@inproceedings{13461, abstract = {{As the emerging digitalization of technical systems offers immense opportunities to be exploited by means of bigdata analysis, ubiquitous computing and largely networked systems, the digital twin comes into focus to combineall these aspects to an attendant model of an individual system during design phase as well as during operation.Since state-of-art technical systems are growing increasingly complex due to inherent intelligence and increasingfunctionality, i. e. autonomous behavior so far, it becomes considerably challenging to ensure reliability for thosesystems. Many methods were developed to support a reliability focused design or reliability-by-design approachesto tackle this challenge during design process. In field, data-based methods, i. e. condition monitoring enabled bythe rise of machine learning approaches, are exploited to ensure a reliable operation based on the current conditionof the monitored system. In order to take advantage of existing models of system reliability during design phaseand condition monitoring systems during operation, a method is proposed to combine both approaches in order toset up a digital twin with focus on system reliability. The base model of the digital twin is taken from the systemreliability model from the design phase and is used during operation and therein updated to the current reliabilitybased on the state estimation of the condition monitoring system. The approach is illustrated with a case study of arolling bearing test rig.}}, author = {{Kaul, Thorben and Bender, Amelie and Sextro, Walter}}, booktitle = {{Proceedings of the 29th European Safety and Reliability Conference (ESREL2019)}}, editor = {{Beer, Michael and Zio, Enrico}}, isbn = {{ 978-981-11-2724-3}}, location = {{Hannover}}, number = {{29}}, pages = {{2340--2347}}, title = {{{Digital Twin for Reliability Analysis During Design and Operation of Mechatronic Systems}}}, year = {{2019}}, } @inproceedings{9987, abstract = {{Rubber-metal-elements are used in a wide range of applications for vibration and sound isola- tion. Nowadays it is state of the art to calculate the lifetimes of these elements under mechanical stress prior to their service life. To establish more reliable and safer rubber-metal-elements, continuous monitoring by dif- ferent sensors can be used. Especially prognostics enable a rise in reliability, availability and safety. To estab- lish these advantages, estimating the remaining useful lifetime of rubber-metal-elements should be realized during its service life based on current information on its condition. Therefore a suitable measure to monitor the condition of the element is necessary. This work focuses on temperature signals. This approach allows in- cluding the ambient temperature and thereby involving changing operating conditions. For estimating the RUL of rubber-metal-elements a model-based prognostics approach based on particle filtering is proposed. Its performance is analyzed regarding relevant parameters to enable the best performance for the applied data.}}, author = {{Bender, Amelie and Sextro, Walter}}, booktitle = {{Safety and Reliability – Safe Societies in a Changing World}}, pages = {{1025--1033}}, title = {{{A particle filtering approach for temperature based prognostics}}}, year = {{2018}}, } @article{9990, abstract = {{The handling of fine powders is an important task in modern production processes. However, as fine powders strongly tend to adhesion and agglomeration, their processing with conventional methods is difficult or impossible. Especially when processing small amounts of highly sensitive fine powders, conventional methods reach their technical limits. In process steps such as dosing, transport, and especially mixing of fine powders new methods are required. Apart from the well-known method of manipulating powder properties by adding chemical additives, this contribution aims at improving the handling of dry fine powders by using vibrations at different frequencies. Modules are presented, which enable the continuous dosing, the homogeneous mixing and the transport of dry fine powders. Finally, these modules are combined for the production of a homogeneous mixture of two dry fine powders.}}, author = {{Dunst, Paul and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter. and Sextro, Walter}}, journal = {{ACTUATOR 2018; 16th International Conference on New Actuators}}, pages = {{142--145}}, title = {{{Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders}}}, year = {{2018}}, } @article{9991, abstract = {{Abstract:Since fine powders tend strongly to adhesion and agglomeration, their processing withconventional methods is difficult or impossible. Typically, in order to enable the handling of finepowders, chemicals are added to increase the flowability and reduce adhesion. This contributionshows that instead of additives also vibrations can be used to increase the flowability, to reduceadhesion and cohesion, and thus to enable or improve processes such as precision dosing, mixing,and transport of very fine powders. The methods for manipulating powder properties are describedin detail and prototypes for experimental studies are presented. It is shown that the handling of finepowders can be improved by using low-frequency, high-frequency or a combination of low- andhigh-frequency vibration.}}, author = {{Dunst, Paul and Bornmann, Peter and Hemsel, Tobias and Sextro, Walter}}, journal = {{Actuators 2018, 7(2).}}, keywords = {{powder handling, flowability, dosing, transport, mixing, dispersion, piezoelectricactuators, vibrations}}, pages = {{1--11}}, title = {{{Vibration-Assisted Handling of Dry Fine Powders}}}, doi = {{10.3390/act7020018}}, year = {{2018}}, } @inproceedings{9992, abstract = {{State-of-the-art industrial compact high power electronic packages require copper-copper interconnections with larger cross sections made by ultrasonic bonding. In comparison to aluminium-copper, copper-copper interconnections require increased normal forces and ultrasonic power, which might lead to substrate damage due to increased mechanical stresses. One option to raise friction energy without increasing vibration amplitude between wire and substrate or bonding force is the use of two-dimensional vibration. The first part of this contribution reports on the development of a novel bonding system that executes two-dimensional vibrations of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic bonds only form properly when surfaces are clean, oxide free and activated, the geometries of tool-tip and pin were optimised using finite element analysis. To maximize the area of the bonded annulus the distribution of normal pressure was optimized by varying the convexity of the bottom side of the pin. Second, a statistical model obtained from an experimental parameter study shows the influence of different bonding parameters on the bond result. To find bonding parameters with the minimum number of tests, the experiments have been planned using a D-optimal experimental design approach.}}, author = {{Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}}, booktitle = {{(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}}, keywords = {{ultrasonic wire-bonding, bond-tool design, parameter identification, statistical engineering}}, pages = {{1--6}}, title = {{{Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}}}, year = {{2018}}, } @inproceedings{9993, abstract = {{Ultrasonic bonding and welding are common friction based approaches in the assembly of power electronics. Interconnections with cross-sections of 0.3 mm² up to 12 mm² made from copper are well suited in high power applications. For increasing friction energy, which is responsible for bond formation, a two-dimensional vibration approach is applied to newly developed interconnection pins. Using two-dimensional vibration for bonding requires identification of suitable bonding parameters. Even though simulation models of wire bonding processes exist, parameters for the two-dimensional pin-bonding process cannot be derived accurately yet. Within this contribution, a methodology and workflow for experimental studies identifying a suitable bond parameter space are presented. The results of a pre-study are used to set up an extensive statistical parameter study, which gives insights about the bond strength change due to bond process parameter variation. By evaluation of electrical data captured during bonding, errors biasing the resulting shear forces are identified. All data obtained during the experimental study is used to build a statistical regression model suitable for predicting shear forces. The accuracy of the regression model’s predictions is determined and the applicability to predict process parameters or validate simulation models is assessed. Finally, the influence of the tool trajectory on the bond formation is determined, comparing one dimensional, elliptic and circular trajectories.}}, author = {{Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias}}, booktitle = {{(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)}}, keywords = {{ultrasonic two-dimensional bonding, electrical interconnection, process parameters}}, pages = {{41--44}}, title = {{{Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding}}}, year = {{2018}}, } @book{9995, abstract = {{Selbstoptimierung bietet die Möglichkeit der autonomen Anpassung des Systemverhaltens an veränderliche Ziele. Dabei ist vor allem der Aspekt Zuverlässigkeit von maßgeblicher Bedeutung, da über einen an die aktuelle Systemzuverlässigkeit angepassten Betriebspunkt die Leistungsfähigkeit verbessert wird, während das Ausfallverhalten besser vorhersehbar wird. Zur Anpassung des Systemverhaltens an die aktuelle Zuverlässigkeit mittels Selbstoptimierung müssen die ersten beiden Schritte des Selbstoptimierungsprozesses unterstützt werden. Für die Analyse der Ist-Situation ist eine Erkennung des aktuellen Degradationszustands mittels Condition Monitoring notwendig. Zur Auswahl geeigneter Verfahren werden bestehende Ansätze hinsichtlich ihrer Eignung klassifiziert. Der zweite Schritt, die Bestimmung der Systemziele, wird durch eine strukturierte Methode zum Finden verlässlichkeitsrelevanter Zielfunktionen ergänzt. Dabei werden kritische Komponenten identifiziert, Optimierungsparameter festgelegt und die Verlässlichkeit in Abhängigkeit des Systemverhaltens quantifiziert. Entwickler selbstoptimierender Systeme werden somit durch geeignete Mittel bei der Implementierung beider Schritte unterstützt. Abschließend wird der praktische Einsatz der vorgestellten Methoden anhand zweier Beispiele gezeigt.}}, author = {{Meyer, Tobias and Kaul, Thorben and Kimotho, James Kuria and Sextro, Walter}}, pages = {{193--213}}, publisher = {{Springer Nature Switzerland AG. Part of Springer Nature.}}, title = {{{Steigerung der Intelligenz mechatronischer Systeme}}}, volume = {{Steigerung der Verlässlichkeit technischer Systeme}}, year = {{2018}}, } @inproceedings{9997, abstract = {{Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor modules in power electronics. Mul- tiple influencing factors in wedge/wedge bonding are known and extensively investigated. A constructively settable but rarely examined parameter is the bonding frequency. In case of bonding on challenging substrates, e.g. supple substruc- tures, a high influence of the working frequency is observed. The choice of the working frequency is typically based on experimental investigations for a certain component or substrate and needs to be evaluated anew for new applications. A profound understanding of the influence of the working frequency is required to achieve a reliable bond process and a short process development. Here a generalized model for the numerical simulation of the bond formation with respect to the dynamics of the substructure is presented. The simulation results are compared to experiments using 300 µm copper wire at different working frequencies and geometries of the substructure.}}, author = {{Schemmel, Reinhard and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}}, booktitle = {{CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018)}}, pages = {{230--235}}, title = {{{Effects of different working frequencies on the joint formation in copper wire bonding}}}, year = {{2018}}, } @inproceedings{9998, abstract = {{Ultrasonic wedge/wedge-wire bonding is used to connect electrical terminals of semiconductor modules in power electronics. The wire is clamped with a tool by a normal force and ultrasonic vibration is transmitted through the wire into the interface between wire and substrate. Due to frictional processes contaminations like oxide layers are removed from the contact zone and the surface roughness is reduced, thus the real contact area is increased. In the next step of bond formation, thermomechanical forces create micro-junctions between the wire and substrate and the bond strength increases. The bond parameters like the bond normal force, the ultrasonic vibration amplitude and the geometry of the clamping tool show a high influence on the strength and reliability of the wire bond and need to be investigated in detail. Therefore, in this contribution the dynamical behaviour of the ultrasonic system, the wire and the substrate are modeled in form of substructures, which are connected by the friction contacts between tool and wire and between wire and substrate. Approaches for modelling the time variant contact behaviour, the substrate dynamics, and the model order reduction for a time efficient simulation are described to simulate the full bonding process.}}, author = {{Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}}, booktitle = {{6th European Conference on Computational Mechanics (ECCM 6)}}, pages = {{1--12}}, title = {{{Numerical and experimental investigations in ultrasonic heavy wire bonding}}}, year = {{2018}}, } @inproceedings{9999, abstract = {{Ultrasonic wire bonding is an indispensable process in the industrial manufacturing of semiconductor devices. Copper wire is increasingly replacing the well-established aluminium wire because of its superior electrical, thermal and mechanical properties. Copper wire processes differ significantly from aluminium processes and are more sensitive to disturbances, which reduces the range of parameter values suitable for a stable process. Disturbances can be compensated by an adaption of process parameters, but finding suitable parameters manually is difficult and time-consuming. This paper presents a physical model of the ultrasonic wire bonding process including the friction contact between tool and wire. This model yields novel insights into the process. A prototype of a multi-objective optimizing bonding machine (MOBM) is presented. It uses multi-objective optimization, based on the complete process model, to automatically select the best operating point as a compromise of concurrent objectives.}}, author = {{Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}}, booktitle = {{In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}}, keywords = {{wire bonding, multi-objective optimization, process model, copper wire, self-optimization}}, title = {{{Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}}}, doi = {{10.4071/2380-4505-2018.1.000572}}, volume = {{Vol. 2018, No. 1, pp. 000572-000577.}}, year = {{2018}}, } @inproceedings{23560, author = {{Hentze, Julian and Kaul, Thorben and Gräßler, Iris and Sextro, Walter}}, booktitle = {{ICED17, 21ST INTERNATIONAL CONFERENCE ON ENGINEERING DESIGN, Nr. DS 87-USB}}, editor = {{Maier, Anja and Skec, Stanko and McKesson, Chris and Van der Loos, Mike}}, location = {{Vancouver, Kanada, 21. - 25. Aug. 2017}}, pages = {{385--394}}, publisher = {{Design Society}}, title = {{{Integrated modeling of behavior and reliability in system development}}}, year = {{2017}}, } @inproceedings{9969, abstract = {{Zuverlässigkeit, Sicherheit und Verfügbarkeit gewinnen bei der Anwendung von technischen Systemen eine immer größere Bedeutung. Aus diesem Grund hat sich Condition Monitoring, die Zustandsüberwachung eines technischen Produkts, in verschiedenen Industriebranchen etabliert. Die sensorbasierte Überwachung eines Produkts während seiner Betriebsdauer in Kombination mit Condition Monitoring Methoden ermöglichen die Bestimmung des aktuellen Zustands des Produkts und somit eine Diagnose, ob das Produkt seine ihm zugeschriebene Funktion zum aktuellen Zeitpunkt erfüllt. Neben Diagnosen bietet Condition Monitoring auch die Möglichkeit Prognosen aufzustellen, dabei wird die restliche Nutzungsdauer des Produkts aufbauend auf geeigneten Sensordaten geschätzt. So kann eine intelligente Wartungsplanung umgesetzt werden, die im Gegensatz zu klassischen Ansätzen keine festen Wartungsintervalle benötigt und die Nachteile einer rein reaktiven Wartung kompensiert. Stattdessen ist es möglich ein Element bis vor das Ende seiner Lebensdauer zu nutzen und erst dann zu warten, um eine optimale Nutzung zu gewährleisten. Durch eine Bestimmung der verbleibenden Restlebensdauer während des Betriebs ist eine optimale Wartungsplanung möglich, wodurch die Verfügbarkeit und die Auslastung der überwachten Produkte signifikant gesteigert werden kann. In dieser Arbeit soll ein produktspezifisches Condition Monitoring System für Gummi-Metall-Elemente entwickelt werden. Diese Elemente werden zur Federung, Geräusch- und/oder Schwingungsisolation in vielen verschiedenen Anwendungen eingesetzt, wie bspw. in Nutz- und Schienenfahrzeugen oder Windenergieanlagen. In Industrie und Forschung werden bereits Zustandsüberwachungen von Systemen mit integrierten Gummi-Metall-Elementen eingesetzt, allerdings noch keine Condition Monitoring Systeme zur alleinigen Zustandsüberwachung dieser Elemente. Aktuell ist es üblich die Lebensdauer dieser Elemente aufbauend auf beschleunigten Lebensdauerversuchen und Erfahrungswerten abzuschätzen. Mit dem Ziel die Lebensdauer des fokussierten Produkts präziser vorherzusagen und damit eine intelligente Wartungsplanung zu ermöglichen, wird die Entwicklung eines Condition Monitoring Systems für Gummi-Metall-Elemente angestrebt und in dieser Arbeit erläutert.}}, author = {{Bender, Amelie and Kaul, Thorben and Sextro, Walter}}, booktitle = {{Verlagsschriftenreihe des Heinz Nixdorf Instituts Band 369, Paderborn, 2017}}, keywords = {{Zustandsüberwachung, Condition Monitoring, Prognose, Gummi-Metall-Elemente, Restlebensdauerschätzung}}, pages = {{347--358}}, title = {{{Entwicklung eines Condition Monitoring Systems für Gummi-Metall-Elemente}}}, year = {{2017}}, } @inproceedings{9970, abstract = {{In vielen verschiedenen Industriezweigen hat sich Condition Monitoring aufgrund seiner finanziellen und sicherheitstechnischen Vorteile bereits etabliert. Um die Verlässlichkeit und die Auslastung zu steigern, sowie um die Lebenszykluskosten zu reduzieren, steigt auch im Schienenfahrzeugbereich die Anzahl an eingesetzten Condition Monitoring Systemen. Studien zu Versagensmodi von Schienenfahrzeugen haben gezeigt, dass Versagensursachen meistens in den Radprofilen oder im Fahrwerk liegen [1]. Wird das Fahrwerk heute mittels Condition Monitoring überwacht, werden hierfür häufig Sensoren an den Wagons angebracht, um bspw. deren Schwingungen zu kontrollieren [2, 3]. In dieser Arbeit liegt der Fokus auf Gummi-Metall-Elementen (GM-Elementen) der Jörn GmbH.; als elastische Lager im Drehgestell sind diese Teil des Fahrwerks eines Schienenfahrzeugs. Mit dem Ziel die Wartungsplanung dieser Elemente zu optimieren, ist untersucht worden, ob diese Elemente einzeln mittels Condition Monitoring überwacht werden können. Die hierfür durchgeführten beschleunigten Lebensdauertests werden im nächsten Abschnitt erläutert. Anschließend werden die modellbasierten Methoden dargestellt, die aufbauend auf den im Versuch aufgezeichneten Daten eine Prognose der nutzbaren Restlebensdauer (RUL, remaining useful lifetime) der GM-Elemente aufstellen. Im letzten Abschnitt folgen eine kurze Zusammenfassung und ein Ausblick.}}, author = {{Bender, Amelie and Kimotho, James Kuria and Kohl, Sergej and Sextro, Walter and Reinke, Kai}}, booktitle = {{15. Internationale Schienenfahrzeugtagung}}, pages = {{123--125}}, title = {{{Modellbasierte Prognose der nutzbaren Restlebensdauer von Gummi-Metall-Elementen}}}, year = {{2017}}, } @inproceedings{9971, abstract = {{In der Windenergieindustrie haben die Größen Zuverlässigkeit, Sicherheit und Verfügbarkeit eine enorme Bedeutung erlangt aufgrund des Trends Windenergieanlagen zur optimalen Windausnutzung an schwer zugänglichen Positionen aufzustellen, wie bspw. Offshore. Dies führt zu erschwerten Wartungsbedingungen und damit zu höheren Kosten. Der Einsatz von Condition Monitoring hat sich in dieser Industrie etabliert, denn diese Technik ermöglicht eine Zustandsdiagnose des überwachten Systems und eine Prognose seiner nutzbaren Restlebensdauer (remaining useful life: RUL), jeweils basierend auf geeigneten Sensordaten. In dieser Arbeit wird ein Konzept für ein produktspezifisches Condition-Monitoring-System für Gummi-Metall-Elemente (GM-Elemente) vorgestellt, welches den Schwerpunkt auf die Prognose der RUL dieser Elemente setzt. In Windenergieanlagen werden zahlreiche GM-Elemente zur Geräusch- und Schwingungsisolation verwendet. Der Einsatz des hier vorgestellten produktspezifischen Condition-Monitoring-Systems kann somit einen erheblichen Beitrag zum verlässlichen Betrieb von Windenergieanlagen liefern, da die Überwachung einzelner Komponenten in die Zustandsüberwachung der gesamten Anlage integriert und dadurch der Betrieb der Anlage optimiert werden kann. In dieser Arbeit werden einige Herausforderungen diskutiert, die sich bei der Entwicklung eines Condition-Monitoring-Systems für GM-Elemente ergeben. So wird evaluiert, welche Größen sich zur Beschreibung der Alterung eines spezifischen Elements eignen und wie diese gemessen werden können. Temperaturen werden bereits in einigen technischen Systemen, wie auch in Windenergieanlagen, aufgezeichnet und ausgewertet, aber ihr Potential für die Bestimmung der RUL der überwachten Komponente ist noch nicht ausgeschöpft. Hier wird eine Lösungsmöglichkeit vorgestellt, die auf Temperatursensoren aufbaut. Als Grundlage für die Entwicklung des Condition-Monitoring-Systems wurden beschleunigte Lebensdauerversuche der GM-Elemente auf einem Versuchsstand zur Schwingungsanalyse durchgeführt. In diesen Lebensdauerversuchen wird die mechanische Alterung eines GM-Elements über einen kraftgeregelten Hydraulikzylinder erzielt. Dabei wird das Ende der Lebensdauerversuche in einem ersten Schritt über die Wegamplitude des Zylinders bestimmt. Während dieser Versuche wurden diverse Sensoren eingesetzt. Die aufgezeichneten Temperaturdaten zeigen, dass sich Temperaturmessungen eignen die Lebensdauer von GM-Elementen mittels Condition Monitoring Prognosemethoden zu schätzen.}}, author = {{Bender, Amelie and Sextro, Walter and Reinke, Kai}}, booktitle = {{VDI-Berichte 2301}}, pages = {{49--60}}, title = {{{Neuartiges Konzept zur Lebensdauerprognose von Gummi-Metall-Elementen}}}, year = {{2017}}, } @article{9972, abstract = {{The transportation of dry fine powders is an emerging technologic task, as in biotechnology, pharmaceu-tical and coatings industry the particle sizes of processed powders get smaller and smaller. Fine powdersare primarily defined by the fact that adhesive and cohesive forces outweigh the weight forces, leadingto mostly unwanted agglomeration (clumping) and adhesion to surfaces. Thereby it gets more difficult touse conventional conveyor systems (e.g. pneumatic or vibratory conveyors) for transport. A rather newmethod for transporting these fine powders is based on ultrasonic vibrations, which are used to reducefriction between powder and substrate. Within this contribution an experimental set-up consisting of apipe, a solenoid actuator for axial vibration and an annular piezoelectric actuator for the high frequencyradial vibration of the pipe is described. Since amplitudes of the radial pipe vibration should be as large aspossible to get high effects of friction reduction, the pipe is excited to vibrate in resonance. To determinethe optimum excitation frequency and actuator position the vibration modes and resonance frequenciesof the pipe are calculated and measured. Results are in good accordance.}}, author = {{Dunst, Paul and Hemsel, Tobias and Sextro, Walter}}, journal = {{elsevier}}, keywords = {{Powder transport Piezoelectrics Ultrasonics Pipe vibration Finite element simulation Fine powder}}, pages = {{733--736}}, title = {{{Analysis of pipe vibration in an ultrasonic powder transportationsystem}}}, volume = {{Sensors and Actuators A 263}}, year = {{2017}}, } @article{9973, abstract = {{In power electronics, copper connector pins are e.g. used to connect control boards with power modules. The new chip generation based on SiC and GaN technology increase the power density of semiconductor modules significantly with junction temperatures reaching 200°C. To enable reliable operation at such high temperature, the soldering of these connector pins should be substituted by a multi-dimensional copper-copper bonding technology. A copper pin welded directly on DBC substrate also simplifies the assembly. With this aim, a proper bond tool and a suitable connector pin geometry are designed. This paper presents a two-dimensional trajectory approach for ultrasonic bonding of copper pieces, e.g. connector pins, with the intention to minimize mechanical stresses exposed to the substrate. This is achieved using a multi-dimensional vibration system with multiple transducers known from flip chip bonding. Applying a planar relative motion between the bonding piece and the substrate increases the induced frictional power compared to one-dimensional excitation. The core of this work is the development of a new tool design which enables a reliable and effective transmission of the multidimensional vibration into the contact area between nail-shaped bonding piece and substrate. For this purpose, different bonding tool as well as bonding piece designs are discussed. A proper bonding tool design is selected based on the simulated alternatives. This tool is examined in bonding experiments and the results are presented. In addition, different grades of hardness for bonding piece and substrate are examined as well as different bonding parameters. Optical inspection of the bonded area shows the emergence of initial micro welds in form of a ring which is growing in direction of the interface boundaries with increasing bonding duration.}}, author = {{Eichwald, Paul and Althoff, Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}}, journal = {{IMAPSource}}, keywords = {{International Symposium on Microelectronics}}, title = {{{Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design}}}, volume = {{Vol. 2017, No. 1}}, year = {{2017}}, } @inproceedings{9974, abstract = {{The integrated modeling of behavior and reliability in system development delivers a model-based approach for reliability investigation by taking into account the dynamic system behavior as well as the system architecture at different phases of the development process. This approach features an automated synthesis of a reliability model out of a behavior model enabling for the closed loop modeling of degradation of the system and its (dynamic) behavior. The approach is integrated into the development process following Systems Engineering. It is based on standard models used in model-based development methodologies i.e. SysML or Matlab/Simulink. In addition to the theoretical description of the necessary steps the procedure is validated by an application example at two stages of the development process.}}, author = {{Hentze, Julian and Kaul, Thorben and Grässler, Iris and Sextro, Walter}}, booktitle = {{ICED17, 21st International conference on enginieering design}}, keywords = {{Design for X (DfX), Product modelling / models, Robust design, Systems Engineering (SE), Reliability}}, pages = {{385--394}}, title = {{{Integrated modeling og behavior and reliability in system development}}}, year = {{2017}}, } @article{9976, abstract = {{State-of-the-art mechatronic systems offer inherent intelligence that enables them to autonomously adapt their behavior to current environmental conditions and to their own system state. This autonomous behavior adaptation is made possible by software in combination with complex sensor and actuator systems and by sophisticated information processing, all of which make these systems increasingly complex. This increasing complexity makes the design process a challenging task and brings new complex possibilities for operation and maintenance. However, with the risk of increased system complexity also comes the chance to adapt system behavior based on current reliability, which in turn increases reliability. The development of such an adaption strategy requires appropriate methods to evaluate reliability based on currently selected system behavior. A common approach to implement such adaptivity is to base system behavior on different working points that are obtained using multiobjective optimization. During operation, selection among these allows a changed operating strategy. To allow for multiobjective optimization, an accurate system model including system reliability is required. This model is repeatedly evaluated by the optimization algorithm. At present, modeling of system reliability and synchronization of the models of behavior and reliability is a laborious manual task and thus very error-prone. Since system behavior is crucial for system reliability, an integrated model is introduced that integrates system behavior and system reliability. The proposed approach is used to formulate reliability-related objective functions for a clutch test rig that are used to compute feasible working points using multiobjective optimization.}}, author = {{Kaul, Thorben and Meyer, Tobias and Sextro, Walter}}, journal = {{SAGE Journals}}, keywords = {{Integrated model, reliability, system behavior, Bayesian network, multiobjective optimization}}, pages = {{390 -- 399}}, title = {{{Formulation of reliability-related objective functions for design of intelligent mechatronic systems}}}, doi = {{10.1177/1748006X17709376}}, volume = {{Vol. 231(4)}}, year = {{2017}}, } @inproceedings{9978, abstract = {{Piezoelectric transducers are used in a wide range of applications. Reliability of these transducers is an important aspect in their application. Prognostics, which involve continuous monitoring of the health of technical systems and using this information to estimate the current health state and consequently predict the remaining useful lifetime (RUL), can be used to increase the reliability, safety, and availability of the transducers. This is achieved by utilizing the health state and RUL predictions to adaptively control the usage of the components or to schedule appropriate maintenance without interrupting operation. In this work, a prognostic approach utilizing self-sensing, where electric signals of a piezoelectric transducer are used as the condition monitoring data, is proposed. The approach involves training machine learning algorithms to model the degradation of the transducers through a health index and the use of the learned model to estimate the health index of similar transducers. The current health index is then used to estimate RUL of test components. The feasibility of the approach is demonstrated using piezoelectric bimorphs and the results show that the method is accurate in predicting the health index and RUL.}}, author = {{Kimotho, James Kuria and Sextro, Walter and Hemsel, Tobias}}, booktitle = {{IEEE Transactions on Reliability}}, keywords = {{Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing}}, pages = {{1 -- 10}}, title = {{{Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing}}}, doi = {{10.1109/TR.2017.2710260}}, year = {{2017}}, } @inproceedings{9982, abstract = {{ln der industriellen Fertigung werden zum Transport von Bauteilen häufig Förderketten genutzt. Obwohl die Förderketten meist nicht direkt mit den Arbeitsmedien in Berührung kommen, werden sie indirekt durch vagabundierende Stäube und Pulver, die an der geölten Kette anhaften, im Laufe der Zeit stark verschmutzt. Ein derart im Betrieb verschmutztes Kettenglied ist in Abbildung 1 dargestellt. Um die Lebensdauer der Ketten zu erhöhen und das Herunterfallen von Schmutzpartikel auf die Produkte zu vermeiden, muss die Kette regelmäßig gereinigt werden. Ziel des hier beschriebenen Forschungsvorhabens ist die Entwicklung eines Systems, das in der Lage ist, ein einzelnes Kettenglied in unter 60 s mittels Ultraschall zu reinigen. In [1] wurde in ersten Versuchen nachgewiesen, dass Stabschwinger in Abhängigkeit des Sonotrodenabstands zum Reinigungsobjekt und der Ultraschallamplitude eine intensive Reinigungswirkung entfalten. Das Konzept der Reinigungsanlage sieht deshalb vor, im ersten Schritt die stark verschmutzten Kettenglieder durch ein hochintensives Kavitationsfeld von direkt eingetauchten Stabschwingern vorzureinigen und anschließend schwer zugängliche Be- reiche wie Hinterschneidungen oder Bohrungen mittels konventioneller Tauchschwinger von Verschmutzungen zu befreien. Für den Stabschwinger wird die sogenannte - Sonotrode untersucht; diese wird unter anderem auch in der Sonochemie verwendet. Ein wesentliches Merkmal der Sonotrode ist eine hohe Amplitudenübersetzung bei einer gleichzeitig großen Abstrahlfläche. Neben dem Entwurf mittels der L /2 -Synthese wird die Reinigungswirkung der Sonotrode in Abhängigkeit der Ultraschallamplitude und dem Abstand zum Reinigungsobjekt in einer Versuchsreihe untersucht. Zur genaueren Betrachtung der Reinigungs- mechanismen eines Stabschwingers werden abschließend Hochgeschwindigkeitsaufnahmen vorgestellt und analysieren.}}, author = {{Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter}}, booktitle = {{43. Deutsche Jahrestagung für Akustik}}, keywords = {{wire bonding, dynamic behavior, modeling}}, pages = {{611--614}}, title = {{{MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}}}, year = {{2017}}, }