","ANSYS","MATLAB","Process optimization","Friction coefficient","Copper-copper","Aluminium-copper"],"user_id":"210","department":[{"_id":"151"}],"_id":"21436","status":"public","abstract":[{"lang":"eng","text":"Ultrasonic wire bonding is a solid-state joining process, used in the electronics industry to form electrical connections, e.g. to connect electrical terminals within semiconductor modules. Many process parameters affect the bond strength, such like the bond normal force, ultrasonic power, wire material and bonding frequency. Today, process design, development, and optimization is most likely based on the knowledge of process engineers and is mainly performed by experimental testing. In this contribution, a newly developed simulation tool is presented, to reduce time and costs and efficiently determine optimized process parameter. Based on a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire bonding process are considered using finite element simulation for the complex plastic deformation of the wire and reduced order models for the transient dynamics of the transducer, wire, substrate and bond formation. The model parameters such as the coefficients of friction between bond tool and wire and between wire and substrate were determined for aluminium and copper wire in experiments with a test rig specially developed for the requirements of heavy wire bonding. To reduce simulation time, for the finite element simulation a restart analysis and high performance computing is utilized. Detailed analysis of the bond formation showed, that the normal pressure distribution in the contact between wire and substrate has high impact on bond formation and distribution of welded areas in the contact area."}],"type":"journal_article","publication":"Microelectronics Reliability"},{"citation":{"ama":"Schemmel R, Scheidemann C, Hemsel T, Kirsch O, Sextro W. Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. In: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems. ; 2020:1-6.","ieee":"R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.","chicago":"Schemmel, Reinhard, Claus Scheidemann, Tobias Hemsel, Olaf Kirsch, and Walter Sextro. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic Heavy Wire Bonding.” In CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6, 2020.","apa":"Schemmel, R., Scheidemann, C., Hemsel, T., Kirsch, O., & Sextro, W. (2020). Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6.","short":"R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.","mla":"Schemmel, Reinhard, et al. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic Heavy Wire Bonding.” CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.","bibtex":"@inproceedings{Schemmel_Scheidemann_Hemsel_Kirsch_Sextro_2020, title={Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding}, booktitle={CIPS 2020; 11th International Conference on Integrated Power Electronics Systems}, author={Schemmel, Reinhard and Scheidemann, Claus and Hemsel, Tobias and Kirsch, Olaf and Sextro, Walter}, year={2020}, pages={1–6} }"},"page":"1-6","year":"2020","quality_controlled":"1","title":"Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding","date_created":"2020-07-06T07:41:21Z","author":[{"id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel","first_name":"Reinhard"},{"full_name":"Scheidemann, Claus","id":"38259","last_name":"Scheidemann","first_name":"Claus"},{"last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias","first_name":"Tobias"},{"first_name":"Olaf ","full_name":"Kirsch, Olaf ","last_name":"Kirsch"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"}],"date_updated":"2023-09-21T14:27:32Z","status":"public","abstract":[{"text":"Ultrasonic wire bonding is a process to form electrical connections in electronics well established industry. Typically, a clamping tool is pressed on the wire and forced to vibrate at relative high frequency 40 to 100 kHz. The ultrasonic vibration is transmitted through the wire into the interface between wire and substrate. Due to frictional processes, contamination like oxide layers are removed from the contact zone, the surface roughness is reduced, and with increasing bond duration an metallic connection of wire and substrate is established. It is known that the amount of ultrasonic energy over time directly influences the strength and reliability of the bond connection, but the determination of optimum bond parameters is still a challenging experimental task. For this, in the past different model approaches have been presented, to calculate the bond quality by simulation. Measuring the friction between wire and substrate to validate these models is a challenging task at ultrasonic bonding frequency. Therefore a versatile test rig for bonding experiments at frequencies lower than 1 kHz is setup to get detailed insight into the different phases of the connection process. It includes a piezoelectric force sensor for the measurement of the three-dimensional process forces, an electrodynamic shaker for the vibration excitation and a conventional tension-compression testing machine to apply the bond normal force. Using this test rig, it is possible to observe the different phases of bond formation in detail, validate and enhance existing models and finally optimize bond parameters for different processes.","lang":"eng"}],"type":"conference","publication":"CIPS 2020; 11th International Conference on Integrated Power Electronics Systems","language":[{"iso":"eng"}],"user_id":"210","department":[{"_id":"151"}],"_id":"17355"},{"publication_status":"published","publication_identifier":{"isbn":["9781728160498"]},"year":"2020","citation":{"chicago":"Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” In 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020. https://doi.org/10.1109/eurosime48426.2020.9152679.","ieee":"R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: 10.1109/eurosime48426.2020.9152679.","ama":"Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). ; 2020. doi:10.1109/eurosime48426.2020.9152679","bibtex":"@inproceedings{Schemmel_Krieger_Hemsel_Sextro_2020, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, DOI={10.1109/eurosime48426.2020.9152679}, booktitle={2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2020} }","mla":"Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, doi:10.1109/eurosime48426.2020.9152679.","short":"R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020.","apa":"Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2020). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). https://doi.org/10.1109/eurosime48426.2020.9152679"},"date_updated":"2023-09-21T14:16:41Z","date_created":"2020-08-07T09:49:17Z","author":[{"first_name":"Reinhard","last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard"},{"first_name":"Viktor","full_name":"Krieger, Viktor","last_name":"Krieger"},{"id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel","first_name":"Tobias"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"}],"title":"Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization","doi":"10.1109/eurosime48426.2020.9152679","type":"conference","publication":"2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","status":"public","_id":"17706","user_id":"210","department":[{"_id":"151"}],"language":[{"iso":"eng"}]},{"abstract":[{"text":"In a variety of industrial applications, liquids are atomized to produce aerosols for further processing. Example applications are the coating of surfaces with paints, the application of ultra-thin adhesive layers and the atomization of fuels for the production of combustible dispersions. In this publication different atomizing principles (standing-wave, capillary-wave, vibrating-mesh) are examined and discussed. Using an optimized standing-wave system, tough liquids with viscosities of up to about 100 Pas could be successfully atomized.","lang":"eng"}],"file":[{"date_updated":"2019-11-07T15:22:56Z","date_created":"2019-11-07T15:22:56Z","creator":"pdunst","file_size":3850591,"file_name":"Dunst_MFHS_2019.pdf","access_level":"closed","file_id":"14853","content_type":"application/pdf","success":1,"relation":"main_file"}],"publication":"Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019)","ddc":["620"],"keyword":["atomization","ultrasound","standing-wave","capillarywave","vibrating-mesh"],"language":[{"iso":"eng"}],"year":"2019","quality_controlled":"1","title":"Atomization of Fluids with Ultrasound","date_created":"2019-11-07T15:25:30Z","editor":[{"first_name":"Joost","last_name":"Lötters","full_name":"Lötters, Joost"},{"first_name":"Gerald","full_name":"Urban, Gerald","last_name":"Urban"}],"status":"public","type":"conference","file_date_updated":"2019-11-07T15:22:56Z","_id":"14852","user_id":"22130","department":[{"_id":"151"}],"place":"Enschede, The Netherlands","citation":{"apa":"Dunst, P., Bornmann, P., Hemsel, T., Littmann, W., & Sextro, W. (2019). Atomization of Fluids with Ultrasound. In J. Lötters & G. Urban (Eds.), Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019) (pp. 140–143). Enschede, The Netherlands.","mla":"Dunst, Paul, et al. “Atomization of Fluids with Ultrasound.” Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019), edited by Joost Lötters and Gerald Urban, 2019, pp. 140–43.","bibtex":"@inproceedings{Dunst_Bornmann_Hemsel_Littmann_Sextro_2019, place={Enschede, The Netherlands}, title={Atomization of Fluids with Ultrasound}, booktitle={Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019)}, author={Dunst, Paul and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter and Sextro, Walter}, editor={Lötters, Joost and Urban, GeraldEditors}, year={2019}, pages={140–143} }","short":"P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, W. Sextro, in: J. Lötters, G. Urban (Eds.), Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019), Enschede, The Netherlands, 2019, pp. 140–143.","ieee":"P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Atomization of Fluids with Ultrasound,” in Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019), Enschede, The Netherlands, 2019, pp. 140–143.","chicago":"Dunst, Paul, Peter Bornmann, Tobias Hemsel, Walter Littmann, and Walter Sextro. “Atomization of Fluids with Ultrasound.” In Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019), edited by Joost Lötters and Gerald Urban, 140–43. Enschede, The Netherlands, 2019.","ama":"Dunst P, Bornmann P, Hemsel T, Littmann W, Sextro W. Atomization of Fluids with Ultrasound. In: Lötters J, Urban G, eds. Conference Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019). Enschede, The Netherlands; 2019:140-143."},"page":"140-143","publication_status":"published","has_accepted_license":"1","conference":{"end_date":"2019-10-04","location":"Enschede, The Netherlands","name":"4th Conference on MicroFluidic Handling Systems","start_date":"2019-10-02"},"date_updated":"2022-01-06T06:52:08Z","author":[{"last_name":"Dunst","full_name":"Dunst, Paul","id":"22130","first_name":"Paul"},{"first_name":"Peter","last_name":"Bornmann","full_name":"Bornmann, Peter"},{"last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210","first_name":"Tobias"},{"first_name":"Walter ","full_name":"Littmann, Walter ","last_name":"Littmann"},{"first_name":"Walter","last_name":"Sextro","id":"21220","full_name":"Sextro, Walter"}]},{"publisher":"VDI Verlag GmbH · Düsseldorf 2019","date_updated":"2022-01-06T06:52:19Z","author":[{"full_name":"Hagedorn, Oliver Ernst Caspar","id":"53321","last_name":"Hagedorn","first_name":"Oliver Ernst Caspar"},{"first_name":"Daniel","full_name":"Pielsticker, Daniel","id":"76966","last_name":"Pielsticker"},{"first_name":"Tobias","last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"}],"date_created":"2019-12-04T11:59:52Z","title":"Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen","publication_identifier":{"isbn":["978-3-18-092366-6"]},"year":"2019","citation":{"ama":"Hagedorn OEC, Pielsticker D, Hemsel T, Sextro W. Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen. In: 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019; 2019.","chicago":"Hagedorn, Oliver Ernst Caspar, Daniel Pielsticker, Tobias Hemsel, and Walter Sextro. “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen.” In 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019, 2019.","ieee":"O. E. C. Hagedorn, D. Pielsticker, T. Hemsel, and W. Sextro, “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen,” in 2. VDI-Fachtagung Schwingungen 2019, 2019.","short":"O.E.C. Hagedorn, D. Pielsticker, T. Hemsel, W. Sextro, in: 2. VDI-Fachtagung Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.","bibtex":"@inproceedings{Hagedorn_Pielsticker_Hemsel_Sextro_2019, title={Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen}, booktitle={2. VDI-Fachtagung Schwingungen 2019}, publisher={VDI Verlag GmbH · Düsseldorf 2019}, author={Hagedorn, Oliver Ernst Caspar and Pielsticker, Daniel and Hemsel, Tobias and Sextro, Walter}, year={2019} }","mla":"Hagedorn, Oliver Ernst Caspar, et al. “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen.” 2. VDI-Fachtagung Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.","apa":"Hagedorn, O. E. C., Pielsticker, D., Hemsel, T., & Sextro, W. (2019). Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen. In 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019."},"_id":"15244","user_id":"53321","department":[{"_id":"151"}],"language":[{"iso":"ger"}],"type":"conference","publication":"2. VDI-Fachtagung Schwingungen 2019","status":"public"},{"conference":{"start_date":"2019-03-18","name":"Deutsche Jahrestagung für Akustik - DAGA 2019","location":"Rostock","end_date":"2019-03-21"},"title":"Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten","date_created":"2019-06-17T13:01:47Z","author":[{"first_name":"Paul","last_name":"Dunst","full_name":"Dunst, Paul","id":"22130"},{"last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210","first_name":"Tobias"},{"last_name":"Bornmann","full_name":"Bornmann, Peter","first_name":"Peter"},{"first_name":"Walter ","full_name":"Littmann, Walter ","last_name":"Littmann"},{"first_name":"Walter","last_name":"Sextro","id":"21220","full_name":"Sextro, Walter"}],"date_updated":"2022-01-06T06:50:33Z","citation":{"ama":"Dunst P, Hemsel T, Bornmann P, Littmann W, Sextro W. Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten. In: DAGA 2019. ; 2019.","chicago":"Dunst, Paul, Tobias Hemsel, Peter Bornmann, Walter Littmann, and Walter Sextro. “Modellbasierte Und Experimentelle Charakterisierung von Intensiven Ultraschall-Stehwellenfeldern Für Die Zerstäubung Hochviskoser Flüssigkeiten.” In DAGA 2019, 2019.","ieee":"P. Dunst, T. Hemsel, P. Bornmann, W. Littmann, and W. Sextro, “Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten,” in DAGA 2019, Rostock, 2019.","apa":"Dunst, P., Hemsel, T., Bornmann, P., Littmann, W., & Sextro, W. (2019). Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten. In DAGA 2019. Rostock.","mla":"Dunst, Paul, et al. “Modellbasierte Und Experimentelle Charakterisierung von Intensiven Ultraschall-Stehwellenfeldern Für Die Zerstäubung Hochviskoser Flüssigkeiten.” DAGA 2019, 2019.","bibtex":"@inproceedings{Dunst_Hemsel_Bornmann_Littmann_Sextro_2019, title={Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung hochviskoser Flüssigkeiten}, booktitle={DAGA 2019}, author={Dunst, Paul and Hemsel, Tobias and Bornmann, Peter and Littmann, Walter and Sextro, Walter}, year={2019} }","short":"P. Dunst, T. Hemsel, P. Bornmann, W. Littmann, W. Sextro, in: DAGA 2019, 2019."},"year":"2019","language":[{"iso":"eng"}],"department":[{"_id":"151"}],"user_id":"22130","_id":"10258","status":"public","abstract":[{"text":"Für die Zerstäubung hochviskoser Flüssigkeiten werden neben Düsenzerstäubern vor allem UltraschallStehwellenzerstäuber angewendet [1]. Diese ermöglichen ohne weitere Maßnahmen zwar keine gerichtete Zerstäubung, benötigen jedoch im Gegensatz zu Düsenzerstäubern keine hohen Drücke und haben keine hohen Austrittsgeschwindigkeiten. Zur Erzeugung der Ultraschallwellen werden typischerweise piezoelektrische, mit Bolzen verschraubte LangevinWandler verwendet [1-4], die eine starke Schallabstrahlung bei einer elektrischen Eingangsleistung von bis zu einigen Kilowatt erzeugen können. Wie bei jedem anderen schwingenden System emittiert der Ultraschallwandler zunächst eine Wanderwelle. Mit einem Reflektor, der gegenüber der Sonotrode angeordnet ist, wird eine stehende Welle erzeugt. Im Resonanzabstand zwischen Reflektor und Wandler werden abgestrahlte und reflektierte Wellen so überlagert, dass höhere Schalldruckamplituden erzielt werden. Ein einfacher Ansatz zur Maximierung des Schallpegels im Stehwellenfeld ist die Erhöhung der Schwingungsamplituden des Wandlers, die jedoch zu Schäden oder zumindest zu einer Verringerung der Lebensdauer führen kann. Hohe Schalldrücke werden auch bei geringen Abständen zwischen Wandler und Reflektor erreicht. Das Volumen des Schallfeldes ist in diesem Fall jedoch für die meisten Prozesse zu klein. Ein weiterer Ansatz ist die Verwendung zweier entgegengesetzt angeordneter Wandler [5]. In diesem Fall erfordert jedoch die Erzeugung einer stehenden Welle eine genaue Abstimmung von Frequenz und Phase beider Wandler, was eine komplexe Steuerung erfordert. Ebenso ist es möglich, geometrische Randbedingungen des Stehwellensystems zu optimieren, sodass es zu optimaler Interferenz der Wellen kommt. Im Folgenden wird der Anschaulichkeit halber vereinfachend angenommen, dass der Wandler an seiner Sonotrodenoberfläche einzelne Schallstrahlen aussendet, die in Nähe des Wandlers nahezu parallel verlaufen und sich mit zunehmender Entfernung vom Wandler auffächern. Ein einfaches Stehwellensystem, bestehend aus ebener Sonotrode und ebenem Reflektor, erzeugt bei kleinem Abstand zwischen Sonotrode und Reflektor sehr hohe Schallpegel, da nahezu sämtliche ausgesandten Schallstrahlen in Richtung der Sonotrode reflektiert werden positive Interferenz entsteht. Erhöht man jedoch den Abstand zwischen Sonotrode und Reflektor, so nehmen die Verluste durch Schallstrahlen, die den Prozessraum verlassen, zu. Wie Abbildung 1 gezeigt, werden nur Schallstrahlen, die in etwa parallel zur Rotationsachse verlaufen, zum Wandler zurück reflektiert und tragen zum Stehwellenfeld bei. Die Strahlen haben zudem abhängig vom Abstrahlwinkel unterschiedliche Weglängen. Die Stehwellenbedingung ist demnach nur für Strahlen in der Nähe der Rotationsachse exakt erfüllt. Um dies zu vermeiden, müssen die Geometrien von Wandler und Reflektor optimiert werden. In den folgenden Abschnitten wird zunächst ein Optimierungsansatz vorgestellt. Mithilfe eines FiniteElemente-Modells werden die Auswirkungen einer optimierten Geometrie auf den maximalen Schalldruckpegel untersucht. Ergebnisse werden durch Messungen an einem experimentellen Aufbau eines Stehwellensystems validiert. Es wird gezeigt, wie sich die Optimierung der geometrischen Randbedingungen auf die Zerstäubung hochviskoser Flüssigkeiten auswirkt.","lang":"eng"}],"publication":"DAGA 2019","type":"conference"},{"publication":"Sensors and Actuators A: Physical","type":"journal_article","status":"public","abstract":[{"text":"Ultrasonic joining is a common industrial process. In the electronics industry it is used to form electrical connections, including those of dissimilar materials. Multiple influencing factors in ultrasonic joining are known and extensively investigated; process parameters like ultrasonic power, bond force, and bonding frequency of the ultrasonic vibration are known to have a high impact on a reliable joining process and need to be adapted for each new application with different geometry or materials. This contribution is focused on increasing ultrasonic power transmitted to the interface and keeping mechanical stresses during ultrasonic bonding low by using a multi-dimensional ultrasonic transducer concept. Bonding results for a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional bonding are discussed.","lang":"eng"}],"department":[{"_id":"151"}],"user_id":"210","_id":"10334","project":[{"_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","grant_number":"MP-1-1-015"}],"language":[{"iso":"eng"}],"keyword":["Ultrasonic bonding","Ultrasonic welding","Multi-dimensional bonding","Complex vibration","Multi-frequent","Two-dimensional friction model"],"quality_controlled":"1","publication_identifier":{"issn":["0924-4247"]},"page":"653 - 662","intvolume":" 295","citation":{"short":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.","bibtex":"@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding}, volume={295}, DOI={10.1016/j.sna.2019.04.025}, journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={653–662} }","mla":"Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical, vol. 295, 2019, pp. 653–62, doi:10.1016/j.sna.2019.04.025.","apa":"Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., & Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical, 295, 653–662. https://doi.org/10.1016/j.sna.2019.04.025","ieee":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662, 2019, doi: 10.1016/j.sna.2019.04.025.","chicago":"Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical 295 (2019): 653–62. https://doi.org/10.1016/j.sna.2019.04.025.","ama":"Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025"},"year":"2019","volume":295,"author":[{"first_name":"Reinhard","last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","id":"210","last_name":"Hemsel"},{"last_name":"Dymel","id":"66833","full_name":"Dymel, Collin","first_name":"Collin"},{"first_name":"Matthias","full_name":"Hunstig, Matthias","last_name":"Hunstig"},{"first_name":"Michael","full_name":"Brökelmann, Michael","last_name":"Brökelmann"},{"first_name":"Walter","id":"21220","full_name":"Sextro, Walter","last_name":"Sextro"}],"date_created":"2019-07-01T07:32:07Z","date_updated":"2023-09-21T14:12:15Z","doi":"10.1016/j.sna.2019.04.025","title":"Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding"},{"type":"journal_article","publication":"ACTUATOR 2018; 16th International Conference on New Actuators","abstract":[{"lang":"eng","text":"The handling of fine powders is an important task in modern production processes. However, as fine powders strongly tend to adhesion and agglomeration, their processing with conventional methods is difficult or impossible. Especially when processing small amounts of highly sensitive fine powders, conventional methods reach their technical limits. In process steps such as dosing, transport, and especially mixing of fine powders new methods are required. Apart from the well-known method of manipulating powder properties by adding chemical additives, this contribution aims at improving the handling of dry fine powders by using vibrations at different frequencies. Modules are presented, which enable the continuous dosing, the homogeneous mixing and the transport of dry fine powders. Finally, these modules are combined for the production of a homogeneous mixture of two dry fine powders."}],"status":"public","_id":"9990","user_id":"55222","department":[{"_id":"151"}],"language":[{"iso":"eng"}],"quality_controlled":"1","year":"2018","citation":{"apa":"Dunst, P., Bornmann, P., Hemsel, T., Littmann, W., & Sextro, W. (2018). Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders. ACTUATOR 2018; 16th International Conference on New Actuators, 142–145.","short":"P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, W. Sextro, ACTUATOR 2018; 16th International Conference on New Actuators (2018) 142–145.","bibtex":"@article{Dunst_Bornmann_Hemsel_Littmann_Sextro_2018, title={Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders}, journal={ACTUATOR 2018; 16th International Conference on New Actuators}, author={Dunst, Paul and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter. and Sextro, Walter}, year={2018}, pages={142–145} }","mla":"Dunst, Paul, et al. “Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders.” ACTUATOR 2018; 16th International Conference on New Actuators, 2018, pp. 142–45.","ama":"Dunst P, Bornmann P, Hemsel T, Littmann W, Sextro W. Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders. ACTUATOR 2018; 16th International Conference on New Actuators. 2018:142-145.","ieee":"P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders,” ACTUATOR 2018; 16th International Conference on New Actuators, pp. 142–145, 2018.","chicago":"Dunst, Paul, Peter Bornmann, Tobias Hemsel, Walter. Littmann, and Walter Sextro. “Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders.” ACTUATOR 2018; 16th International Conference on New Actuators, 2018, 142–45."},"page":"142-145","date_updated":"2019-09-16T09:45:13Z","date_created":"2019-05-27T10:13:10Z","author":[{"last_name":"Dunst","full_name":"Dunst, Paul","id":"22130","first_name":"Paul"},{"full_name":"Bornmann, Peter","last_name":"Bornmann","first_name":"Peter"},{"id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel","first_name":"Tobias"},{"first_name":"Walter.","full_name":"Littmann, Walter.","last_name":"Littmann"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"}],"title":"Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders"},{"page":"1-11","citation":{"chicago":"Dunst, Paul, Peter Bornmann, Tobias Hemsel, and Walter Sextro. “Vibration-Assisted Handling of Dry Fine Powders.” Actuators 2018, 7(2)., 2018, 1–11. https://doi.org/10.3390/act7020018.","ieee":"P. Dunst, P. Bornmann, T. Hemsel, and W. Sextro, “Vibration-Assisted Handling of Dry Fine Powders,” Actuators 2018, 7(2)., pp. 1–11, 2018.","ama":"Dunst P, Bornmann P, Hemsel T, Sextro W. Vibration-Assisted Handling of Dry Fine Powders. Actuators 2018, 7(2). 2018:1-11. doi:10.3390/act7020018","bibtex":"@article{Dunst_Bornmann_Hemsel_Sextro_2018, title={Vibration-Assisted Handling of Dry Fine Powders}, DOI={10.3390/act7020018}, journal={Actuators 2018, 7(2).}, author={Dunst, Paul and Bornmann, Peter and Hemsel, Tobias and Sextro, Walter}, year={2018}, pages={1–11} }","mla":"Dunst, Paul, et al. “Vibration-Assisted Handling of Dry Fine Powders.” Actuators 2018, 7(2)., 2018, pp. 1–11, doi:10.3390/act7020018.","short":"P. Dunst, P. Bornmann, T. Hemsel, W. Sextro, Actuators 2018, 7(2). (2018) 1–11.","apa":"Dunst, P., Bornmann, P., Hemsel, T., & Sextro, W. (2018). Vibration-Assisted Handling of Dry Fine Powders. Actuators 2018, 7(2)., 1–11. https://doi.org/10.3390/act7020018"},"year":"2018","quality_controlled":"1","doi":"10.3390/act7020018","title":"Vibration-Assisted Handling of Dry Fine Powders","author":[{"last_name":"Dunst","full_name":"Dunst, Paul","id":"22130","first_name":"Paul"},{"first_name":"Peter","last_name":"Bornmann","full_name":"Bornmann, Peter"},{"last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias","first_name":"Tobias"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"date_created":"2019-05-27T10:16:16Z","date_updated":"2019-09-16T09:44:54Z","status":"public","abstract":[{"lang":"eng","text":"Abstract:Since fine powders tend strongly to adhesion and agglomeration, their processing withconventional methods is difficult or impossible. Typically, in order to enable the handling of finepowders, chemicals are added to increase the flowability and reduce adhesion. This contributionshows that instead of additives also vibrations can be used to increase the flowability, to reduceadhesion and cohesion, and thus to enable or improve processes such as precision dosing, mixing,and transport of very fine powders. The methods for manipulating powder properties are describedin detail and prototypes for experimental studies are presented. It is shown that the handling of finepowders can be improved by using low-frequency, high-frequency or a combination of low- andhigh-frequency vibration."}],"publication":"Actuators 2018, 7(2).","type":"journal_article","language":[{"iso":"eng"}],"keyword":["powder handling","flowability","dosing","transport","mixing","dispersion","piezoelectricactuators","vibrations"],"department":[{"_id":"151"}],"user_id":"55222","_id":"9991"},{"quality_controlled":"1","year":"2018","citation":{"ieee":"C. Dymel et al., “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.","chicago":"Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 1–6, 2018.","ama":"Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany). ; 2018:1-6.","apa":"Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).","bibtex":"@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }","mla":"Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.","short":"C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6."},"page":"1-6","date_updated":"2020-05-07T05:33:56Z","date_created":"2019-05-27T10:18:10Z","author":[{"last_name":"Dymel","id":"66833","full_name":"Dymel, Collin","first_name":"Collin"},{"last_name":"Eichwald","full_name":"Eichwald, Paul","first_name":"Paul"},{"last_name":"Schemmel","id":"28647","full_name":"Schemmel, Reinhard","first_name":"Reinhard"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"}],"title":"Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process","type":"conference","publication":"(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)","abstract":[{"text":"State-of-the-art industrial compact high power electronic packages require copper-copper interconnections with larger cross sections made by ultrasonic bonding. In comparison to aluminium-copper, copper-copper interconnections require increased normal forces and ultrasonic power, which might lead to substrate damage due to increased mechanical stresses. One option to raise friction energy without increasing vibration amplitude between wire and substrate or bonding force is the use of two-dimensional vibration. The first part of this contribution reports on the development of a novel bonding system that executes two-dimensional vibrations of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic bonds only form properly when surfaces are clean, oxide free and activated, the geometries of tool-tip and pin were optimised using finite element analysis. To maximize the area of the bonded annulus the distribution of normal pressure was optimized by varying the convexity of the bottom side of the pin. Second, a statistical model obtained from an experimental parameter study shows the influence of different bonding parameters on the bond result. To find bonding parameters with the minimum number of tests, the experiments have been planned using a D-optimal experimental design approach.","lang":"eng"}],"status":"public","project":[{"_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","grant_number":"MP-1-1-015"}],"_id":"9992","user_id":"210","department":[{"_id":"151"}],"keyword":["ultrasonic wire-bonding","bond-tool design","parameter identification","statistical engineering"],"language":[{"iso":"eng"}]},{"quality_controlled":"1","page":"41-44","citation":{"mla":"Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.","short":"C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.","bibtex":"@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={41–44} }","apa":"Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).","ama":"Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan). ; 2018:41-44.","ieee":"C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.","chicago":"Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44, 2018."},"year":"2018","author":[{"first_name":"Collin","last_name":"Dymel","full_name":"Dymel, Collin","id":"66833"},{"full_name":"Schemmel, Reinhard","id":"28647","last_name":"Schemmel","first_name":"Reinhard"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"},{"first_name":"Michael","full_name":"Brökelmann, Michael","last_name":"Brökelmann"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"}],"date_created":"2019-05-27T10:19:18Z","date_updated":"2020-05-07T05:33:56Z","title":"Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding","publication":"(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)","type":"conference","status":"public","abstract":[{"lang":"eng","text":"Ultrasonic bonding and welding are common friction based approaches in the assembly of power electronics. Interconnections with cross-sections of 0.3 mm² up to 12 mm² made from copper are well suited in high power applications. For increasing friction energy, which is responsible for bond formation, a two-dimensional vibration approach is applied to newly developed interconnection pins. Using two-dimensional vibration for bonding requires identification of suitable bonding parameters. Even though simulation models of wire bonding processes exist, parameters for the two-dimensional pin-bonding process cannot be derived accurately yet. Within this contribution, a methodology and workflow for experimental studies identifying a suitable bond parameter space are presented. The results of a pre-study are used to set up an extensive statistical parameter study, which gives insights about the bond strength change due to bond process parameter variation. By evaluation of electrical data captured during bonding, errors biasing the resulting shear forces are identified. All data obtained during the experimental study is used to build a statistical regression model suitable for predicting shear forces. The accuracy of the regression model’s predictions is determined and the applicability to predict process parameters or validate simulation models is assessed. Finally, the influence of the tool trajectory on the bond formation is determined, comparing one dimensional, elliptic and circular trajectories."}],"department":[{"_id":"151"}],"user_id":"210","_id":"9993","project":[{"grant_number":"MP-1-1-015","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93"}],"language":[{"iso":"eng"}],"keyword":["ultrasonic two-dimensional bonding","electrical interconnection","process parameters"]},{"page":"1-12","citation":{"mla":"Schemmel, Reinhard, et al. “Numerical and Experimental Investigations in Ultrasonic Heavy Wire Bonding.” 6th European Conference on Computational Mechanics (ECCM 6), 2018, pp. 1–12.","bibtex":"@inproceedings{Schemmel_Hemsel_Sextro_2018, place={Glasgow, UK}, title={Numerical and experimental investigations in ultrasonic heavy wire bonding}, booktitle={6th European Conference on Computational Mechanics (ECCM 6)}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2018}, pages={1–12} }","short":"R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.","apa":"Schemmel, R., Hemsel, T., & Sextro, W. (2018). Numerical and experimental investigations in ultrasonic heavy wire bonding. In 6th European Conference on Computational Mechanics (ECCM 6) (pp. 1–12). Glasgow, UK.","ieee":"R. Schemmel, T. Hemsel, and W. Sextro, “Numerical and experimental investigations in ultrasonic heavy wire bonding,” in 6th European Conference on Computational Mechanics (ECCM 6), 2018, pp. 1–12.","chicago":"Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “Numerical and Experimental Investigations in Ultrasonic Heavy Wire Bonding.” In 6th European Conference on Computational Mechanics (ECCM 6), 1–12. Glasgow, UK, 2018.","ama":"Schemmel R, Hemsel T, Sextro W. Numerical and experimental investigations in ultrasonic heavy wire bonding. In: 6th European Conference on Computational Mechanics (ECCM 6). Glasgow, UK; 2018:1-12."},"year":"2018","place":"Glasgow, UK","title":"Numerical and experimental investigations in ultrasonic heavy wire bonding","author":[{"first_name":"Reinhard","full_name":"Schemmel, Reinhard","id":"28647","last_name":"Schemmel"},{"first_name":"Tobias","last_name":"Hemsel","full_name":"Hemsel, Tobias","id":"210"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"}],"date_created":"2019-05-27T10:24:38Z","date_updated":"2019-09-23T08:48:04Z","status":"public","abstract":[{"text":"Ultrasonic wedge/wedge-wire bonding is used to connect electrical terminals of semiconductor modules in power electronics. The wire is clamped with a tool by a normal force and ultrasonic vibration is transmitted through the wire into the interface between wire and substrate. Due to frictional processes contaminations like oxide layers are removed from the contact zone and the surface roughness is reduced, thus the real contact area is increased. In the next step of bond formation, thermomechanical forces create micro-junctions between the wire and substrate and the bond strength increases. The bond parameters like the bond normal force, the ultrasonic vibration amplitude and the geometry of the clamping tool show a high influence on the strength and reliability of the wire bond and need to be investigated in detail. Therefore, in this contribution the dynamical behaviour of the ultrasonic system, the wire and the substrate are modeled in form of substructures, which are connected by the friction contacts between tool and wire and between wire and substrate. Approaches for modelling the time variant contact behaviour, the substrate dynamics, and the model order reduction for a time efficient simulation are described to simulate the full bonding process.","lang":"eng"}],"publication":"6th European Conference on Computational Mechanics (ECCM 6)","type":"conference","language":[{"iso":"eng"}],"department":[{"_id":"151"}],"user_id":"55222","_id":"9998"},{"_id":"9972","user_id":"55222","department":[{"_id":"151"}],"keyword":["Powder transport Piezoelectrics Ultrasonics Pipe vibration Finite element simulation Fine powder"],"language":[{"iso":"eng"}],"type":"journal_article","publication":"elsevier","abstract":[{"text":"The transportation of dry fine powders is an emerging technologic task, as in biotechnology, pharmaceu-tical and coatings industry the particle sizes of processed powders get smaller and smaller. Fine powdersare primarily defined by the fact that adhesive and cohesive forces outweigh the weight forces, leadingto mostly unwanted agglomeration (clumping) and adhesion to surfaces. Thereby it gets more difficult touse conventional conveyor systems (e.g. pneumatic or vibratory conveyors) for transport. A rather newmethod for transporting these fine powders is based on ultrasonic vibrations, which are used to reducefriction between powder and substrate. Within this contribution an experimental set-up consisting of apipe, a solenoid actuator for axial vibration and an annular piezoelectric actuator for the high frequencyradial vibration of the pipe is described. Since amplitudes of the radial pipe vibration should be as large aspossible to get high effects of friction reduction, the pipe is excited to vibrate in resonance. To determinethe optimum excitation frequency and actuator position the vibration modes and resonance frequenciesof the pipe are calculated and measured. Results are in good accordance.","lang":"eng"}],"status":"public","date_updated":"2019-09-16T10:23:40Z","date_created":"2019-05-27T09:31:13Z","author":[{"first_name":"Paul","full_name":"Dunst, Paul","id":"22130","last_name":"Dunst"},{"first_name":"Tobias","last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"}],"volume":"Sensors and Actuators A 263","title":"Analysis of pipe vibration in an ultrasonic powder transportationsystem","quality_controlled":"1","year":"2017","citation":{"apa":"Dunst, P., Hemsel, T., & Sextro, W. (2017). Analysis of pipe vibration in an ultrasonic powder transportationsystem. Elsevier, Sensors and Actuators A 263, 733–736.","bibtex":"@article{Dunst_Hemsel_Sextro_2017, title={Analysis of pipe vibration in an ultrasonic powder transportationsystem}, volume={Sensors and Actuators A 263}, journal={elsevier}, author={Dunst, Paul and Hemsel, Tobias and Sextro, Walter}, year={2017}, pages={733–736} }","mla":"Dunst, Paul, et al. “Analysis of Pipe Vibration in an Ultrasonic Powder Transportationsystem.” Elsevier, vol. Sensors and Actuators A 263, 2017, pp. 733–36.","short":"P. Dunst, T. Hemsel, W. Sextro, Elsevier Sensors and Actuators A 263 (2017) 733–736.","ama":"Dunst P, Hemsel T, Sextro W. Analysis of pipe vibration in an ultrasonic powder transportationsystem. elsevier. 2017;Sensors and Actuators A 263:733-736.","ieee":"P. Dunst, T. Hemsel, and W. Sextro, “Analysis of pipe vibration in an ultrasonic powder transportationsystem,” elsevier, vol. Sensors and Actuators A 263, pp. 733–736, 2017.","chicago":"Dunst, Paul, Tobias Hemsel, and Walter Sextro. “Analysis of Pipe Vibration in an Ultrasonic Powder Transportationsystem.” Elsevier Sensors and Actuators A 263 (2017): 733–36."},"page":"733-736"},{"year":"2017","page":"1 - 10","citation":{"short":"J.K. Kimotho, W. Sextro, T. Hemsel, in: IEEE Transactions on Reliability, 2017, pp. 1–10.","bibtex":"@inproceedings{Kimotho_Sextro_Hemsel_2017, title={Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing}, DOI={10.1109/TR.2017.2710260}, booktitle={IEEE Transactions on Reliability}, author={Kimotho, James Kuria and Sextro, Walter and Hemsel, Tobias}, year={2017}, pages={1–10} }","mla":"Kimotho, James Kuria, et al. “Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing.” IEEE Transactions on Reliability, 2017, pp. 1–10, doi:10.1109/TR.2017.2710260.","apa":"Kimotho, J. K., Sextro, W., & Hemsel, T. (2017). Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing. In IEEE Transactions on Reliability (pp. 1–10). https://doi.org/10.1109/TR.2017.2710260","chicago":"Kimotho, James Kuria, Walter Sextro, and Tobias Hemsel. “Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing.” In IEEE Transactions on Reliability, 1–10, 2017. https://doi.org/10.1109/TR.2017.2710260.","ieee":"J. K. Kimotho, W. Sextro, and T. Hemsel, “Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing,” in IEEE Transactions on Reliability, 2017, pp. 1–10.","ama":"Kimotho JK, Sextro W, Hemsel T. Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing. In: IEEE Transactions on Reliability. ; 2017:1-10. doi:10.1109/TR.2017.2710260"},"quality_controlled":"1","title":"Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing","doi":"10.1109/TR.2017.2710260","date_updated":"2019-09-16T10:32:05Z","author":[{"first_name":"James Kuria","full_name":"Kimotho, James Kuria","last_name":"Kimotho"},{"id":"21220","full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"}],"date_created":"2019-05-27T09:41:06Z","abstract":[{"lang":"eng","text":"Piezoelectric transducers are used in a wide range of applications. Reliability of these transducers is an important aspect in their application. Prognostics, which involve continuous monitoring of the health of technical systems and using this information to estimate the current health state and consequently predict the remaining useful lifetime (RUL), can be used to increase the reliability, safety, and availability of the transducers. This is achieved by utilizing the health state and RUL predictions to adaptively control the usage of the components or to schedule appropriate maintenance without interrupting operation. In this work, a prognostic approach utilizing self-sensing, where electric signals of a piezoelectric transducer are used as the condition monitoring data, is proposed. The approach involves training machine learning algorithms to model the degradation of the transducers through a health index and the use of the learned model to estimate the health index of similar transducers. The current health index is then used to estimate RUL of test components. The feasibility of the approach is demonstrated using piezoelectric bimorphs and the results show that the method is accurate in predicting the health index and RUL."}],"status":"public","publication":"IEEE Transactions on Reliability","type":"conference","keyword":["Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing"],"language":[{"iso":"eng"}],"_id":"9978","department":[{"_id":"151"}],"user_id":"55222"},{"abstract":[{"text":"ln der industriellen Fertigung werden zum Transport von Bauteilen häufig Förderketten genutzt. Obwohl die Förderketten meist nicht direkt mit den Arbeitsmedien in Berührung kommen, werden sie indirekt durch vagabundierende Stäube und Pulver, die an der geölten Kette anhaften, im Laufe der Zeit stark verschmutzt. Ein derart im Betrieb verschmutztes Kettenglied ist in Abbildung 1 dargestellt. Um die Lebensdauer der Ketten zu erhöhen und das Herunterfallen von Schmutzpartikel auf die Produkte zu vermeiden, muss die Kette regelmäßig gereinigt werden. Ziel des hier beschriebenen Forschungsvorhabens ist die Entwicklung eines Systems, das in der Lage ist, ein einzelnes Kettenglied in unter 60 s mittels Ultraschall zu reinigen. In [1] wurde in ersten Versuchen nachgewiesen, dass Stabschwinger in Abhängigkeit des Sonotrodenabstands zum Reinigungsobjekt und der Ultraschallamplitude eine intensive Reinigungswirkung entfalten. Das Konzept der Reinigungsanlage sieht deshalb vor, im ersten Schritt die stark verschmutzten Kettenglieder durch ein hochintensives Kavitationsfeld von direkt eingetauchten Stabschwingern vorzureinigen und anschließend schwer zugängliche Be- reiche wie Hinterschneidungen oder Bohrungen mittels konventioneller Tauchschwinger von Verschmutzungen zu befreien. Für den Stabschwinger wird die sogenannte - Sonotrode untersucht; diese wird unter anderem auch in der Sonochemie verwendet. Ein wesentliches Merkmal der Sonotrode ist eine hohe Amplitudenübersetzung bei einer gleichzeitig großen Abstrahlfläche. Neben dem Entwurf mittels der L /2 -Synthese wird die Reinigungswirkung der Sonotrode in Abhängigkeit der Ultraschallamplitude und dem Abstand zum Reinigungsobjekt in einer Versuchsreihe untersucht. Zur genaueren Betrachtung der Reinigungs- mechanismen eines Stabschwingers werden abschließend Hochgeschwindigkeitsaufnahmen vorgestellt und analysieren.","lang":"ger"}],"status":"public","type":"conference","publication":"43. Deutsche Jahrestagung für Akustik","keyword":["wire bonding","dynamic behavior","modeling"],"language":[{"iso":"eng"}],"_id":"9982","user_id":"55222","department":[{"_id":"151"}],"year":"2017","place":"Kiel 2017","citation":{"chicago":"Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” In 43. Deutsche Jahrestagung Für Akustik, 611–14. Kiel 2017, 2017.","ieee":"R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall,” in 43. Deutsche Jahrestagung für Akustik, 2017, pp. 611–614.","ama":"Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In: 43. Deutsche Jahrestagung Für Akustik. Kiel 2017; 2017:611-614.","apa":"Schemmel, R., Hemsel, T., & Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall. In 43. Deutsche Jahrestagung für Akustik (pp. 611–614). Kiel 2017.","bibtex":"@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43. Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}, year={2017}, pages={611–614} }","short":"R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.","mla":"Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” 43. Deutsche Jahrestagung Für Akustik, 2017, pp. 611–14."},"page":"611-614","title":"MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall","date_updated":"2019-05-27T09:49:49Z","author":[{"id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel","first_name":"Reinhard"},{"full_name":"Hemsel, Tobias","id":"210","last_name":"Hemsel","first_name":"Tobias"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"}],"date_created":"2019-05-27T09:48:10Z"},{"abstract":[{"text":"The transportation of dry fine powders is an emerging technologic task, as in biotechnology, pharmaceutical or coatings industry particle sizes of processed powders are getting smaller and smaller. Fine powders are primarily defined by the fact that adhesive and cohesive forces outweigh the weight forces. This leads to mostly unwanted agglomeration (clumping) and adhesion to surfaces, what makes it more difficult to use conventional conveyor systems (e. g. pneumatic or vibratory conveyors) for transport. A rather new method for transporting these fine powders is based on ultrasonic vibrations, which are used to reduce friction and adhesion between powder and the substrate. One very effective set-up consists of a pipe, which vibrates harmoniously in axial direction at low frequency combined with a pulsed radial high frequency vibration. The high frequency vibration accelerates the particles perpendicular to the surface of the pipe, which in average leads to lower normal and thereby smaller friction force. With coordinated friction manipulation the powder acceleration can be varied so that the powder may be greatly accelerated and only slightly decelerated in each excitation period of the low frequency axial vibration of the pipe. The amount of powder flow is adjustable by vibration amplitudes, frequencies, and pulse rate, which makes the device versatile for comparable high volume and fine dosing using one setup. Within this contribution an experimental set-up consisting of a pipe, a solenoid actuator for axial vibration and a piezoelectric actuator for the radial high frequency vibration is described. An analytical model is shown, that simulates the powder velocity. Finally, simulation results are validated by experimental data for different driving parameters such as amplitude of low frequency vibration, pipe material and inclination angle.","lang":"eng"}],"status":"public","type":"conference","publication":"PAMM Proc. Appl. Math. Mech. 16","language":[{"iso":"eng"}],"_id":"9958","user_id":"55222","department":[{"_id":"151"}],"year":"2016","place":"Braunschweig","citation":{"ieee":"P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, and W. Littmann, “Transportation of dry fine powders by coordinated friction manipulation,” in PAMM Proc. Appl. Math. Mech. 16, 2016, pp. 635–636.","chicago":"Dunst, Paul, Walter Sextro, Peter Bornmann, Tobias Hemsel, and Walter Littmann. “Transportation of Dry Fine Powders by Coordinated Friction Manipulation.” In PAMM Proc. Appl. Math. Mech. 16, 635–36. Braunschweig, 2016. https://doi.org/10.1002/pamm.201610306.","ama":"Dunst P, Sextro W, Bornmann P, Hemsel T, Littmann W. Transportation of dry fine powders by coordinated friction manipulation. In: PAMM Proc. Appl. Math. Mech. 16. Braunschweig; 2016:635-636. doi:10.1002/pamm.201610306","apa":"Dunst, P., Sextro, W., Bornmann, P., Hemsel, T., & Littmann, W. (2016). Transportation of dry fine powders by coordinated friction manipulation. In PAMM Proc. Appl. Math. Mech. 16 (pp. 635–636). Braunschweig. https://doi.org/10.1002/pamm.201610306","short":"P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, W. Littmann, in: PAMM Proc. Appl. Math. Mech. 16, Braunschweig, 2016, pp. 635–636.","mla":"Dunst, Paul, et al. “Transportation of Dry Fine Powders by Coordinated Friction Manipulation.” PAMM Proc. Appl. Math. Mech. 16, 2016, pp. 635–36, doi:10.1002/pamm.201610306.","bibtex":"@inproceedings{Dunst_Sextro_Bornmann_Hemsel_Littmann_2016, place={Braunschweig}, title={Transportation of dry fine powders by coordinated friction manipulation}, DOI={10.1002/pamm.201610306}, booktitle={PAMM Proc. Appl. Math. Mech. 16}, author={Dunst, Paul and Sextro, Walter and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter}, year={2016}, pages={635–636} }"},"page":"635-636","title":"Transportation of dry fine powders by coordinated friction manipulation","doi":"10.1002/pamm.201610306","date_updated":"2019-05-27T08:59:25Z","date_created":"2019-05-27T08:57:25Z","author":[{"first_name":"Paul","last_name":"Dunst","id":"22130","full_name":"Dunst, Paul"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"},{"full_name":"Bornmann, Peter","last_name":"Bornmann","first_name":"Peter"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"full_name":"Littmann, Walter","last_name":"Littmann","first_name":"Walter"}]},{"publication":"tm - Technisches Messen","popular_science":"1","type":"journal_article","status":"public","abstract":[{"text":"Eine Vielzahl von Prozessen in der Chemie und Verfahrenstechnik kann durch Ultraschall positiv beeinflusst werden. Oftmals ist ultraschallinduzierte Kavitation der Hauptwirkmechanismus für die positiven Effekte der Beschallung. Daher ist es notwendig die Kavitationsaktivität während des Prozesses zu quantifizieren um die Beschallung für den jeweiligen Prozess optimal gestalten und überwachen zu können. Eine Möglichkeit der prozessbegleitenden Kavitationsdetektion ist die Auswertung der akustischen Emissionen von oszillierenden und kollabierenden Kavitationsblasen mittels Drucksensoren in der Flüssigkeit. Raue Prozessrandbedingungen wie hohe Temperaturen oder aggressive Flüssigkeiten erschweren es jedoch geeignete Sensoren zu finden. Als Alternative wurde daher die Nutzbarkeit der Rückwirkung von Kavitationsereignissen auf das elektrische Eingansgssignal des Ultraschallwandlers zur Quantifizierung von Kavitation untersucht. Die experimentelle Analyse hat ergeben, dass das Einsetzen und in einigen Fällen auch die Art der Kavitation auf Basis der Rückwirkung auf das Stromsignal des Ultraschallwandlers bestimmt werden kann. Die Stärke der Kavitation war hingegen nicht aus den Stromsignalen abzuleiten.","lang":"eng"}],"department":[{"_id":"151"}],"user_id":"55222","_id":"9944","language":[{"iso":"eng"}],"keyword":["Kavitationsdetektion","Self-Sensing","So- nochemie","Ultraschallwandler"],"issue":"2","intvolume":" 82","page":"73-84","citation":{"ama":"Bornmann P, Hemsel T, Sextro W, Memoli G, Hodnett M, Zeqiri B. Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler. tm - Technisches Messen. 2015;82(2):73-84. doi:10.1515/teme-2015-0017","ieee":"P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, and B. Zeqiri, “Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler,” tm - Technisches Messen, vol. 82, no. 2, pp. 73–84, 2015.","chicago":"Bornmann, Peter, Tobias Hemsel, Walter Sextro, Gianluca Memoli, Mark Hodnett, and Bajram Zeqiri. “Kavitationsdetektion Mittels Self-Sensing-Ultraschallwandler.” Tm - Technisches Messen 82, no. 2 (2015): 73–84. https://doi.org/10.1515/teme-2015-0017.","apa":"Bornmann, P., Hemsel, T., Sextro, W., Memoli, G., Hodnett, M., & Zeqiri, B. (2015). Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler. Tm - Technisches Messen, 82(2), 73–84. https://doi.org/10.1515/teme-2015-0017","bibtex":"@article{Bornmann_Hemsel_Sextro_Memoli_Hodnett_Zeqiri_2015, title={Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler}, volume={82}, DOI={10.1515/teme-2015-0017}, number={2}, journal={tm - Technisches Messen}, author={Bornmann, Peter and Hemsel, Tobias and Sextro, Walter and Memoli, Gianluca and Hodnett, Mark and Zeqiri, Bajram}, year={2015}, pages={73–84} }","mla":"Bornmann, Peter, et al. “Kavitationsdetektion Mittels Self-Sensing-Ultraschallwandler.” Tm - Technisches Messen, vol. 82, no. 2, 2015, pp. 73–84, doi:10.1515/teme-2015-0017.","short":"P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, B. Zeqiri, Tm - Technisches Messen 82 (2015) 73–84."},"year":"2015","volume":82,"author":[{"first_name":"Peter","full_name":"Bornmann, Peter","last_name":"Bornmann"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"first_name":"Walter","full_name":"Sextro, Walter","id":"21220","last_name":"Sextro"},{"last_name":"Memoli","full_name":"Memoli, Gianluca","first_name":"Gianluca"},{"last_name":"Hodnett","full_name":"Hodnett, Mark","first_name":"Mark"},{"first_name":"Bajram","full_name":"Zeqiri, Bajram","last_name":"Zeqiri"}],"date_created":"2019-05-27T08:13:40Z","date_updated":"2019-09-16T10:44:38Z","doi":"10.1515/teme-2015-0017","title":"Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler"},{"issue":"3","quality_controlled":"1","citation":{"ama":"Kudo R, Bornmann P, Hemsel T, Morita T. Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method. Acoustical Science and Technology. 2015;36(3):262-264. doi:10.1250/ast.36.262","chicago":"Kudo, Ryo, Peter Bornmann, Tobias Hemsel, and Takeshi Morita. “Thick KNbO 3 Films Deposited by Ultrasonic-Assisted Hydrothermal Method.” Acoustical Science and Technology 36, no. 3 (2015): 262–64. https://doi.org/10.1250/ast.36.262.","ieee":"R. Kudo, P. Bornmann, T. Hemsel, and T. Morita, “Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method,” Acoustical Science and Technology, vol. 36, no. 3, pp. 262–264, 2015.","apa":"Kudo, R., Bornmann, P., Hemsel, T., & Morita, T. (2015). Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method. Acoustical Science and Technology, 36(3), 262–264. https://doi.org/10.1250/ast.36.262","mla":"Kudo, Ryo, et al. “Thick KNbO 3 Films Deposited by Ultrasonic-Assisted Hydrothermal Method.” Acoustical Science and Technology, vol. 36, no. 3, Acoustical Society of Japan, 2015, pp. 262–64, doi:10.1250/ast.36.262.","short":"R. Kudo, P. Bornmann, T. Hemsel, T. Morita, Acoustical Science and Technology 36 (2015) 262–264.","bibtex":"@article{Kudo_Bornmann_Hemsel_Morita_2015, title={Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method}, volume={36}, DOI={10.1250/ast.36.262}, number={3}, journal={Acoustical Science and Technology}, publisher={Acoustical Society of Japan}, author={Kudo, Ryo and Bornmann, Peter and Hemsel, Tobias and Morita, Takeshi}, year={2015}, pages={262–264} }"},"page":"262-264","intvolume":" 36","year":"2015","author":[{"last_name":"Kudo","full_name":"Kudo, Ryo","first_name":"Ryo"},{"full_name":"Bornmann, Peter","last_name":"Bornmann","first_name":"Peter"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","id":"210","last_name":"Hemsel"},{"full_name":"Morita, Takeshi","last_name":"Morita","first_name":"Takeshi"}],"date_created":"2019-05-27T08:28:31Z","volume":36,"publisher":"Acoustical Society of Japan","date_updated":"2019-09-16T10:51:23Z","doi":"10.1250/ast.36.262","title":"Thick KNbO 3 films deposited by ultrasonic-assisted hydrothermal method","type":"journal_article","publication":"Acoustical Science and Technology","status":"public","user_id":"55222","department":[{"_id":"151"}],"_id":"9948","language":[{"iso":"eng"}]}]